32results about How to "Improve interface" patented technology

The invention discloses a composite encapsulating material with high heat conduction activity and a preparation method thereof, and belongs to the field of metal based composite materials. The composite material consists of SnAg4Ti4 alloy powder, aluminum powder and diamond particle reinforcer, wherein volume percentage of diamond particles is 50%-70%, volume percentage of aluminum powder is 25%-49%, and volume percentage of SnAg4Ti4T alloy powder is 1%-5%. A preparation method for the composite encapsulating material comprises the following steps: preparing active brazing filler metal SnAg4Ti4 alloy powder through a vacuum gas-atomization powdering furnace, mechanically mixing powder, and putting mixed powder into a discharge plasma sintering furnace to prepare a diamond / aluminum composite material. The sintered composite material is relatively good in interface bonding, is relatively high in compactness, has heat conductivity of 703W / m.K, has a thermal expansion coefficient reduced to 7.9*10<-6> / K, and has compactness of 97.8% or more. The preparation method is strong in operability, is simple in process, and can be used for the fields of electronic encapsulating and the like.

The invention discloses a diamond / copper composite packaging material high in thermal conductivity and a preparation method thereof. The material is formed by sintering Cu-(1-10 wt.%)Ti alloy powder, titanium powder and diamonds through the spark plasma sintering technology, wherein the content of Cu is 40-60% by weight, the content of Ti is 2-10% by weight and the rest is the diamonds. The composite packaging material is good in interface bonding performance and high in compactness, the heat conductivity of the material reaches 425-522 W / m.K, the thermal expansion coefficient of the material is lowered to (7.1-8.3)*10<-6> K, and the compactness is greater than 97%. The diamond / copper composite packaging material high in thermal conductivity and the preparation method thereof have the advantages that the operability is high and the process is simple and can be used for the field of electronic packaging.

The invention discloses a fluorine-containing polyurethane solid composite electrolyte and a preparation method thereof. The electrolyte is composed of a fluorine-containing polyurethane, an inorganic solid electrolyte and a lithium salt. The preparation method includes: S1: preparation of a fluorine-containing dihydroxy monomer; S2: fluorine-containing Preparation of polyurethane; S3: Preparation of fluorine-containing polyurethane solid-state composite electrolyte. The invention adopts polyether polyurethane as solid electrolyte matrix, and its molecular chain contains a large number of ether groups, which can effectively improve the conductivity of lithium ions at room temperature; at the same time, the fluorine-containing polyurethane is prepared by synthesizing a new type of fluorine-containing dihydroxy monomer as a chain extender, and the introduction of The fluorine structure can effectively improve the electrochemical stability of the polyurethane electrolyte, improve the dissociation degree of lithium salts to a certain extent, and improve the lithium ion conductivity; the fluorine-containing structure can effectively improve the mechanical properties and processing properties of the polyurethane solid electrolyte in the polyurethane; Polyurethane solid electrolyte is prepared by inorganic composite, which can effectively improve the conductivity of lithium ions and improve the thermal stability and mechanical properties of the electrolyte membrane.