48results about How to "No change in shape" patented technology

The invention relates to a CuO-NiO/rGO composite material with efficient electro-catalysis oxygen reduction performance, and belonging to the technical field of electro-catalysis materials. In the CuO-NiO/rGO composite material provided by the invention, CuO-NiO nanoparticles are attached to a reduction-oxidized graphene sheet layer, a mass ratio of the CuO-NiO nanoparticles to the rGO is 100:3-5, the sizes of the CuO-NiO nanoparticles are 6-10nm, and the reduction-oxidized graphene sheet layer is a single sheet layer; and the electro-catalysis oxygen reduction performance is provided. Compared with existing oxygen reduction reaction catalysts, the CuO-NiO/rGO composite material provided by the invention is significantly reduced in cost, and is the oxygen reduction reaction catalyst with low price and excellent electro-catalysis oxygen reduction performance. The CuO-NiO/rGO composite material provided by the invention adopts copper salts, nickel salts, hydroxides and oxidized graphene as materials, deionized water and absolute ethyl alcohol as solvents, and glycol as a dispersing agent and a reducing agent, and is synthesized by using a one-pot hydrothermal method. The CuO-NiO/rGO composite material provided by the invention is low in material price, prone to get materials, simple and easy in preparation operation, simple in aftertreatment process, prone to control reaction parameters, short in flow and low in energy consumption.

The invention relates to an elastic facial mask cloth, which is manufactured by adopting a spunlaced nonwovens processing technique by a direct web formation method. The elastic facial mask cloth is characterized by containing composite ultrafine chopped fiber, absorbent cotton and bamboo fiber. (First), the composite ultrafine chopped fiber is split into 16 or more than 16 fine denier fibers withtiny diameters from the original one fiber part after being punctured at a high pressure by a spunlace processing technique, the fine diner fibers are adhered to each other, and after the spunlance high-pressure puncturing, the fibers are woven with the fibers and the fine denier fibers in a three-dimensional and staggered mode to form a three-dimensional netlike structure of a tight structure. Afacial mask manufactured by soaking the facial mask cloth in hygroscopic water and facial make-up liquid by a spunlace process of the direct web formation method has an unchanged shape. The facial mask of the same model can be suitable for people of different facial forms after being stretched; and the elastic facial mask cloth also has a certain elastic recoverability and strong comfortable pasting feeling, tightens and relaxes along with a face, generates tightening feeling to the face, and enhances the continuous infiltration and absorption of the facial make-up liquid.

The invention discloses a method for packaging a glass-silicon wafer-grade chiponboard (COB) of a light emitting diode (LED). The method comprises the following steps: 1, etching a silicon micro slot array with the micro slots communicated with each other through micro channels, and placing a proper amount of heat outgas agent in the micro slots; 2, performing anodic bonding on the Si wafer with patterns and the heat outgas agent and borosilicate glass wafer in air or in vacuum to form a sealed cavity; 3, heating and preserving heat to form a spherical glass micro cavity, cooling the cavity to normal temperature, annealing and removing silicon to obtain a wafer-grade glass micro cavity; 4, preparing a lead substrate; 5, mounting a chip and leading a wire; 6, carrying out wafer-grade bonding; and 7, filling silica gel to realize the wafer-grade packaging of the LED. By achieving the integration with the wafer-grade LED reflecting cup, the method reduces heat resistance and cost.

The invention discloses CuInS2/ZnS core-shell quantum dots and a preparation method thereof. The method comprises the following steps: in an inert gas atmosphere, heating a prepared zinc precursor to 200-270 DEG C, injecting CuInS2 quantum dots into the zinc precursor, reacting for 5-120 minutes, and stopping heating; and after the reaction solution is cooled to room temperature, repeatedly dissolving and precipitating the product, and carrying out centrifugation purification to obtain the CuInS2/ZnS core-shell quantum dots. The environment-friendly CuInS2 alloy quantum dots are converted into the CuInS2/ZnS core-shell quantum dots by the cation exchange technique, thereby implementing the use of the no heavy metal Cd. The composition and crystal lattice of the CuInS2/ZnS core-shell quantum dots can be completed by previously designing the composition and crystal lattice of the CuInS2 quantum dots. In the cation exchange process, the shape and size of the alloy quantum dots are not changed.

