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A crack-resistant, high thermal conductivity ceramic tile

This utility model relates to a crack-resistant, high thermal conductivity ceramic tile. It solves the problems of poor thermal conductivity and easy cracking and hollowing in existing ceramic tiles. It includes a ceramic tile body, with a wear-resistant and crack-resistant structural layer on the upper surface, an adhesive bonding assembly at the lower end, and a pressure-resistant mechanism in the middle layer of the ceramic tile body for connecting the wear-resistant and crack-resistant structural layer and the adhesive bonding assembly. An adhesive supply structure is provided between the pressure-resistant mechanism and the adhesive bonding assembly. The advantages of this utility model are: good thermal conductivity, less prone to cracking and hollowing, and a stable structure.
Owner:SHANGHAI WEIXING NEW MATERIAL TECH CO LTD +1