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Silver electrolytic polishing solution of a deep eutectic solvent system and application thereof

PendingCN122382698AInhibition of segregationHigh solubilizing ability
The application discloses a eutectic solvent system silver electrolytic polishing solution and application thereof; the polishing solution is prepared from raw materials and has the following mass fractions: a eutectic solvent base solution with a molar ratio of choline chloride to ethylene glycol being 1:1.5 to 1:2.5, 0.6 to 1.0 parts of 5,5-dimethylhydantoin, 0.9 to 2.0 parts of citric acid, 0.3 to 1.0 parts of urea and 0.1 to 0.5 parts of sodium dodecyl sulfate; the application utilizes the multiple hydrogen bond cross-linking network formed by citric acid and DMH in the base solution to realize solubilization of a macromolecular complexing agent and reduce the viscosity of the system; through a dynamic step voltage polishing process and a homologous decomplexing post-processing method, the problems of low mass transfer efficiency, anode film residue and surface reduction blackening in a non-aqueous system are solved; the application can improve the mirror gloss of a silver workpiece surface, reduce the roughness to below 0.05 mu m and has high silver loading and excellent environmental stability.
Owner:HEFEI SIGMA APPLIED MATERIALS CO LTD