32results about How to "Increase cost rate" patented technology

The invention discloses a high-precision resonant mode quartz temperature sensor with a plurality of arrow-shaped vibrating arms. The high-precision resonant mode quartz temperature sensor with the arrow-shaped vibrating arms aims to solve the problems of large volume, fixed thermosensitive quartz resonator, complex mounting structure, slow response speed and the like of an existing temperature sensor. The high-precision resonant mode quartz temperature sensor with the arrow-shaped vibrating arms comprises an integrated packaging part and a thermosensitive quartz resonator, wherein the integrated packaging part is filled with helium gas; the integrated packaging part comprises a pipe cap and a pipe seat; the pipe seat comprises an insulator, a first pin and a second pin; the thermosensitive quartz resonator comprises a base region and n vibrating arms, and n is an even number not less than four. According to the high-precision resonant mode quartz temperature sensor with the arrow-shaped vibrating arms, the mechanical strength of the thermosensitive quartz resonator is improved, a parasitic vibration mode in a conventional structure is reduced, structures are simple to support, fixand mount, high cost rate is achieved, and more importantly the precision, response speed, repeatability and long-term stability of the sensor are improved. The high-precision resonant mode quartz temperature sensor with the arrow-shaped vibrating arms has low working frequency, low power consumption, high precision, high response speed, clean frequency spectrum and high anti-interference capability.

The invention discloses and provides a dust collection milling cutter structure of a board division machine. The dust collection milling cutter structure is simple in structure, produces the production cost, achieves comprehensive dust collection so as to lower the reject ratio, and meanwhile effectively prevents static electricity. The dust collection milling cutter structure comprises a transverse moving device, a lifting device arranged on the transverse moving device and a milling cutter device arranged on the lifting device. The lifting device is in sliding fit with the transverse moving device, and the milling cutter device is in sliding fit with the lifting device. The milling cutter device comprises a milling cutter base (1) and a milling cutter (2) arranged on the top of the milling cutter base (1). The milling cutter base (1) is further provided with a dust collection cavity (3). The periphery of the milling cutter (1) is wrapped by the dust collection cavity (3). A plurality of anti-static hairbrushes (4) are arranged on the dust collection cavity (3) and have the equal height as the milling cutter (2). The dust collection cavity (3) is communicated with a dust collection pipe (5). The dust collection milling cutter structure of the board division machine is applicable to the field of board division machines.

The invention relates to a method for manufacturing a tiny-pore plate by using a wave flat belt, comprising the following steps of: overlapping a wave-shaped belt (2) and a flat belt (3) to form a wave flat belt (1); fixing the starting end of the wave flat belt (1) on a center shaft (4); winding the wave flat belt (1) on the center shaft (4) for a plurality of circles by taking the center shaft (4) as a center; and fixing the termination end of the wave flat belt (1) after the winding so as to obtain the tiny-pore plate (5). Another method provided by the invention comprises the steps of: fixing the starting end of a wave flat belt (1) which has a flat surface at one side and a wave-shaped curved surface at the other side on a center shaft (4); winding the wave flat belt (1) on the center shaft (4) for a plurality of circles by taking the center shaft (4) as the center; and fixing the termination end of the wave flat belt (1) after the winding is ended so as to obtain the tiny-pore plate (5). The method provided by the invention is simple; and the tiny-pore plate has good quality and low manufacturing cost.

The invention discloses a manufacturing method of a high temperature and high pressure resistant hydraulic component. The hydraulic component comprises a mounting shell, one end of the shell is provided with a valve hole, and the other end of the mounting shell is provided with a threaded hole which is communicated with the valve hole and is coaxial. The valve hole is provided with a valve core that fits with the valve hole. The clearance between the valve core and the valve hole is 0.001‑0.002mm. The roughness of the inner surface of the valve hole and the outer surface of the valve core are Ra0.4 and Ra0 respectively. .2; and prepared through the steps of material preparation, heat treatment, machining, fitter, surface treatment, grinding, and testing, the valve core and the valve hole can be sealed and fitted in a medium environment of 120‑130℃ and a pressure of 40‑45MP It has good sealing performance, and the preparation method of the present invention has a high yield.

The present application provides an MRAM device and a manufacturing method thereof. The manufacturing method includes: step S1, arranging a first interconnection part and a second interconnection part in an interconnection medium layer; step S2, arranging a first etch barrier layer and a first dielectric layer in sequence on the surface of an interconnection medium layer layer; step S3, forming a first metal hole in the first etching barrier layer and the first dielectric layer above the first interconnection; step S4, sequentially forming a first metal hole on the surface of the first dielectric layer above the first interconnection Setting the bottom electrode, the MTJ unit, the top electrode, and the second etch barrier layer; step S5, sequentially setting the third dielectric layer, the third etch barrier layer and the fourth dielectric layer on the surface of the second dielectric layer away from the first dielectric layer Dielectric layer; Step S6, opening the second through hole and the third through hole; Step S7, filling the second through hole and the third through hole with metal. The manufacturing method reduces the process difficulty and improves the cost rate of the device.

