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38results about How to "Prevent diffusion from entering" patented technology

Wafer loading disc for MOCVD (metal organic chemical vapor deposition) reactor and MOCVD reactor

The invention discloses a wafer loading disc for an MOCVD (metal organic chemical vapor deposition) reactor and an MOCVD reactor. In order to expand the range of a uniform-temperature field on the surface of the wafer loading disc to the greatest degree, the wafer loading disc for the MOCVD reactor comprises a wafer loading disc body, wherein a groove for placing a wafer is formed in the upper surface of the wafer loading disc body, and the periphery of the lower surface of the wafer loading disc body extends downward to form an annular bulge so that the whole wafer loading disc is of an inverted barrel shape. The MOCVD reactor is provided with the wafer loading disc with the annular bulge and a matched heater, wherein the heater is divided into an inner part, a middle part and an outer part, wherein an inner ring and an outer ring of the heater are vertically arranged in a cylindrical manner, and a middle ring is horizontally arranged in an omega shape. By adopting the wafer loading disc and the MOCVD reactor disclosed by the invention, the utilization efficiency of heat energy is improved; the heating device is separated from a reactant so as to better protect the heating device; meanwhile, the consistent-temperature area on the surface of the wafer loading disc is expanded, thereby increasing the single-batch output.
Owner:48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP

Thin-film solar cell module and preparation method thereof

The invention provides a thin-film solar cell module and a preparation method thereof. The thin-film solar cell module comprises a substrate, a back electrode layer, a semiconductor layer, a transparent conductive layer and grooves P1, P2 and P3, wherein the groove P1 is filled with a semiconductor layer material; the side walls and the bottom part of the groove P2 are covered with a high-resistance material film layer; the groove P2 is filled with a conductive material; the high-resistance material film layer is located between the side walls and / or the bottom part of the groove P2 and the transparent conductive layer; the upper part and / or the lower part of the transparent conductive layer are filled with the conductive material; the conductive material is prepared from resin or ink containing conductive particles; and the conductive particles comprise silver, aluminum, titanium, copper, molybdenum, carbon or alloys thereof and the like. The performance of the thin-film solar cell module can be improved.
Owner:厦门神科太阳能有限公司

Composite insulating layer for thin film sensor and preparation method of composite insulating layer

The invention belongs to the technical field of thin film sensors, and relates to a composite insulating layer for a thin film sensor. The composite insulating layer comprises four layers of structures which comprise the amorphous Al-O-N diffusion impervious layer, the Al-O-N-to-Al2O3 transition layer, the electron beam evaporation Al2O3 thin film layer and the microcrystal Al2O3 oxygen diffusion barrier layer in sequence from bottom to top. An amorphous Al-O-N thin film in the composite insulating layer is good in compactness and is in an amorphous state, and a good diffusion barrier effect is achieved for metal atoms. The adhesive force between the amorphous Al-O-N layer and the Al2O3 layer can be effectively improved through the transition layer. The microcrystal layer on the Al2O3 thin film layer can effectively prevent outside oxygen atoms from diffusing into the Al-O-N layer at a high temperature, the amorphous state of the Al-O-N thin film in the high-temperature oxygen-enriched environment is kept, and therefore the composite insulating layer still has good insulation performance in the high-temperature oxygen-enriched work environment, and the stability and the service life of the thin film sensor in the high-temperature environment are effectively guaranteed.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA +1

Closed type dust removal device for printing press

A closed type dust removal device for a printing press comprises a cleaning box communicated with an inlet of the printing press, and a supporting plate inclining in the direction backing on to the printing press is arranged on the top of the inner side of the cleaning box and divides the cleaning box into a dust removing area and a cleaning area. A hairbrush and a dust exhaust mechanism are arranged in the dust removing area, and an air blowing mechanism is arranged in the cleaning area. The air blowing mechanism comprises a dust blowing pipe and an air curtain pipe. The dust blowing pipe is arranged in a cavity of the supporting plate, the air blowing direction of the dust blowing pipe is oblique, air blown out from the dust blowing pipe can raise dust on paper and attachments brushed up by the hairbrush, and the dust and the attachments can be exhausted by the dust exhaust mechanism. The air curtain pipe comprises a vertical segment and a horizontal segment, the vertical segment is arranged on one side of the inlet of the printing press, the air outlet direction of the vertical segment faces the other side of the inlet, and then an air curtain closing the inlet is formed; the horizontal segment is arranged on one side of the cleaning box, the air outlet direction of the horizontal segment faces the other side of the cleaning box, and then an air curtain closing the paper face is formed. According to the closed type dust removal device for the printing press, the dust on the paper is effectively cleared through cooperation of the hairbrush, the air blowing mechanism and the dust exhaust mechanism, and printing quality is guaranteed.
Owner:HENAN GUOHUA COLOR PRINTING PACKAGING

