The invention relates to an LED chip maintenance method. The LED chip maintenance method comprises steps that S1, a chip substrate having a failed LED chip is provided; S2, the position of the failedLED chip on the chip substrate is determined; S3, a first nozzle is heated to a preset temperature, and the first solder for fixing the failed LED chip is melted; S4, the failed LED chip is sucked; S5, the first solder is sucked; and S6, die bonding is performed. The method is advantaged in that when the LED chip fails, the first nozzle is heated to fuse the first solder connecting the failed LEDchip with the chip substrate, after the first solder is melted, the failed chip is sucked, the first solder is removed by suction, so elimination of a failure point of the chip substrate is simple, fast, and efficient, professional equipment is not needed, cost is low, moreover, the failed chip and the first solder can be removed, the quality of subsequent die bonding is guaranteed, and the methodis especially suitable for maintenance of small-pitch LED products such as COB flip chips.