The invention discloses a preparation method of an experimental system on a micro-runner grid sheet of a focusing ultrasonic transmitter integrated with spherical glass cavity, comprising the steps of: 1, preparing a spherical glass micro-cavity or a cylindrical micro-runner by a thermal forming method; 2, integrating vibration and excitation sources such as a metal strip on the prepared spherical glass micro-cavity or cylindrical micro-runner; 3, placing biological cells or molecules in the experimental system on the glass micro-runner grid integrated sheet with the excitation sources; and 4, treating the biological cells or molecules by the experimental system on the integrated sheet. The invention generates resonance with frequency which is 20kHz-1MHz based on the glass sphere cavity under external electric excitation or electromagnetic excitation. The frequency range of the resonance frequency is ultrasonic range. Cavitation effect generated by ultrasonic wave can be applied to micro-treatment in the field of biology or chemistry, such as cell disruption and DNA interruption and the like.

The invention discloses a positive pressure thermoforming manufacturing method of a wafer-level glass micro-channel, which comprises the following steps of: 1. etching a specific silicon micro-channel shallow slot pattern on a Si wafer by utilizing a Si microprocessing process; 2. locally placing a proper amount of high-temperature gas releasing agent at both ends or a specific position of a silicon micro-channel; 3. bonding the Si wafer and a Pyrex7740 glass wafer to enable a shallow slot on Pyrex7740 glass to form a sealed cavity body; and 4. heating the bonded wafers to the temperature of 810-890 DEG C in air, preserving heat for 5-10 minutes, releasing gas by the high-temperature gas releasing agent due to heating, generating a positive pressure to enable molten glass corresponding to the sealed cavity body to deform and form a micro-channel pattern corresponding to the silicon micro-channel shallow slot pattern on the glass, and cooling to obtain the wafer-level glass micro-channel. In the invention, the gas is released by utilizing the high-temperature gas releasing agent, so that the glass can be in the shape of a hemispherical arc pipe to form the glass micro-channel.

The invention provides a method for packaging a wafer level solid-state image sensor. The method comprises the following steps of: etching a microgroove ring array on a silicon wafer to obtain a silicon wafer mold; bonding a boron silicon glass wafer and the silicon wafer mold under vacuum conditions so as to seal the microgroove rings of the silicon wafer mold; heating the bonded wafer to a temperature above a glass softening point and keeping the temperature for a certain period of time, molding the softened glass to obtain a glass bulge loop through atmosphere of an external environment, cooling to solidify the glass and annealing; removing the silicon wafer mold to obtain a glass wafer with a glass bulge loop and a planar optical window; and after alignment, adhering the glass bulge loop and the planar optical window at an end of the glass bulge loop through an adhesive to seal the solid-state image sensor, and obtaining the packaged solid-state image sensor through a back thinning process. The method has the characteristics that: the method has a simple process flow, low cost, controllable height, high degree of parallelism and high yield.

The invention relates to a standard substance for calibrating a PM2.5 cutter. The standard substance is composed of 8 kinds of spherical particles, the aerodynamic normal diameters Dae of the 8 kinds of spherical particles are 1.5 micrometers, 2.0 micrometers, 2.2 micrometers, 2.5 micrometers, 2.8 micrometers, 3.0 micrometers, 3.5 micrometers and 4.0 micrometers, and the spherical particles are spherical monodisperse crosslinking standard polystyrene particles. The standard substance is prepared through the following steps that a dispersing agent is dissolved in a mixed solution of ethyl alcohol and deionized water to serve as a water phase, and an initiating agent and a crosslinking agent are dissolved in styrene to serve as an organic phase; the organic phase is added into the water phase, and after the mixture is stirred to be uniform, an emulsion sample in obtained; the emulsion sample is washed with ethyl alcohol and deionized water in a centrifugation mode respectively, then centrifugal classification is carried out, and the standard substance for calibrating the PM2.5 cutter is obtained. The relative standard deviations of the prepared standard particles are smaller than 2%, the degrees of sphericity of the prepared standard particles are larger than 0.95, and the prepared standard particles have good degree of sphericity, monodispersity and stability and can be completely suitable for detection and calibration of the PM2.5 cutter.

