The
evaporation heat dissipation
assembly comprises a first
water cooling head, a first water pump, a first water bag and a heat dissipation device which are connected in a circulating mode, the first
water cooling head is tightly attached to the hot face of a
semiconductor chilling plate, the heat dissipation device comprises a shell with a water inlet end and a water outlet end, and a first
water storage bin is arranged on the side, close to the water inlet end, in the shell. A first
water storage bin is arranged in the shell and provided with a plurality of water inlet holes, a second
water storage bin is arranged on the side, close to the water outlet end, in the shell and provided with a plurality of water outlet holes, a water passing part is arranged between the first water storage bin and the second water storage bin, the shell is provided with a plurality of air outlets and air inlets corresponding to the water passing part, and the air inlets are correspondingly provided with fans. The first water pump ensures that water in the
evaporation heat dissipation
assembly keeps circulating flowing, the water flows to the water passing part through a water inlet hole of the first water storage bin, air flowing in the water passing part takes away heat in the water, then the water flows to the second water storage bin through a water outlet hole and finally flows back to the first
water cooling head from the water outlet end along the other end of the first water bag, and the
water circulation process is continuously repeated. The design structure is simple, the heat dissipation efficiency is high, and the practicability of the product is improved.