The invention discloses a high-thermal-
conductivity low-
viscosity epoxy resin molding compound for
semiconductor packaging and a preparation method of a heat-conducting component of the high-thermal-
conductivity low-
viscosity epoxy resin molding compound. The molding compound is composed of 50-100 parts by weight of
epoxy resin, 40-100 parts by weight of a curing agent, 3-5 parts by weight of an
ion capturing agent, 2-6 parts by weight of a
coupling agent, 400-600 parts by weight of a
hybrid filler, 2-5.25 parts by weight of a
flame retardant and 1-2.5 parts by weight of a coloring agent. The heat-conducting component is formed by assembling alpha
crystal form aluminum
oxide microspheres (10-50 microns) and aluminum
oxide nanosheets through chemical bonds, and the
mass ratio of the alpha
crystal form aluminum
oxide microspheres (10-50 microns) to the aluminum oxide nanosheets is (2-10): 1. The method comprises the steps of assembling spherical aluminum oxide and flaky aluminum oxide into a
hybrid filler according to a certain component ratio through chemical bonding, adding the
hybrid filler into an epoxy molding compound mixture, and carrying out high-speed dispersion, mixing, crushing, mold pressing and other processes to form the molding compound. The prepared epoxy resin molding compound has
high heat conductivity coefficient and lower
internal stress, the
spiral flow length is not less than 50 inches, and the typical value of the heat conductivity coefficient can reach 4.3 W / mK.