The invention discloses a functional
oxide film based on a
hard mask stripping technology and a high-temperature patterning preparation method, and belongs to the technical field of
semiconductor films. The invention provides a stripping process based on a double-layer
metal hard mask to solve the problem that high-quality patterning of an
oxide film with a high-temperature deposition function is difficult to realize in a traditional process. According to the method, a
nickel metal layer which is resistant to high temperature and stable in temperature serves as a bearing layer so as to adapt to the high-temperature environment in the thin film
deposition process; and meanwhile, aluminum sensitive to a specific corrosive is adopted as a sacrificial layer, so that subsequent selective wet
etching treatment is facilitated. Through the process, after the high-quality functional
oxide thin film is deposited at a high temperature, nondestructive stripping of the
metal hard mask and the thin film covered by the metal hard
mask can be realized by utilizing selective
corrosion on the aluminum sacrificial layer, so that the graphical functional oxide thin film which is sharp in edge and free of damage is obtained. The method is simple and convenient in process, low in cost and excellent in compatibility, and an effective technical approach is provided for manufacturing of high-performance oxide electronic devices.