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72results about How to "Increase output optical power" patented technology

Hybrid silicon-based whispering gallery mode microcavity laser

The invention discloses a hybrid silicon-based whispering gallery mode microcavity laser which adapts to a light source part of a silicon-based photonic integrated circuit. The hybrid silicon-based whispering gallery mode microcavity laser comprises a silicon-based waveguide part and an III-V semiconductor gain part. The III-V semiconductor gain part is formed on the silicon-based waveguide part. The silicon-based waveguide part is in an SOI (silicon-on-insulator) structure with silicon, silicon dioxide and silicon. The silicon-based waveguide part is made into a triangular, rectangular, circular or waveguide-coupled output form to allow for longitudinal mode control. The III-V semiconductor gain part made of gain material is bonded to the SOI structure directly and matches with the SOI structure to form evanescent field coupling output. The hybrid silicon-based whispering gallery mode microcavity laser has the advantages that single-mode output of laser source on a silicon-based semiconductor surface is achieved by a right-triangular, square or round whispering gallery mode microcavity, cavity surface need not be split, large-scale processing is facilitated, optical coupling output and single longitudinal mode operation are easy to implement, and the laser is simpler in process and higher in practicality than the conventional single-mode lasers.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Terahertz quantum cascade laser of multiple-mode interface structure and manufacturing method thereof

The invention relates to a terahertz quantum cascade laser of a multiple-mode interface structure. The terahertz quantum cascade laser comprises a multiple-mode interference wave guiding structure. The multiple-mode interference wave guiding structure comprises a semi-insulating substrate, a buffer layer, a lower contact layer, an active region, an upper contact layer and an upper metal layer in the perpendicular direction from bottom to top in sequence, wherein the active region, the upper contact layer and the upper metal layer form a ridge type structure on the lower contact layer; lower metal layers are arranged on the two sides of the ridge type structure; the upper metal layer forms a multiple-mode wave guide and output wave guides through the wet etching method; the output wave guides are single-mode wave guides and located at the centers of the two ends of the multiple-mode wave guide, and the width of each output wave guide is smaller than that of the multiple-mode wave guide. The invention further relates to a manufacturing method of the THz QCL. By the adoption of the THz QCL of the multiple-mode interface structure and the manufacturing method of the THz QCL, the light-emitting power of the THz QCL can be increased, the quality of an emitted light beam is not reduced, collection efficiency is not reduced, the device is kept small, and cost is reduced.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Flip-chip structure micro-size photonic crystal LED array chip and preparation method thereof

The invention discloses a flip-chip structure micro-size photonic crystal LED array chip and a preparation method thereof. The LED array chip of the invention has four light emitting units connected in parallel, the metal connecting line of the positive electrode and the semiconductor material are separated by a dielectric insulation layer, and the negative electrode is directly covered on the upper surface of the semiconductor material. The active region of the light-emitting unit has a photonic crystal with periodic distribution, and the depth of the photonic crystal exceeds the depth of theactive layer. Except electrode pad, DBR is distributed on the whole chip surface. Metal electrodes form metal mirrors. The preparation method of the invention adopts the scheme that an ohmic contactlayer and an electrode are firstly prepared and then a photonic crystal is etched without planarizing and the like traditional process flow; Using thick strip dielectric insulating layer to insulate the electrode from semiconductor material and thin dielectric mask layer and adhesive mask layer to etch together is conducive to the deposition of DBR and the rapid escape of photon mode. The processflow of the invention is simple and reliable.
Owner:SOUTH CHINA UNIV OF TECH