The invention relates to a main heat exchange component in various high-temperature heat treatment furnace bodies such as a carburizing furnace, a fluorating furnace and the like in the field of steel manufacturing, in particular to a method for manufacturing a radiant tube with long service life and high temperature resistance. The method comprises the following steps of: A, mixing raw materialsin percentage by weight: 45 to 65 percent of silicon carbide, 20 to 30 percent of monocrystalline silicon, 10 to 20 percent of carbon black, 3 to 5 percent of polyving akohol and 0.3 percent of wool grease uniformly, and adding water to prepare paste; B, injecting the paste raw materials into a die for molding by adopting a solid slip casting method; C, demoulding a molded green body for drying; D, putting the dried green body into a vacuum furnace, raising the temperature to 180 DEG C, and performing vacuum reactive sintering to manufacture a main body of the silicon carbide heat exchanger; and E, sleeving the sintered main body of the heat exchanger outside a guiding pipe, and sleeving an outer pipe outside the main body of the heat exchanger. Products prepared by the method have the advantages of high strength and hardness, high temperature resistance, corrosion resistance, good thermal shock resistance and superior antioxidation performance.

The invention discloses a pair of guide wire fixing pliers comprising pliers handles, a pliers shaft and pliers heads. Each pliers head includes a guide wire through hole, a guide wire clamping plateand a rubber buffer pad. The guide wire through hole is defined by half-cylindrical portions of the two pliers heads. A plurality of point-shaped protrusions are evenly arranged on the pliers clampingsurface of the guide wire clamping plate and used for fixing and winding a guide wire. The rubber buffer pad covers the pliers clamping surface of the guide wire clamping plate, and a plurality of small holes are formed evenly in the rubber buffer pad. The point-shaped protrusions on the pliers clamping surface pass through the small holes in the rubber buffer pad and are exposed out of the rubber buffer pad. The pliers heads drive the guide wire clamping plate of the rubber buffer pad to clamp the guide wire, can be simultaneously fixed on a surgical drape, and are used for fixing and the winding the guide wire when required in an operation, to protect the guide wire from displacement and sliding; the guide wire through hole in the pliers head can fix the guide wire on the surgical drape, at the time the guide wire cannot be horizontally shifted, the sliding of the guide wire is effectively prevented, and longitudinal advancement and retreatment and axial torsion can be performed without affecting the operation of an operator.

The invention discloses a web arch structure reinforced by a frame type reinforcing structure, which comprises a web arch. The web arch is provided with a reinforcing structure, the reinforcing structure comprises a longitudinal rib and a diaphragm plate, the longitudinal rib is poured at the arch top part of the inner side of the web arch along the longitudinal direction of the web arch, and the diaphragm plate is fixedly poured at the inner side of the web arch along the spanning direction of the web arch, and the diaphragm plate and the longitudinal ribs are poured and connected into a whole to form a space reinforcing frame structure of the web arch. A reinforced space frame structure is formed, and the resistance of the web arch structure for resisting various load effects is obviously improved; the main reinforcing steel bars of the reinforced diaphragm plate can effectively restrain the opening deformation of the web arch under load and prevent the expansion of the midspan vertical crack of the web arch; construction is relatively easy and convenient, compared with a reinforced concrete reinforced web arch, the material consumption and the dead weight of the reinforced structure are remarkably reduced, the better reinforcing effect is achieved, damage to the original web arch caused by reinforcing embedded steel bars is reduced, and on-site reinforcing construction operation is remarkably reduced; and compared with sticking of carbon fibers or steel plates, the web arch reinforcing effect is remarkably improved.

The invention discloses an adhesive film cutting device for a wafer. The adhesive film cutting device for the wafer structurally comprises a machine body, sliding blocks and a portal frame. Considering the problem that since the portal frame moves on the top of a cutting table and drives surrounding airflow to flow, the edge of an adhesive film is prone to floating upwards under the action of the airflow, a rotating ring in a limiting mechanism makes contact with the surface of the edge of the adhesive film along with movement of the portal frame, the rotating ring presses downwards and smooths the edge of the adhesive film, the phenomenon that the adhesive film on the edge of the cutting table floats upwards under the action of airflow is reduced, the phenomenon that the edge of the adhesive film is wrinkled is reduced, the cut shape of the adhesive film keeps unchanged beneficially, the adhesive film is matched with the surface size of a wafer, and the adhesive film can be normally used for covering the surface of the wafer. Considering the problem that since adhesive film fluid is attached to the outer wall of the rotating ring, the phenomenon that the adhesive film rotates along with the rotating ring under the action of adsorption force of the fluid is prone to happen, the adhesive film fluid on the outer wall of the rotating ring is removed through a scraping plate in a matching block, so that the outer wall of the rotating ring can be kept clean.