38results about How to "Not easy to heat" patented technology

The invention discloses a method for preparing a biochar-base fertilizer from cotton straws, which comprises the following steps: 1. preparing cotton straw biochar from cotton straws; 2. pulverizing gypsum, bentonite and cotton straw biochar, respectively passing the gypsum and bentonite through a 100-mesh screen, and passing the cotton straw biochar through a 40-mesh screen; 3. mixing 16-19 parts of weight of ammonium phosphate, 7-9 parts of weight of urea, 7-9 parts of weight of potassium sulfate, 1-2 parts of weight of zinc sulfate, 1-2 parts of weight of boric acid, 7-9 parts of weight of nitrohumic acid, 30-40 parts of weight of cotton straw biochar, 7-12 parts of weight of gypsum and 7-12 parts of weight of bentonite together, and stirring uniformly to obtain a fertilizer mixture; 4. carrying out primary granulation on the fertilizer mixture with a rotating drum granulator, and carrying out reshaping granulation with a disk granulator to obtain fertilizer granules; and 5. drying the fertilizer granules with a drying machine to obtain the biochar-base fertilizer.

The invention describes a heat dissipation module, which comprises a housing, an airflow generator, a heat sink and a deflector. The housing has a cover portion which is provided with a through hole. The airflow generator is arranged in the housing, and has an air outlet and an air inlet. The heat sink is provided at the air outlet, and has a surface facing the cover portion. The deflector is provided in the housing to construct a passageway between the surface and the cover portion. The passageway has a first port and a second port. The first port corresponds to the through hole, while the second port corresponds to the air inlet. The heat dissipation module of the invention is capable of enabling the cover portion of the housing and the heat sink to be thermally isolated by providing cold air therebetween, enabling the cover portion not to be easily heated by the heat sink, and also ensuring the air that enters the airflow generator is the air from the outside of the housing. Therefore the heat dissipation module is able to prevent a too hot discomfort from occurring on the cover portion, and also to enhance the efficiency of the airflow generator that dissipates a heat from the heat sink.

The invention belongs to the industrial-grade powder rapid manufacturing molding related technology field and discloses spray printing equipment suitable for selective melting molding under a wide temperature gradient. The spray printing equipment comprises an upper cover body, a lower cover body, a powder laying component, a spray printing component and a heating component, wherein the spray printing component and the heating component are connected, and the upper cover body is connected with a powder laying base plate to form a closed space used for containing components; the heating component includes a first directional heat radiator, a second directional heat radiator and a heating roller module; and the first directional heat radiator and the second directional heat radiator are connected to the upper cover body and are used for heating a powder in a powder laying area and the powder in a working area so as to heat the powder to be in a glassy state; the heating roller module isconnected to the spray printing component and the powder in the working area is compacted and is further heated at the same time, and a part, sprayed to an adhesive, of the powder in the working areais melted and cured. Precision is improved, forming quality is good, and applicability is high.

The invention provides a semiconductor structure forming method. The method comprises the steps of providing a substrate; forming an opening in the substrate; forming a stress layer in the opening; forming an initial covering layer on the surface of the substrate and the surface of the stress layer, wherein the material of the initial covering layer is composed of an amorphous semiconductor material; converting the part of the initial covering layer, that is positioned on the surface of the stress layer, into a covering layer through the crystallization process, wherein the material of the covering layer is composed of a crystalline semiconductor material; and removing the initial covering layer that is not converted into the covering layer after the crystallization process. The formed semiconductor structure is good in morphology and stable in performance.

This invention provides a trivet and a glass top stove. An annular frame (9) is arranged on the trivet (7). The annular frame (9) is located below the upper edge of the trivet claws (8) and above the lower ends of the foot portions (8a) of the trivet claws (8), and is formed by a band-like plate extending up and down along the width direction. A plurality of trivet claws (8) are fixed to the annular frame (9) at the respective foot portions (8a) of the trivet claws. The combustion exhaust gas of the burner (3) flows through an upper space of the annular frame (9) and exits to the exterior. The secondary air flows smoothly from a lower space of the annular frame (9) along the glass top panel (1) to the burner part. The trivet of the invention separates the flow of the combustion exhaust ga s and the flow of the secondary air to enhance the combustibility of a burner and that is suitable for a glass top stove.

The invention discloses a packaging structure of an inverter IGBT module. Both the positive input terminal and the negative input terminal of the half-bridge IGBT module are on the lower surface of the chip, and buffer capacitors can be respectively connected to the positive and negative input terminal areas on the surface of the first insulating ceramic substrate. The surface is soldered to minimize the inductance of the IGBT module pins; the E pole of the upper half-bridge IGBT chip of the half-bridge IGBT module and the C pole of the lower half-bridge IGBT chip are both on the upper surface of the chip, which can be far away from the water cooling plate, thereby reducing the equivalent The parasitic capacitance can reduce the common mode interference current to the ground, and can improve the EMC performance of the inverter; the half-bridge IGBT modules of each phase can cancel the bonding wire, which improves the current capability and life, reduces the chip area, and reduces the cost of the inverter ; The electrical pins of the half-bridge IGBT modules of each phase are directly welded to the insulating ceramic substrate and the chip, and the positive input terminals, negative input terminals and phase output pins of the half-bridge IGBT modules of each phase are very close to each other, so that the outgoing wires of the inverter are short, The wiring is simple, and the internal cavity is not easily heated by copper bars.

The present invention provides a heater for preventing a carburetor from icing up. An air inlet passage 2 of a carburetor main body 1 is formed sideway, and the float chamber 6 on which a constant fuel liquid level X-X is formed with a float chamber main body 5 is arranged below the carburetor main body 1. An electric heater 13 is arranged on the float chamber main body 5, a longitudinal axial line A-A of the electric heater 13 is arranged roughly in parallel with the fuel liquid level X-X in the float chamber 6 as well as a longitudinal axial line Y-Y of the air inlet passage 2 and the electric heater is arranged in the neighborhood of the by-pass chamber 10. Thus, the present invention is capable of effectively warming a by-pass hole of the by-pass chamber and restraining fuel evaporation of fuel reserved in the float chamber.