Optical module

The invention discloses an optical module. The optical module comprises a tube shell, a light emitting assembly, a light receiving assembly, a light emitting interface and a light receiving interface,the light emitting assembly and the light receiving assembly are arranged in the tube shell, the light emitting interface and the light receiving interface are arranged on the tube shell, an output optical fiber is arranged on the side of the light emitting assembly, and an input optical fiber is arranged on the side of the light receiving assembly; the output optical fiber is wound around the light emitting assembly and the light receiving assembly and then is connected with the light emitting interface; the input optical fiber is wound around the light emitting assembly and the light receiving assembly and then is connected with the light receiving interface. The light receiving assembly and the light emitting assembly are flexibly connected with the corresponding interfaces through theoptical fibers, so that the coupling difficulty is reduced, and the light receiving assembly and the light emitting assembly can be placed flexibly. Attenuation of the optical module is mainly generated by the optical fiber, attenuation generated by optical port pressure in an optical port integration scheme is avoided, attenuation can be reduced, and output optical power and receiving sensitivity are improved.
Owner:WUHAN ACCELINK TECH CO LTD

Electro-optical modulation device

An electro-optic modulation device provided by the present invention includes a semiconductor laser, a collimator, a polarizer, a driving source module, an electro-optic modulation crystal, and a polarizer. This device is mainly aimed at the 800nm ​​band, the modulation rate is 100Mbps to 500Mbps, and the maximum optical power output is greater than 0.5w. The semiconductor laser is connected to the collimator through an optical fiber. The laser light passing through the collimator becomes polarized light after passing through the polarizer. The polarized light is modulated after passing through the electro-optic modulation crystal. Use the unit. The external signal source and the driving source module are connected with a high-frequency coaxial cable, the external signal source provides a high-frequency, high-power square wave AC signal for the driving source module, and the electro-optical modulation crystal and the driving source module are connected by a high-frequency coaxial The cable is connected, the output signal of the driving source module is sent to the electro-optic modulation crystal through the high-frequency coaxial cable and the traveling wave electrode, and the optical feedback signal of the electro-optic modulation crystal realizes the real-time control of the static working point.
Owner:GUILIN TRYIN TECH CO LTD

Asymmetrically-structured phase-shifting grating and DFB (distributed feedback) semiconductor laser

The present application discloses an asymmetrically-structured phase-shifting grating and a DFB (distributed feedback) semiconductor laser. The phase-shifting grating comprises a phase-shifting structure, a first grating and a second grating, wherein the phase-shifting structure is located at the non-center position of the phase-shifting grating, and the first grating and the second grating are located at two sides of the phase-shifting structure; the etching depth of the first grating is equal to the etching depth of the second grating; the grating duty ratio of the first grating is equal tothe grating duty ratio of the second grating, or the sum of the grating duty ratios of the first grating and second grating is equal to 1; the length of the first grating is different from the lengthof the second grating; two sides in the first grating and the second grating, which are adjacent to the phase-shifting structure, are a first chirp grating and a second chirp grating respectively; thefirst chirp grating and the second chirp grating are symmetrically distributed along the phase-shifting structure; and the grating period of the first chirp grating and the second chirp grating gradually changes along the direction of the phase-shifting structure. With the asymmetrically-structured phase-shifting grating of the invention adopted, the asymmetric output of optical power can be realized, so that the output optical power of the laser can be improved; and refractive index modulation near the phase-shifting structure can be decreased, and therefore, the influence of a spatial hole-burning effect can be effectively reduced, and the single-mode stability of the laser can be improved.
Owner:INNOLIGHT TECHNOLOGY (SUZHOU) LTD

Bragg grating external cavity semiconductor laser module beam combining device

The invention relates to a Bragg grating external cavity semiconductor laser module beam combining device, and the device comprises at least one light emitting module; the light emitting module comprises at least two light emitting units; at least one conduction optical fiber which is arranged on an output light path of the light-emitting module; a Bragg grating is arranged on an output light pathof the conduction optical fiber, the Bragg grating and the output end of the light-emitting module form an outer cavity, laser output through the conduction optical fiber vertically enters the incident end face of the Bragg grating, part of the laser is transmitted to serve as output light to be output, and part of the laser is reflected to serve as feedback light to return into the light-emitting module along the original path to achieve wavelength locking. An outer cavity is formed by one Bragg grating and a plurality of light-emitting modules, so that the cost of the beam combining deviceis reduced. The Bragg grating only feeds back part of light beams perpendicular to the incident end face, the output light power is improved, the light intensity fed back by the Bragg grating is ensured by limiting the core diameter of the conduction optical fiber and the distance between the conduction optical fiber and the Bragg grating, and a better locking effect is achieved.
Owner:SUZHOU EVERBRIGHT PHOTONICS CO LTD +1

