208results about How to "Free from mechanical damage" patented technology

A vehicle lighting system for a vehicle includes an accessory module assembly that is adapted for attachment to an interior portion of a vehicle and configured to illuminate, for example, an area inside the vehicle. The module assembly includes a single high-intensity power light emitting diode that has a luminous efficiency of at least about 1 lumen per watt when the light emitting diode is operated and is preferably operated at a forward current of at least 100 milliamps. The system also includes a voltage conversion element for converting the battery/ignition voltage of the vehicle to the forward operating voltage of the light emitting diode.

Polymeric coating materials used to protect electrochromic devices from environmental and mechanical damage are provided. The protective polymeric coating materials are physically, chemically and optically compatible with the electrochromic cell layers of electrochromic devices. The polymeric coating materials are polymers having generic polymer back-bones selected from the group of polyimides, polybenzimidazoles, polybenzothiazoles, polybenzoxazoles, poly(phenylene ethers), polyquinolines, polycarbonates, and polysulfones.

Embodiments of a flexible electronic visual display device and a flexible mobile computer having such a display device are disclosed. The basic electronic visual display device comprises a flexible display device, at least one control system, at least one three-dimensional sensor, a flexible housing containing the electronic components, and an adjustment means for the housing. In some embodiments, the flexible display device can have additonal sensors of various types, a projector, a wireless communication interface, and a wireless power supply. For independent use some embodiments of the flexible electronic visual display device can also comprise an electronic module including at least one processor and at least one data memory, and also at least one electrical energy storage device being contained in the housing as well. This permits the flexible electronic display device to provide a broad range of functionalities and application possibilities, and to assume novel functionalities and applications.

An aerial platform comprising a kite providing a level of directional stability when elevated by the wind, and an inflated balloon attached above the kite with a cord. The payload is attached to the kite. The physical separation of the balloon from the kite isolates the payload from shocks generated by the balloon. Additional isolation is provided by use of an elastic attachment cord. Electric power is supplied to the aerial platform by means of an optical fiber receiving optical power from a ground-based source, and conversion of the optical power to electrical power on board the platform. In order to provide a strong tether line, the optical fiber is plaited with a jacket braided from high tensile strength fibers. An aerial laser transmitter is described using a ground based laser source transmitting laser power through an optical fiber to an aerial platform for transmission from the platform.

The invention relates to a semiconductor module with a semiconductor sensor chip and an associated method. The sensor chip has a sensor region, and nonsensitive regions of the sensor chip are embedded in a nontransparent plastic package molding compound. The sensor region of the sensor chip is operably coupled to the external surroundings of the module via an opening in the nontransparent plastic package molding compound. The opening in the molding compound is formed by laser ablation.

The invention relates to a bending-resistant multi-mode fiber used in an access network or a miniature optical device. The bending-resistant multi-mode fiber comprises an optical fiber and a coating coated on the outer surface of the optical fiber, wherein the fiber consists of a quartz glass core layer which has a section structure with a parabolic shape or step-type refraction index and a quartz glass cladding which surrounds the core layer. The optical fiber is characterized in that: the core layer has a diameter of between 20 and 200 mu m and consists of a germanium-and-fluorine-doped quartz glass material; and double solidified polymer coatings are coated out of the cladding, wherein an inner coating coated on the outer surface of the cladding is a low-refraction index flexible polymer coating while an outer coating is a high-Young's modulus polymer coating. Because of the design of the low-refraction index inner coating, an internal stress of the optical fiber is avoided, the mechanical performance of the optical fiber is greatly improved, and the use performance and the service life of the optical fiber working in a small-radius bending state are ensured. The bending-resistant multi-mode fiber has high bending-resistant performance; and at a wavelength of 850 nm, the additional attenuation of the bending caused by winding 1 circle with a bending radius of 10 mm is less than or equal to 0.15 dB. The bending-resistant multi-mode fiber has the characteristic of simple, convenient and effective manufacturing method, and is suitable for large-scale production.

The invention discloses a human adipose-derived stem cell serum-free basic medium. The medium uses a serum substitute, and is composed of a high glucose type DMEM basic medium, human serum albumin, transferrin, taurine, reduced glutathione, ceruloplasmin, L-ascorbic acid-2-sulfate, alpha-tocopherol succinate, linoleic acid, alpha-ketoglutarate and selenium. The serum-free basic medium can exempt potential threats caused by animal serum in conventional serum-containing mediums to human health, and the adipose-derived stem cells cultured by the medium is more suitable for clinical application.

