2results about How to "Low vaporization temperature" patented technology

This invention provides a method for recovering and utilizing distillation residue after solvent removal from homohydric anhydride, relating to the field of fine chemical technology. The method includes anhydride treatment, vaporization and sublimation, dissolution and recrystallization, distillation, and water washing. In this invention, the distillation residue is anhydride-treated under high temperature and negative pressure, followed by vaporization and sublimation under vacuum to separate mechanical impurities and high-boiling substances. Then, through dissolution and recrystallization, the difference in solubility between homohydric anhydride and metahydric anhydride in polar solvents is utilized to preferentially crystallize out the homohydric anhydride. The mother liquor is distilled to remove the solvent, and then colored impurities are removed by hot water washing and activated carbon adsorption. Finally, it is cooled and crystallized to obtain trimellitic acid. The homohydric anhydride obtained by this invention has a purity ≥95% and a yield of 84-89%, and the trimellitic acid has a purity ≥97% and a yield of 81-86%. This method achieves effective recovery of high-value-added components from distillation residue, demonstrating significant economic and environmental benefits and promising application prospects.

The application discloses a vapor chamber and a preparation method thereof and an electronic device, relates to the technical field of heat dissipation, and can reduce the weight and thickness of the vapor chamber, thereby achieving the light and thin design of the electronic device. The vapor chamber comprises a first cover body and a second cover body. The first cover body comprises a first wall plate and a boss. The boss is fixed to the first wall plate and protrudes from one side surface of the first wall plate. A capillary groove is arranged on the boss, and the boss is a high polymer material piece. The second cover body is in sealed connection with the first cover body, and the second cover body is supported on the boss. A steam passage is formed between the second cover body, the boss and the first wall plate, and the steam passage is in communication with the capillary groove.