The invention discloses a packaging method of an integrated optical isolator and the integrated optical isolator, and relates to the technical field of optical fiber communication. The method includes: laminating the first magneto-optic crystal and the birefringent crystal to form a substrate; dividing the substrate into a front substrate, a middle substrate and a rear substrate, performing ion etching on the surface of the birefringent crystal corresponding to the middle substrate, and Make a magneto-optical rotator on the first magneto-optic crystal after etching; use the birefringent crystal corresponding to the front substrate to form a polarizer, and use the birefringent crystal corresponding to the rear substrate to form a polarizer; couple the polarizer to the optical fiber , coupled to the output fiber on the analyzer to obtain an integrated optical isolator. In the present invention, the first magneto-optic crystal is pasted with birefringent crystal, and the polarizer and the polarizer are prepared at the same time, so the product quality is high, the processing technology is simple, the processing efficiency is high, and the processing cost is reduced.

The invention relates to a device for continuously and automatically measuring the resistance value of conductive materials, which belongs to the field of electrical measurement technology, and mainly solves the problem of multi-point monitoring of the resistance value of conductive materials. It is mainly composed of a resistance multi-point cycle detection system, a winding system, a deviation correction mechanism and a support plate; the support plate is provided with a deviation correction mechanism pressure roller, and a deviation correction mechanism is provided below, and is controlled by a central controller; The material board and the deviation correction mechanism are installed on the support frame; the detection system and the winding system are installed on the winding frame, and the detection system is located between the deviation correction mechanism and the winding system. Due to the continuous multi-point cyclic detection of the resistance value, and the multi-point horizontal distribution of the detection points, the uniform distribution of the resistance value after the conductive treatment of the material is ensured, and the uneven density of the later electroplated metal surface caused by the uneven resistance value of the material is reduced. The cost rate of production is improved, and the product quality is guaranteed. It is suitable for measuring the resistance of materials such as conductive sponges.

The invention belongs to the technical field of semiconductor surface modification, and specifically relates to a method for preparing a semiconductor laser cavity mirror, comprising the following steps: Step 1, cleaning; Step 2, passivation modification; Step 3, dielectric film coating; Step 4, flipping, Repeat step 1 to step 3, step 5, remove; the semiconductor laser cavity mirror modification method can be compatible with chemical and physical surface modification technology, which improves the selectivity and integrity of surface treatment; makes the surface clean and passivation modified The dielectric film coating of the double-sided cavity mirror is completed in the same vacuum chamber at one time, which reduces the number of sample entry and exit operations and possible pollution and damage, improves the cost rate, and greatly improves production efficiency; this method is based on the same equipment. Surface cleaning, modified passivation and dielectric film technology are integrated on the surface, so that the various steps of surface treatment are seamlessly connected, and the performance and yield of the finished product are improved; further, the treatment of the double-sided dielectric film cavity mirror is also completed in one step. The production efficiency and quality stability are further enhanced; the method is suitable for batch processing, has high production efficiency and low comprehensive cost.

The invention discloses an orifice plate. An upper ring score and a lower ring score are respectively arranged on the upper surface and the lower surface of the orifice plate. The upper ring score and the lower ring score are coaxial but have a diameter of different. At the same time, the current blocking structure of the lithium-ion battery is disclosed, which includes a fixedly connected orifice plate and an explosion-proof sheet, and an upper ring score and a lower ring score are respectively formed on the upper surface and the lower surface of the orifice plate. The upper and lower ring scores are coaxial but have different diameters. In the orifice plate of the present invention, the interval 6 of the overlapping portion of the upper ring score and the lower ring score is used as a CID structure, and the processing is simple. The current blocking is realized by the current blocking structure on the orifice plate perpendicular to the direction of the battery cover, that is, the tearing of the spacer 6 . The reduction of the tolerance dependence of the upper ring notch and the lower ring notch, first of all, greatly reduces the processing cost, and the stability of the product, especially the stability of the explosion-proof performance.

A driving circuit includes a shift register circuit and an output buffer circuit. The shift register circuit includes first and second shift register units. The first and second shift register units respectively output first and second shift signals, and the first and second shift signals are enabled sequentially. The output buffer circuit includes first and second output buffer units. The first and second output buffer units respectively receive the first and second shift signals to output a first switch control signal and a second switch control signal. The voltage supply end of the second output buffer unit receives the first shift signal. When the voltage of the first shift signal turns inactive, the second output buffer unit is enabled, so that the second output buffer unit outputs the second switch control signal, so that a data signal is input into the pixel array.