The
processing method for improving the
utilization rate of the high-purity
germanium crystal comprises the following steps: S1, respectively carrying out sheet taking and Hall testing on the head part and the
tail part of the high-purity
germanium crystal obtained by a
czochralski method to obtain a purity qualified section; s2, taking wafers from the head part and the
tail part with qualified purity, and carrying out
dislocation defect and deep-energy-level
impurity tests; s3, according to the
dislocation defects of the head part and the
tail part of the purity qualified section,
rounding from the
diameter with the qualified
dislocation defect of the tail part to the middle part of the purity qualified section, wherein the
diameter is not smaller than the minimum
diameter of the plane
detector; s4, according to the deep-energy-level
impurity content of the head and the tail of the purity qualified section, the diameter of the head with the qualified deep-energy-level
impurity content is rolled towards the middle part of the purity qualified section from the position where the diameter is not smaller than the minimum diameter of the plane
detector; s5, the inverted circular truncated cone of the tail part, the circular truncated cone of the head part and the cylinder between the inverted circular truncated cone of the tail part and the circular truncated cone of the head part are qualified high-purity
germanium crystals; and S6,
cutting.