48results about How to "No change in shape" patented technology

The invention relates to a main heat exchange component in various high-temperature heat treatment furnace bodies such as a carburizing furnace, a fluorating furnace and the like in the field of steel manufacturing, in particular to a method for manufacturing a radiant tube with long service life and high temperature resistance. The method comprises the following steps of: A, mixing raw materialsin percentage by weight: 45 to 65 percent of silicon carbide, 20 to 30 percent of monocrystalline silicon, 10 to 20 percent of carbon black, 3 to 5 percent of polyving akohol and 0.3 percent of wool grease uniformly, and adding water to prepare paste; B, injecting the paste raw materials into a die for molding by adopting a solid slip casting method; C, demoulding a molded green body for drying; D, putting the dried green body into a vacuum furnace, raising the temperature to 180 DEG C, and performing vacuum reactive sintering to manufacture a main body of the silicon carbide heat exchanger; and E, sleeving the sintered main body of the heat exchanger outside a guiding pipe, and sleeving an outer pipe outside the main body of the heat exchanger. Products prepared by the method have the advantages of high strength and hardness, high temperature resistance, corrosion resistance, good thermal shock resistance and superior antioxidation performance.

The invention provides a method for molding a wafer-level glass device by using a micro mold, which comprises the following steps: etching a polished silicon wafer by a micro-electronic processing technique to form a mold deep cavity with a specific structure, bonding the silicon wafer with a Pyrex7740 glass wafer under the vacuum environment so that the mold deep cavity with the specific structure on the silicon wafer forms a sealed cavity, heating the two bonded wafers under one atmospheric pressure, carrying out hot molding, forming a microstructure corresponding to the mold deep cavity with the specific structure by the softened glass due to internal and external pressure difference of the cavity, cooling the wafers, annealing the wafers and relieving stress, chemically and mechanically polishing the glass back of the thermally annealed bonding sheets, planishing the glass back of the bonding sheets, and removing a silicon mold layer by a single-side corrosion method. The method can prepare the glass microstructure with large height-width ratio (more than 50:1), has low cost, and has important application in the fields of micro-fluid device, MOEMS and the like.

The invention relates to polycarbonate and polymethyl methacrylate laminating adhesive resin, a preparation method and application thereof. The polycarbonate and polymethyl methacrylate laminating adhesive resin comprises a component A and a component B, wherein the component A is an NCO-terminated polyurethane prepolymer; the component B comprises hydroxyl acrylic resin, first polyol, transparentmicrospheres and an auxiliary agent; the molar ratio of isocyanate groups in the component A to hydroxyl groups in the component B is 0.9 to 1.3. The adhesive resin not only can be well adhered to polycarbonate and polymethyl methacrylate, but also can guarantee optical properties of an adhered laminated component.