34results about How to "There is no problem of shedding" patented technology

The invention discloses a high-frequency and high-speed printed circuit board (PCB) and a fabrication method thereof. The high-frequency and high-speed PCB comprises at least two layers of rigid substrate core plates, at least one layer of PTFE substrate core plate and at least one layer of FR4 substrate core plate, wherein a PCB main body is formed by sequentially laminating the rigid substrate core plate, the PTFE substrate core plate, the FR4 substrate core plate, the PTFE substrate core plate and the rigid substrate core plate from bottom to top, PTFE prepregs are laminated among the core plates, and a through hole is drilled in the PCB main body. The fabrication method of the high-frequency and high-speed PCB comprises the steps of board cutting, surface roughness processing, inner-layer pattern fabrication, baking plate processing, board lamination, drilling, copper plating, soldering and surface processing. The PCB disclosed by the invention has the characteristics of excellent high-speed / high-frequency transmission and low transmission loss, the production processes such as drilling, shaping and board grinding are easier to control, and the problem that a soldering layer is easy to drop off is solved.

The invention belongs to the technical field of surgical implants and relates to an artificial joint prosthesis with biologically activated surface. The biological activation layer formed on the surface of the artificial joint prosthesis has good biocompatibility and bioactivity and forms natural chemical bonding with the bone tissues, thus improving the bond strength between the prosthesis and the bone tissues, ensuring the stress transfer to be more reasonable and reducing the negative effect of stress shielding. The biological activation layer on the surface of the artificial joint prosthesis is formed by chemical reaction and forms chemical bonding with the matrix, therefore, the problem that the biological activation layer on the surface sheds is avoided, thus ensuring the postoperative long-term effect of the prosthesis. The artificial joint prosthesis is biologically fixed; therefore, wear particles produced when bone cement is adopted for fixation are avoided, thus reducing the possibility of occurrence of aseptic loosening. Besides, the artificial joint prosthesis adopts simple raw materials and process, has low cost and is easy to realize.

The invention relates to a composite material core used for an enhanced cable, a preparation process and the enhanced cable. The composite material core comprises an inner core and an outer layer, wherein the inner core is composed of fiber and thermosetting resin; the outer layer comprises a fiber woven pipe and thermosetting resin which are composited to form the outer layer; and the fiber woven pipe of the outer layer is a network structure which is woven by interlacing a plurality of fiber bundles. The transversal strength of the composite material core is greatly improved by the interlaced network structure, the fatigue resistance of the composite material core is greatly improved, and the service life of the composite material core and a power transmission cable is prolonged; and the problem that the composite material core is broken when the composite material core is stranded, wound and extruded by a conductor in the manufacturing process of the cable is completely avoided. Asthe fiber woven pipe is adopted by the outer layer, the flexibility of the outer layer is greatly increased by the interlaced and woven structure, thereby meeting the requirement of manufacturing composite material core with major diameter.

An object of the present invention is to provide a semiconductor device and a method for manufacturing the semiconductor device, which improve the high-temperature durability, quality, and reliability of a junction between a semiconductor element and a substrate by using a sinterable junction material. The semiconductor device manufacturing method of the present invention is characterized in that it includes the following steps: (a) preparing an insulating or conductive substrate; (b) disposing a sinterable bonding material in the bonding region (3a) of the main surface of the substrate (that is, an insulating substrate) (c) sintering the bonding material while making the surface for bonding of the semiconductor element, that is, the bonding surface, contact with the bonding material under pressure, thereby bonding the substrate (i.e., an insulating substrate) and the semiconductor element via the bonding material, the process ( The bonding region in b) is located inside the bonding surface of the semiconductor element (i.e., region (3b)) in plan view, and after step (c), the bonding material does not go outside the bonding surface of the semiconductor element in plan view. overflow.

The invention discloses an insulated wire coded by entity color bars and a preparation method thereof. The preparation method is characterized in that an outermost layer rubber jacket is set as fan-shaped entity zones with different colors in a zoning mode on the cross section of a wire; and the fan-shaped entity zones with the different colors are helical in the axial direction of the wire so asto form helical color bars at the periphery of the wire. The color bars of the invention can not drop and has exact color code and large coding capacity; and the preparation method of the invention is simple and reliable and has high production efficiency.

The invention provides a method for preparing a wooden board with a concave-convex-profiled surface, and belongs to the field of materials technology. The method overcomes the defects of the prior decorative boards which have no concave-convex-profiled surface, lack three-dimensional sense and have poor attractive performance. The manufacturing process of the wooden board with a concave-convex-profiled surface includes the following steps that: A. material selecting includes that wooden boards can be selected and conveyed under a pressing machine by a conveyer; B. pressing includes that the wooden boards conveyed under the pressing machine which is provided with a concave-convex-profiled die plate at bottom can be pressed under high temperature; C. surface processing includes that the wooden boards with concave-convex-profiled surfaces can be achieved by deburring the press boards and spraying oil and painting. The wooden board made according to the manufacturing method of the wooden board with a concave-convex-profiled surface has the advantages of good fire-resistance, moisture-proof, wear-resistance and scratch- resistance attractive performances and well three-dimensional sense.