Mixed silicon single mode annular cavity laser based on microstructural silicon waveguide frequency selection

The invention discloses a mixed silicon single mode annular cavity laser based on microstructural silicon waveguide frequency selection, comprising a silicon substrate, a silicon dioxide layer formed on the silicon substrate, a silicon annular waveguide layer formed on the silicon dioxide layer, a bonding buffer layer formed on the silicon waveguide layer, an N type contact layer formed on the bonding buffer layer, an N type electrode formed in the middle on the N type contact layer, an annular quantum well active region formed in an annular part of the N type electrode on the N type contact layer, a P type annular contact layer formed on the annular quantum well active region, a P type annular cover layer formed on the P type annular contact layer and a P type electrode formed on the P type annular cover layer. The structure is in high density integration, single longitudinal mode working and high-efficiency coupling outputting; and more importantly, according to the mixed silicon single mode annular cavity laser disclosed by the invention, technological steps of conventional DFB distributed feedback grating manufacturing, III-V group material secondary epitaxy and the like are saved in technological processing, and the complexity is lowered.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Asymmetric micro-cavity edge emitting semiconductor laser array

The invention discloses an asymmetric micro-cavity edge emitting semiconductor laser array, and belongs to the technical field of semiconductor lasers. An existing semiconductor laser stack array faces multiple technical problems in beam shaping and output coupling. According to the asymmetric micro-cavity edge emitting semiconductor laser array, laser single tubes forming the laser array are asymmetric micro-cavity edge emitting semiconductor lasers; a front row of laser linear arrays and a back row of laser linear arrays are located on the same substrate; in the front row of the laser lineararrays, the 3-4 laser single tubes are linearly arranged according to the same geometric center distance; in the back row of the laser linear arrays, the 2-4 laser single tubes are linearly arrangedaccording to the same geometric center distance; the geometric center distance of each laser single tube in the front row of the laser linear arrays is the same as the geometric center distance of each laser single tube in the back row of the laser linear arrays; the laser single tubes are same in light-emitting direction, and are forward; and an optical axis of light emitted by each laser singletube in the back row of the laser linear arrays is away from the geometric center of the closest laser single tube in the front row of the laser linear arrays for 1/2 of the geometric center distance.
Owner:CHANGCHUN UNIV OF SCI & TECH

Electrically pumped random laser device based on dual SiO2-ZnO structure and preparation method and application thereof

The invention provides an electrically pumped random laser device based on a dual SiO2-ZnO structure and a preparation method and application thereof. The electrically pumped random laser device comprises a first ZnO thin film, a first SiO2 thin film, a second ZnO thin film, a second SiO2 thin film and a semi-transparent electrode which are sequentially deposited on the front face of a silicon substrate from bottom to top, wherein an ohmic contact electrode is deposited on the back face of the silicon substrate. The invention also provides a preparation method of the laser device. The preparation method comprises the following steps of: 1) depositing the first ZnO thin film on the front face of the silicon substrate; 2) depositing the first SiO2 thin film on the first ZnO thin film; 3) depositing the second ZnO thin film on the first SiO2 thin film; 4) depositing the second SiO2 thin film on the second ZnO thin film; 5) sputtering the semi-transparent electrode on the second SiO2 thin film, and sputtering the ohmic contact electrode on the back face of the silicon substrate, thus obtaining the electrically pumped random laser device based on the dual SiO2-ZnO structure. According to the electrically pumped random laser device based on the dual SiO2-ZnO structure, the threshold current of is obviously reduced and the light output power is obviously improved. Moreover, the preparation method is simple, can be compatible with the conventional complementary metal oxide semiconductor (CMOS) process and is favorable for large-scale production and application of devices.
Owner:ZHEJIANG UNIV
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