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5results about How to "Increased tortuosity" patented technology

A waterproof and dustproof structure for lithium batteries

ActiveCN224437808USqueeze tightConstant extrusion forceClassical mechanicsStructural engineering
This utility model discloses a waterproof and dustproof structure for a lithium battery, including a lower cover and an upper cover. One side of the lower cover and the upper cover, respectively, has an integrally formed extension edge one and an extension edge two. A sealing strip one is sandwiched between the extension edges one and two. Fastening components for squeezing the sealing strip one penetrate the corners of the overlapping extension edges one and two. The fastening components are elastic near both ends. Compared with the prior art, the advantages of this utility model are that the concave-convex design of the sealing strip one, in conjunction with the concave-convex surfaces of the extension edges, increases the tortuosity of the sealing path, making it difficult for moisture or dust to directly penetrate; the adhesive layer on the sealing strip one is bonded to the extension edge, and the adhesive layer can maintain tight contact even under vibration or temperature changes, preventing gap formation; the fastening components provide constant compressive force, compensating for the loss of elasticity of the sealing strip and ensuring that the sealing strip is always tightly squeezed.
Owner:JINHUAN LVCHI NEW ENERGY TECH CO LTD

High-strength low-heat-conductivity foam glass and preparation method thereof

The invention relates to the technical field of preparation of foam glass, in particular to high-strength and low-heat-conductivity foam glass and a preparation method thereof. The problems that existing foam glass is low in strength and high in heat conductivity are solved. According to the foam glass, waste glass and glass fibers are used as raw materials, silicon carbide is used as a foaming agent, borax is used as a fluxing agent, trisodium phosphate dodecahydrate is used as a foam stabilizer, modified polyurethane and silicon dioxide aerogel are used for modifying the foam glass, the porous structure advantage of the aerogel enables heat to be transmitted along a slender framework of the aerogel, the heat transfer flux is low, and the foam glass has good heat transfer performance. The heat loss in the transmission path is large, and due to the existence of the aerogel particles, the solid-phase transmission path of heat in the foam glass is more complex, the CF3 group low surface energy reduces the heat convection path and inhibits the solid-phase heat conduction, so that the foam glass has a lower heat conductivity coefficient, and the mechanical strength of the material is improved. Therefore, the durability and thermal insulation performance of the foam glass are enhanced.
Owner:JIANGSU DEHE INSULATION TECH CO LTD

High-temperature-resistant insulating protective coating for power battery pack and preparation method thereof

PendingCN122503011AIncreased tortuosityreduce continuity
The application discloses a high-temperature-resistant insulating protective coating for power battery packs and a preparation method thereof. The coating comprises, in terms of weight fractions, 40-60 parts of organic silicon modified polyurethane acrylate, 10-20 parts of a polyisocyanate compound, 0.01-0.5 parts of a catalyst, 5-15 parts of a quaternary phosphonium cation modified montmorillonite, 5-10 parts of gamma-methacryloxypropyltrimethoxysilane modified mica powder, 2-5 parts of nano-aluminum oxide, 1-3 parts of zinc borate, 1-3 parts of a photoinitiator and 30-50 parts of a solvent. The application improves the insulating performance and high-temperature resistance by constructing a stacked "brick-mud" structure and organic silicon modification.
Owner:HENAN LIANCHUANGDA IND PROTECTIVE MATERIALS CO LTD

A top of blast furnace noise elimination and dust removal device

The application discloses a blast furnace top sound elimination and dust removal equipment and relates to the technical field of flue gas dust removal. Since the temperature of flue gas led out from a blast furnace is high, when the flue gas is directly subjected to dust removal treatment without cooling, the heat of the flue gas is transferred to a dust removal filter element in the filtering process, the filter element is damaged, and the dust removal effect on the flue gas is affected. The blast furnace top sound elimination and dust removal equipment utilizes the contact between flue gas and an inner cavity block and an outer cover bin when the high-temperature flue gas flows, so that the heat of the flue gas is transferred to cooling water through the inner cavity block and the outer cover bin when the flue gas contacts the inner cavity block and the outer cover bin, the temperature of the flue gas is lowered, the filter element is prevented from being damaged due to high-temperature flue gas during dust removal, the arc-shaped protrusions of the inner cavity block are matched with the recesses of the outer cover bin, the tortuosity of the flue gas flow is increased, the area of the contact between the outer cover bin and the inner cavity block and the flue gas is increased, and the cooling effect is improved.
Owner:YANGZHOU QINYOU STEEL CO LTD

A high-efficiency GPU chip liquid cooling heat dissipation device

ActiveCN224402096UImprove convection heat transfer coefficientPromote working fluid distributionCold plateHeat spreader
The utility model relates to a kind of high-efficiency GPU chip liquid cooling heat sink, comprising: bottom plate;GPU mainboard being located on the bottom plate;Radiator cover plate being located on the GPU mainboard, the radiator cover plate and the GPU mainboard are enclosed to form a heat dissipation space;Radiator cold plate and shunt plate in the heat dissipation space, the radiator cold plate is located on the GPU mainboard, the shunt plate is located on the radiator cold plate;Wherein, the side of the radiator cold plate away from the GPU mainboard is equipped with microstructure rib column;The radiator cover plate is provided with a pair of working medium flow port being located just above the shunt plate, respectively as the working medium inlet and working medium outlet of heat dissipation device.The utility model provides a kind of high-efficiency GPU chip liquid cooling heat sink, the radiator cold plate of the device is equipped with microstructure rib column, by increasing the heat dissipation area and disturbing working medium flow field, improve convective heat transfer coefficient.
Owner:SHANGHAI INST OF TECH