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58results about How to "Low water vapor permeability" patented technology

Hydrogenated block copolymer having alkoxysilyl group and use therefor

Provided are: an alkoysilyl group-containing hydrogenated block copolymer produced by introducing an alkoxysilyl group into a hydrogenated block copolymer that is obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer that includes at least two polymer blocks [A] and at least one polymer block [B], the polymer block [A] including a repeating unit derived from an aromatic vinyl compound as a main component, the polymer block [B] including a repeating unit derived from a linear conjugated diene compound as a main component, and a ratio (wA:wB) of a weight fraction wA of the polymer block [A] in the block copolymer to a weight fraction wB of the polymer block [B] in the block copolymer being 20:80 to 60:40; a method for producing the same; a solar cell element encapsulating material; a sheet, a laminated sheet; a multilayer sheet; and a method for encapsulating a solar cell element. The alkoxysilyl group-containing hydrogenated block copolymer exhibits low hygroscopicity, a low water vapor permeability, transparency, weatherability, and flexibility, maintains excellent adhesion to glass even when exposed to a high-temperature/high-humidity environment for a long time, and can encapsulate a solar cell element without applying a special waterproof treatment.
Owner:ZEON CORP

Manufacturing method of flexible heat-sensitive thin film resistor array

The invention discloses a manufacturing method of a flexible heat-sensitive thin film resistor array, which belongs to the field of micro-electromechanical systems (MEMS). The method comprises the following steps: firstly depositing a sacrificial layer on a silicon chip; spin-coating a PI prepolymer on the sacrificial layer, and forming a PI thin film by thermocuring; then spin-coating photoresist, carrying out lithographic patterning, and sputtering a required metal heat-sensitive thin film layer; adopting the stripping method to obtain a pattern of the heat-sensitive thin film layer; then spin-coating the photoresist, carrying out the lithographic patterning, and then electroplating for forming an electrical connection metal layer; removing the photoresist, and then carrying out heat treatment on heat-sensitive resistors; and finally depositing a parylene protective layer, removing the sacrificial layer and then obtaining the flexible thin film resistor array. The flexible heat-sensitive thin film resistor array has simple process, more reliable connectivity of the heat-sensitive resistors, and small interference of conductor resistance, and can greatly improve the measurement precision when being used as a sensing element of a sensor, and be applied in moist, underwater and other environments under the condition of ensuring the sensitivity of the sensor.
Owner:NORTHWESTERN POLYTECHNICAL UNIV

Preparing method of carbon nano tube array composite film and heat exchanger

ActiveCN105463404AImprove thermal conductivityWith high temperature and low temperature resistanceChemical vapor deposition coatingLaminated elementsComposite filmGas phase
The invention provides a preparing method of a carbon nano tube array composite film and a heat exchanger. The method comprises the following steps that S1, an Al2O3 film and a Fe film are sequentially deposited on a substrate of monocrystalline silicon (100) to serve as catalysts; S2, vacuum chemical vapor deposition equipment is heated to 830 DEG C to 850 DEG C, ethylene gas is led in to serve as a carbon source, and a carbon nano tube array grows under assistance of water; S3, paracyclophane is deposited on the surface of the nano tube array in a vapor manner to form an even composite film; S4, the composite film is transferred to an aluminum sheet from the substrate of the monocrystalline silicon (100), paracyclophane is deposited on the surface of the composite film in a vapor manner, and a composite film is bonded on the aluminum sheet; and S5, a paracyclophane coating on the surface of the composite film is etched to form the carbon nano tube array composite film. The prepared carbon nano tube array composite film has high temperature and low temperature resistance, corrosion resistance, heat conduction and super hydrophobicity, and therefore when a unit carries out refrigeration, heat exchanger fins are not prone to condensation; and during heating, frosting is not prone to happening, the heat exchange performance of the heat exchanger is improved, and therefore the running performance of the unit is improved.
Owner:GREE ELECTRIC APPLIANCES INC

Organic light emitting diode device encapsulation drying agent and encapsulation application method thereof

The invention relates to the field of organic light emitting diode device encapsulation and provides an organic light emitting diode device encapsulation drying agent and an encapsulation application method thereof. The drying agent is characterized by comprising, by weight, 4-7 parts of chloride, nano calcium oxide microcrystal, and 15-70 parts of film forming agent. The molar ratio of the chloride to the nano calcium oxide microcrystal is 1:1-10. When the drying agent is used for encapsulating an OLED device, the drying agent is dissolved by ketone or alcohol to form coating liquid, the coating liquid is used to coat the inner surface of the cover plate of the OLED device in a spun manner, and film thickness is 2-10 micrometers. Compared with traditional drying pieces, the drying agent and the coating liquid thereof are simple to operate, convenient to prepare, cheap in raw material, easy in raw material acquiring, convenient to store and good in stability. Compared with other thin film drying agent, the drying agent and the coating liquid thereof has the advantages that the nano calcium oxide particles are doped in the coating liquid, specific surface area is increased, moisture absorption capability is increased, and good drying effect is achieved.
Owner:北京大学包头创新研究院
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