A method of manufacturing a plurality of microelectronic packages including electrically and/or thermally conductive elements. The method includes providing a support structure having a plurality of protrusions and depressions extending outwardly from the support. A conductive element is then mated to the support structure in a male-to-female relationship. The depressions formed in the support structure and conductive element are used to house a microelectronic element such as a semiconductor chip. A substrate is provided so as to cover substantially each depression located in the conductive element. Leads interconnect contacts to the chip to terminals on the substrate. A curable encapsulant material may be deposited into the depression so as to protect and support the leads and the microelectronic element. Additionally, the curable encapsulant material forms part of the exterior of a single resulting chip package once the assembly is diced and cut into individual packages.

The invention belongs to the field of tire manufacturing technology, and specifically relates to a sidewall rubber of an automobile tire. The sidewall rubber of the automobile tire is characterized in that the sidewall rubber comprising the following components of natural rubber, butadiene rubber, styrene butadiene rubber, ethylene propylene diene monomer rubber, polybutadiene rubber, zinc carbonate, light calcium carbonate, stearic acid, talcum powder, titanium dioxide, low structure high-abrasion furnace black, white clay, zinc oxide, stearic acid, Santo white crystal, high aromatic hydrocarbon oil, an accelerant, paraffin, Santo flacks, insoluble sulfur, carbon black, aluminium hydroxide, alkyl phenol disulfide and magnesium oxide. By adopting the formula composed by the above components, the sidewall rubber of the automobile tire has relatively good strength and elongation property, can endure atmospheric aging, flex cracks and mechanical damages, can protect the tire body from corrosion of the mechanical damages, sunlight, wind and rains.

A method provides a tank out of blown, thermoformed, or rotomolded thermoplastic material with a portion in relief for enabling mounting of an attachment inside the tank. The method includes making the portion in relief on the inside of the tank, the portion in relief enabling an attachment to be mounted inside the tank. The portion in relief is made by mounting a mounting member on the wall of the tank. Preferred mounting is by heat-sealing. The wall of the tank includes at least a layer of thermoplastic material and preferably includes a layer that forms a barrier against hydrocarbons. A tank with a portion in relief mounted on an inside wall is also provided.

A valve, in particular for the oil circuit of an internal combustion engine. The valve includes a supporting dome, a valve body situated therein, a valve disk which is connected to the supporting dome and has an opening which can be closed by the valve body, and an element having a spring action which urges the valve body into the position in which the valve body closes the opening of the valve disk; the valve disk including a receptacle for a screen element, and the screen element being permanently connected to the valve disk.

A replaceable cartridge for coupling to a consumer or to a filling station, wherein the replaceable cartridge comprises at least one disconnectable connection coupling for connection to the consumer or the filling station. Furthermore, the replaceable cartridge comprises a tank for holding liquid hydrogen.

A method for making back-to-front electrical connections in a wafer level chip scale packaging process is disclosed. A wafer containing a plurality of semiconductor chips is mounted on a package substrate. Each semiconductor chip in the plurality includes one or more electrodes on an exposed back side. Scribe lines between two or more adjacent chips on the wafer are removed to form relatively wide gaps. A conductive material is applied to the back side of the semiconductor chips and in the gaps. The conductive material in the gaps between two or more of the chips is then cut through leaving conductive material on the back side and on side walls of the two or more chips. As a result, the conductive material provides an electrical connection from the electrode on the back side of the chip to the front side of the chip.

A radiation detector assembly, in some aspects, includes a detector substrate and a detector matrix array disposed on the detector substrate. A scintillator material is disposed on the detector matrix array and a moisture resistant layer is disposed on the scintillator material. The moisture resistant layer includes a plurality of sub-layers. The assembly also includes a protective cover disposed over the detector substrate and the moisture resistant layer, and an adhesive material disposed between the detector substrate and the cover. The adhesive material in some configurations is disposed so that it is not in contact with the moisture resistant layer.

A tire and wheel rim assembly includes a tire supporting rim having an outward facing mounting surface and at least one tire body mounted to the rim and positioning an internal tire cavity over the rim mounting surface. A tire pressure monitoring module assembly mounts to the rim mounting surface and includes a housing having an internal pressure chamber; a pressure sensing device and/or a temperature measuring sensor within the housing pressure chamber; and an elongate connecting member extending through the housing and the rim mounting surface. A crossover pipe connects the housing pressure chamber with a remote portion of the rim. The inflation pressure in the tire cavity is transferred through the axial passageway of the crossover pipe to the pressure chamber within the module housing.