Copper interconnection structure and forming method thereof

The invention provides a copper interconnection structure and a forming method thereof. The forming method of the copper interconnection structure comprises the following steps of: providing a semiconductor substrate, wherein the semiconductor substrate is covered with a first dielectric layer and a first opening is formed on the first dielectric layer; filling metal copper in the first opening to form a copper plug, wherein the surface of the copper plug is flush with the surface of the first dielectric layer; etching the first dielectric layer and removing a part of the first dielectric layer, which is connected with the side wall of the copper plug, so as to form a gap between the copper plug and the first dielectric layer; forming a second dielectric layer which covers the surfaces of the first dielectric layer and the copper plug and seals the gap; forming a second opening on the second dielectric layer above the copper plug, wherein the width of the second opening is less than the width of the copper plug and the copper plug is exposed out of the bottom of the second opening; and filling cobalt tungsten phosphorus in the second opening. Through adoption of the forming method of the copper interconnection structure, metal ions can be prevented from diffusing into the dielectric layers, thereby improving reliability.
Owner:SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORP

Additive for anhydrous stemming and preparation method thereof

ActiveCN111704472ACause potential harmAvoid the problem of high carcinogen benzopyreneProcess efficiency improvementPhysical chemistryCarbide
The invention relates to an additive for anhydrous stemming and a preparation method thereof. The preparation method comprises the following steps: preparing following raw materials in percentage by weight at first: 35 to 55 wt% of andalusite fine powder; 10-30 wt% of kyanite fine powder, 6-16 wt% of titanium oxide fine powder, 5-15 wt% of silicon oxynitride fine powder, 3-7 wt% of titanium aluminum carbide fine powder, 3-7 wt% of earthy graphite fine powder, 1-3 wt% of simple substance silicon fine powder, 2-5 wt% of bentonite fine powder and 2-5 wt% of nickel oxide fine powder; adding 0.5-2.5 wt% of polypropylene fibers and 7-15 wt% of cobalt modified phenolic resin fine powder into the raw materials, and mixing in a mixer for 20-30 minutes to obtain the additive for anhydrous stemming,wherein the Al2O3 content of the andalusite fine powder is more than 52 wt%, the particle size of the andalusite fine powder is less than 75 [mu]m; the Al2O3 content of the kyanite fine powder is larger than 54 wt%, and the particle size of the kyanite fine powder is smaller than 45 [mu]m. The prepared additive for the anhydrous stemming does not pollute the environment, and can obviously improvethe strength, the volume stability, the oxidation resistance and the erosion resistance of the anhydrous stemming.
Owner:湖南立达高新材料有限公司 +1

Semiconductor structure and method for forming semiconductor structure

The invention provides a semiconductor structure and a method for forming the semiconductor structure. The method comprises a step of providing a substrate and fins protruding from the substrate, wherein the materials of the fins contain germanium elements, an isolation layer covering partial sidewalls of the fins are on the substrate, and the top of the isolation layer is lower than the tops of the fins, a step of forming a dummy gate oxide layer on the tops and sidewalls of the fins exposed by the isolation layer by using the atomic layer deposition process, wherein the process temperature of the atomic layer deposition process is a first temperature, a step of forming a dummy gate across the fins, wherein the dummy gate covers the surface of a dummy gate oxide layer, a step of forming adielectric layer on the isolation layer, wherein the dielectric layer covers a sidewall of the dummy gate and exposes a top wall of the dummy gate, a step of removing the dummy gate and the dummy gate oxide layer and exposing the tops and partial sidewalls of the fins, and a step of forming an interface layer on the exposed tops and sidewalls of the fins, wherein the process temperature of forming the interface layer is a second temperature which is lower than or equal to the first temperature. According to the invention, the germanium elements in the fins can be prevented from diffusing intothe interface layer, therefore, the interface characteristics between the interface layer and the fins can be improved, and the carrier mobility is enhanced.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

