2results about How to "Reduce sample preparation costs" patented technology

This application relates to the field of semiconductor technology and provides a method for preparing and analyzing high-power bare chip failure analysis samples. The method includes: fixing the back surface of the high-power bare chip under test to the patch area of ​​a carrier substrate; wire bonding the functional electrode area on the amorphous back surface of the chip to the lead pads of the carrier substrate; preparing a polymer encapsulation layer on the amorphous back surface to obtain a molded high-power bare chip; peeling the molded high-power bare chip from the patch area of ​​the carrier substrate; grinding, fine polishing, and thinning the back surface to obtain the target failure analysis sample; powering the target failure analysis sample by connecting the lead pads outside the back surface area; observing the back surface area of ​​the target failure analysis sample to determine the failure location. This application not only avoids high-power bare chips being broken down or burned by high voltage and high current in failure analysis scenarios, but also significantly improves the sample preparation efficiency and quality of high-power bare chip failure samples.

The invention discloses a section scanning electron microscope sample suitable for a metal micro guide wire and a preparation method of the section scanning electron microscope sample. Belongs to the technical field of material microscopic analysis. The preparation method comprises the following steps: fixing the metal micro guide wires by constructing conductive rigid clamps, filling conductive adhesives among the conductive rigid clamps, and arranging a plurality of metal micro guide wires among the conductive adhesives; the metal micro guide wires are exposed out of the two ends of the conductive rigid clamp by 0.5-1.5 cm; and the diameter of the metal micro guide wire is 45-500 microns. The invention provides a preparation scheme of a metal microwire section scanning electron microscope sample, which is simple to operate and does not need any large equipment, and provides a rigid and conductive support system capable of performing directional electrolytic polishing for a soft and fine metal wire on the premise of not introducing external stress, not polluting the sample and not using expensive equipment. Therefore, the scanning electron microscope samples are efficiently prepared in batches at low cost, and the high-resolution characterization requirement is met.