The application provides a heat-conducting material suitable for local micro heat sources of integrated chips and a preparation method thereof, and the preparation method comprises the following steps: S1, obtaining a topological structure of a heat-conducting filler framework according to the parameters of the local micro heat source; S2, designing an ice template mold, comprising a heat-conducting
metal block with a cavity protrusion on the upper surface and a heat insulation plate, the heat insulation plate is covered on the upper surface of the heat-conducting
metal block and exposes the cavity protrusion as a cold source; S3, controlling the temperature to form uniform
crystal nuclei on the cavity protrusion, adding a heat-conducting filler dispersion liquid, controlling the temperature of the cavity protrusion to be close to the
freezing point, directional freezing, forming an ice template-heat-conducting filler composite, freeze-
drying, and obtaining the heat-conducting filler framework; and S4, treating the heat-conducting filler framework and a
polymer matrix
prepolymer by a vacuum impregnation method to obtain the heat-conducting material. The heat-conducting material and method solve the problems of poor heat-conducting strengthening effect, and mismatching between the structure and the heat source of the existing material, and realize efficient reduction of the temperature of the micro heat source.