A closed dust removal device for printing presses

A closed type dust removal device for a printing press comprises a cleaning box communicated with an inlet of the printing press, and a supporting plate inclining in the direction backing on to the printing press is arranged on the top of the inner side of the cleaning box and divides the cleaning box into a dust removing area and a cleaning area. A hairbrush and a dust exhaust mechanism are arranged in the dust removing area, and an air blowing mechanism is arranged in the cleaning area. The air blowing mechanism comprises a dust blowing pipe and an air curtain pipe. The dust blowing pipe is arranged in a cavity of the supporting plate, the air blowing direction of the dust blowing pipe is oblique, air blown out from the dust blowing pipe can raise dust on paper and attachments brushed up by the hairbrush, and the dust and the attachments can be exhausted by the dust exhaust mechanism. The air curtain pipe comprises a vertical segment and a horizontal segment, the vertical segment is arranged on one side of the inlet of the printing press, the air outlet direction of the vertical segment faces the other side of the inlet, and then an air curtain closing the inlet is formed; the horizontal segment is arranged on one side of the cleaning box, the air outlet direction of the horizontal segment faces the other side of the cleaning box, and then an air curtain closing the paper face is formed. According to the closed type dust removal device for the printing press, the dust on the paper is effectively cleared through cooperation of the hairbrush, the air blowing mechanism and the dust exhaust mechanism, and printing quality is guaranteed.
Owner:HENAN GUOHUA COLOR PRINTING PACKAGING

Semiconductor device and method of forming the same

A semiconductor device and a method for forming the same, wherein the method for forming the semiconductor device includes: providing a substrate, the substrate including a first semiconductor layer, an insulating layer positioned on the surface of the first semiconductor layer, and a second semiconductor layer positioned on the surface of the insulating layer, The substrate has a first region, a second region and a third region, the second region is adjacent to the first region and the third region, wherein the thickness of the insulating layer in the first region and the third region is greater than that of the insulating layer in the second region The bottom surface of the insulating layer in the first region, the second region and the third region is flush; the gate structure is formed on the surface of the second semiconductor layer in the second region; the first region and the third region on both sides of the gate structure A doped region is formed in the second semiconductor layer. The thickness of the insulating layer under the gate structure of the present invention is smaller than the thickness of the insulating layer under the doped region. Since the effective resistance of the insulating layer under the gate structure is small, the threshold voltage of the semiconductor device can be effectively improved.
Owner:SEMICON MFG INT (SHANGHAI) CORP

A cold storage air curtain system that can form a positive pressure space

The invention discloses a refrigeration house air curtain system capable of forming a positive pressure space. A refrigeration house door through which goods enter and exit is installed in a refrigeration house; a refrigeration house-out static pressure box and a refrigeration house-in static pressure box are correspondingly arranged on the inner side and the outer side of the top of the refrigeration house door; the top of the refrigeration house-out static pressure box communicates with air outlets in the bottoms of a plurality of refrigeration house-out fans and communicates with air outlets in the bottoms of a plurality of refrigeration house-in fans; a plurality of refrigeration house-out air supply channels with downward openings are formed in an opening in the bottom of the refrigeration house-out static pressure box; a plurality of refrigeration house-in air supply channels with downward openings and a plurality of refrigeration house-in positive pressure air supply outlets areformed in an opening in the bottom of the refrigeration house-in static pressure box; and refrigeration house-in air return channels and refrigeration house-out air return channels which are used forair return are correspondingly formed inside and outside the refrigeration house door for the air return. The refrigeration house air curtain system is good in heat insulation effect, and air curtains can be used for forming the closed positive pressure space inside and outside the refrigeration house, so that air outside the refrigeration house is effectively prevented from being diffused into the refrigeration house, the temperature in the refrigeration house is kept stable, and the quality of the goods stored in the refrigeration house is ensured.
Owner:TIANJIN UNIV OF COMMERCE

Semiconductor structures and methods of forming them

A semiconductor structure and its forming method, the forming method comprising: providing a substrate and fins protruding from the substrate, the material of the fins contains germanium, the substrate has an isolation layer covering the side walls of the fins, and isolating The top of the layer is lower than the top of the fin; an atomic layer deposition process is used to form a dummy gate oxide layer on the top and side walls of the fin exposed by the isolation layer, and the process temperature of the atomic layer deposition process is the first temperature; a dummy gate oxide layer across the fin is formed. Gate, the dummy gate covers the surface of the dummy gate oxide layer; a dielectric layer is formed on the isolation layer, the dielectric layer covers the sidewall of the dummy gate and exposes the top of the dummy gate; removes the dummy gate and dummy gate oxide layer, exposing the top of the fin and part of the sidewall ; Forming an interface layer on the exposed top and sidewall of the fin, the process temperature for forming the interface layer is a second temperature, and the second temperature is less than or equal to the first temperature. The invention can prevent the germanium element in the fin from diffusing into the interface layer, thereby improving the interface characteristics between the interface layer and the fin, and enhancing carrier mobility.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1
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