The invention provides a forming method of a CMOS image sensor, and the method comprises the steps: forming a self-aligned silicide region barrier layer, and covering a pixel region; forming a stressmemory dielectric layer, a grid electrode covering the pixel region and the pixel region, and a side wall; carrying out annealing treatment on the stress memory dielectric layer on the pixel region; and removing the stress memory dielectric layer on the pixel region. The invention also provides a CMOS image sensor, comprising a semiconductor substrate, wherein the semiconductor substrate comprisesa pixel region and a logic region; the pixel region and the logic region are each provided with a grid electrode and a side wall; a self-aligned silicide region barrier layer is formed on the pixel region, and the grid electrode and the side wall on the pixel region; a stress memory dielectric layer is arranged on the pixel region, high stress of the stress memory dielectric layer is transferredinto the pixel region through annealing, and the migration rate of electrons generated by near-infrared light can be increased in a stress mode, so that the electrons generated by near-infrared lightare increased to become signal charges, and the collection efficiency of the near-infrared light is improved.