1results about How to "Avoid easy decomposition" patented technology

The application discloses a composite additive for electroplating copper of a printed circuit board via hole and an electroplating solution thereof, wherein the composite additive PPL-2000 is a purine group with a nitrogen-containing heterocyclic ring introduced in a polyethylene glycol molecule with a molecular weight of 2000; on one hand, the introduction of the purine group with the nitrogen-containing heterocyclic ring not only significantly enhances the adsorption capacity of the polyethylene glycol molecule to the copper surface, but also makes the PPL-2000 molecule more easily enriched in a high current density area, such as a surface protruding part and a via hole opening; on the other hand, the polyether functional group in the polyethylene glycol molecule has a strong adsorption capacity and can be combined with Cl ‑ in the plating solution to generate a synergistic effect, so that a stable and dense adsorption structure is formed on the surface of the copper layer, thereby effectively inhibiting the copper electrodeposition process.