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38results about How to "Increase working current density" patented technology

Semi-solid flow cell

The invention discloses a semi-solid flow cell which is provided with a cell stack formed by parallel connection of one individual cell or multiple individual cells, wherein at least one of a positive pole electrolyte and a negative pole electrolyte comprises solid electrode particles to form an electrode suspension liquid; the surfaces of the solid electrode particles have catalytic activity; and active substances dissolved in the electrolytes can have an electrochemical oxidation or reduction reaction on the surfaces of the particles. Because the solid electrode particles can enlarge electrochemical oxidation area of the active substances in the electrolytes but not participate in the electrochemical oxidation, a current collector of the semi-solid flow cell does not need to have catalytic activity, so that the manufacturing cost is greatly reduced; and meanwhile, the solid electrode particles have good conductivity for collecting current generated in the electrochemical reaction, so as to form a conductive network. According to the invention, the work current density of the cell can be increased, the multiplying power performance of the cell can be improved, the size of a cell module is reduced, and the manufacturing cost of the cell can be lowered.
Owner:南京竞予能源有限公司

Silicon carbide trench type MOSFETs integrated with SBD and preparation method thereof

The invention provides a silicon carbide trench type MOSFETs integrated with an SBD and a preparation method thereof. A side wall gate electrode contact of the MOSFETs is located on the side wall of amain trench, a source electrode metal contact is formed at the bottom of the trench, and a Schottky metal contact is integrated. When a first quadrant is conducted forward, electrons flow from bottomto top through an inversion layer of the side wall of the trench, and a reverse conduction channel different from a conventional trench MOSFETs is formed. When a third quadrant is conducted forward,a Schottky diode is conducted at first, effectively inhibiting conduction of an in-vivo parasitic PN diode. During reverse blocking, a p-type shield layer at the bottom of the trench effectively shields a high electric field in a device body region, so that a device gate dielectric electric field and a Schottky contact electric field are greatly reduced, and an avalanche occurs at a PN junction ofthe device body region. The silicon carbide trench type MOSFETs integrated with an SBD has a low total chip area, satisfies good first and third quadrant conduction characteristics and reverse blocking abilities, and enables the static and dynamic reliability of a device to be improved.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Organic light emitting diode device and preparation method thereof, display substrate and display device

The application provides an organic light emitting diode device and a preparation method thereof, a display substrate and a display device. The organic light-emitting diode device comprises a substrate, an anode layer, an organic functional layer and a cathode layer, and the anode layer, the organic functional layer and the cathode layer are stacked on one side of the substrate; the organic functional layer comprises a first functional layer, a second functional layer and a light-emitting layer which are stacked, and the first functional layer is arranged close to the anode layer; the HOMO energy level of the second functional layer is deeper than the HOMO energy levels of the first functional layer and a light-emitting layer host material. According to the technical scheme, the second functional layer material with the relatively deep HOMO energy level is arranged; a hole blocking barrier is formed at the interface of the first functional layer 11 and the second functional layer 12 and thus the light-emitting efficiency of the organic light-emitting diode device under extremely low current is extremely low, so that the picture quality of an OLED under extremely low gray scale andlow brightness can be improved, the influence of leakage current on the picture quality can be reduced, and the problem of crosstalk between pixels is solved.
Owner:BOE TECH GRP CO LTD +1

Treatment device and method for organic high-concentration wastewater

The invention discloses a treatment device and method for organic high-concentration wastewater. The treatment device for the organic high-concentration wastewater comprises a machine body, a dreg scraping machine and a plurality of groups of electrochemical water treatment units, wherein the machine body is internally provided with a mud storage chamber, an electrochemical reaction chamber and awater inlet chamber; the water inlet chamber is arranged at the left lower part of the electrochemical reaction chamber; the water inlet chamber is communicated with the electrochemical reaction chamber; a water inlet is formed in the water inlet chamber; the plurality of groups of electrochemical water treatment units are arranged at the bottom of the electrochemical reaction chamber; the dreg scraping machine is mounted at the top in the machine body; the mud storage chamber is arranged at the left upper part of the machine body; the mud storage chamber is arranged at one side of the dreg scraping machine; a mud discharging opening is formed in the bottom of the mud storage chamber; a water outlet is formed in the bottom of the right end of the machine body. The treatment device disclosed by the invention is reasonable in design, scaling and blocking conditions on the surface of an electrode can be avoided, the treatment efficiency is higher and the treatment energy consumption is lower.
Owner:方达 +1

Shielded gate trench power device and manufacturing method thereof

The invention discloses a shield gate trench power device. A bottom dielectric layer and an inter-polysilicon isolation dielectric layer are formed in a deep trench of a gate structure, a region encircled by the inter-polysilicon isolation dielectric layer forms a source trench, a gate trench is formed in a region, on which self-alignment etching is performed, of the bottom dielectric layer arranged at a top of the deep trench, a gate dielectric layer is formed on a side surface of a top, corresponding to the deep trench, of the gate trench, a polysilicon gate is formed in the gate trench, source polysilicon is formed in the source trench, and the polysilicon gate and polysilicon of the source polysilicon are simultaneously formed. The invention also discloses a fabrication method of the shield gate trench power device. By the fabrication method of the shield gate trench power device, the threshold voltage of the device can be reduced, and meanwhile, the gate-source electric leakage of the device can be reduced; the process flow can be substantially simplified, so that the process cost is reduced; and the frequency characteristic can be improved, and the shield gate trench power device has relatively large working current density.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

A kind of integrated SBD silicon carbide trench mosfets and its preparation method

The invention provides a silicon carbide trench MOSFETs integrated with SBDs and a preparation method thereof. The side wall gate electrode contact of the MOSFETs is located on the side wall of the main trench, and the source electrode metal contact is formed at the bottom of the trench, and a Schottky metal contact is integrated. When the first quadrant is forward-conducting, electrons flow through the side of the trench from bottom to top The wall inversion layer forms a reverse conduction channel different from traditional trench MOSFETs; when the third quadrant is forward conduction, the Schottky diode is first to conduct, effectively suppressing the conduction of parasitic PN diodes in the body; reverse blocking When , the p-type shielding layer at the bottom of the trench effectively shields the high electric field of the device body region, so that the electric field of the device gate dielectric and the Schottky contact electric field are greatly reduced, and the avalanche occurs at the PN junction of the device body region. The silicon carbide trench MOSFETs integrated with SBDs have a lower total chip area, while satisfying good first and third quadrant conduction characteristics and reverse blocking capabilities, and the static and dynamic operating reliability of the device are improved. .
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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