The invention discloses a filter fan-out packaging structure and a manufacturing method thereof, a filter
chip comprises a
resonance area and a non-
resonance area outside the
resonance area, a bonding pad is arranged on the non-resonance area, a bonding layer covers the surface of an additionally provided carrier plate
wafer, a
barrier layer is manufactured above the bonding layer, and the
barrier layer is arranged on the surface of the carrier plate
wafer. An alignment structure is formed on an
enclosure layer or a non-resonance area, the position of the alignment structure corresponds to a bonding pad, a filter
chip is attached to a carrier plate
wafer in an alignment mode through the alignment structure so as to form a first cavity above a resonance area, and the back face and the side face of the filter
chip and the back face and the side face of the
enclosure layer are covered with a plastic
package layer. And removing the carrier wafer and the bonding layer, manufacturing a protective layer on the
enclosure layer, and arranging a
metal connecting structure and a
solder ball through a first through hole in the protective layer and the alignment structure. According to the invention, the problems of offset of fan-out packaging of the filter chip and LT wafer
cracking can be solved, the mold pressing resistance of the cavity structure is effectively enhanced, the production cost is reduced, and ultrathin packaging is realized.