The application provides a
copper plating solution and a stabilizer, which comprises
copper sulfate pentahydrate, a complexing agent,
formaldehyde,
ethanolamine, 2,2-
bipyridine, S-adenosyl-L-
homocysteine, S-carboxymethyl-L-
cysteine and
thiomalic acid. The S-adenosyl-L-
homocysteine and the S-carboxymethyl-L-
cysteine can improve the tolerance of the plating solution to leached
palladium. After a certain amount of
thiomalic acid is added, the three components have a good synergistic effect. The plating solution maintains
high activity and further improves the tolerance to leached
palladium, which is beneficial to improve the service life of the plating solution and prolong the
decomposition time of the plating solution. Even under high leached
palladium concentration, the thick
copper solution does not affect the plating activity and the uniform plating capacity of the chemical
copper plating solution. Under normal production load, a
deposition rate of 1.0 um / 20 min can be obtained. The solution has good stability. Under extreme conditions of high leached palladium, the
decomposition time of the plating solution is prolonged by 2-6 hours.