The invention relates to a piezoresistor and a manufacturing process thereof. The piezoresistor is composed of a
ceramic substrate, a leading-out end, an
electrode layer and an insulating layer, wherein a concave area, namely, an
electrode positioning area, is prefabricated on the
ceramic substrate; the leading-out end is arranged on an
electrode; the insulating layer is used for locally or wholly packaging the
ceramic substrate, the electrode layer and the leading-out end; in the manner of
sputtering or spraying electrode, an electrode hole of a
mask plate is positioned and coated on a concave opening; a small electrode hole and a big concave opening form a
bottle-shaped structure; the electrode is drifted and deposited into the concave opening so as to form the electrode and realize the concave opening being accurately filled with the electrode; the electrode eccentricity caused by the difference in
diameter of the
ceramic substrate in a batch
sputtering process can be avoided; the thickness of the
ceramic substrate at an edge of the concave opening is greater than the thickness of the interior; the reducing of the risk in edge arc crossing is benefited; the edge effect is weakened; the flowing property is greatly promoted; the preparation process of the piezoresistor comprises the following steps: manufacturing the
ceramic substrate, performing electric polarization, connecting the leading-out end,
coating the insulating layer, printing and testing.