1results about How to "Lower recrystallization temperature" patented technology

The present application relates to copper-aluminum composite plate strip technical field, especially a kind of copper-aluminum composite plate strip and production method, it is made of aluminum material and copper material composite, the oxygen content of copper material is 50ppm-500ppm, production method includes oxygen-increasing treatment to red copper or oxygen-free copper, the present application reduces the recrystallization temperature of copper material by increasing the oxygen content in copper material, in turn reduces annealing temperature, copper-aluminum composite blank heat treatment below 300 DEG C can satisfy copper material complete recrystallization, realize soft annealing, meet the demand of bending, while reducing the thickness of copper-aluminum intermetallic compound in heat treatment process, improve the composite strength of copper-aluminum composite plate strip.