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A crack-resistant, high thermal conductivity ceramic tile
Active
CN224281851U
Improve stress resistance
Improve wear resistance
Flooring
Thermal conductivity
Adhesive bonding
This utility model relates to a crack-resistant, high
thermal conductivity
ceramic
tile. It solves the problems of poor
thermal conductivity
and easy
cracking
and hollowing in existing
ceramic
tiles. It includes a
ceramic
tile body, with a wear-resistant and crack-resistant structural layer on the upper surface, an
adhesive
bonding
assembly
at the lower end, and a pressure-resistant mechanism in the middle layer of the ceramic tile body for connecting the wear-resistant and crack-resistant structural layer and the
adhesive
bonding
assembly
. An
adhesive
supply structure is provided between the pressure-resistant mechanism and the
adhesive bonding
assembly
. The advantages of this utility model are: good
thermal conductivity
, less prone to
cracking
and hollowing, and a stable structure.
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Owner:
SHANGHAI WEIXING NEW MATERIAL TECH CO LTD
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Improve thermal efficiency
stable structure
easy to use
Improve thermal conductivity