This invention relates to the field of advanced
semiconductor process testing and
failure analysis, and discloses a sample vacuum storage and transfer device, including a vacuum transfer box, a sealed door at the front end of the vacuum transfer box connected by a hinge, and a sample carrying mechanism disposed within the inner cavity of the vacuum transfer box. The sample carrying mechanism includes an anti-
contamination component, a positioning component, an opening and closing component, a sealing docking module, an environmental control module, and a status recording module. The anti-
contamination component is disposed within the inner cavity of the vacuum transfer box and includes an anti-
contamination cover. By setting up the anti-contamination component and multiple sealing structures, full-
enclosure protection is achieved from both the inner and outer
layers. Combined with the vacuum transfer box and the front sealed door to form an integral sealed cavity, it can effectively isolate external air, dust,
moisture, and other interference factors. For easily oxidized and
highly sensitive samples in the
semiconductor field, it avoids problems such as oxidation and surface adsorption of impurities during sample storage and transfer.