The invention relates to the technical field of
semiconductor wafers, in particular to a preparation method of a
semiconductor graphical
epitaxial thin film, an embedded
electrode structure and application, and the method comprises the following steps: S1, carrying out the pretreatment of a substrate layer, and carrying out the low-temperature deposition of a high-temperature-resistant
hard mask layer on the surface of the pretreated substrate layer; s2, performing segmented
etching treatment on the deposited high-temperature-resistant
hard mask layer and part of the substrate layer according to a photoetching pattern, and removing the
photoresist after
etching treatment to obtain a first substrate; s3, the first substrate is placed in a PLD cavity, a bottom
electrode thin film layer is epitaxially deposited on the
etching face of the first substrate, the thickness of the bottom
electrode thin film layer is the same as the etched depth of the substrate layer, and a second substrate is obtained; and S4, performing wet etching on the second substrate until the high-temperature-resistant
hard mask layer is completely removed, and performing post-
processing to obtain the embedded electrode structure. According to the technical scheme, the problems of high-temperature failure, cavity carbon
pollution, pattern collapse,
surface roughness and the like of traditional optical
cement are solved.