This invention discloses a rapid, high-strength
microwave bonding method for ceramics and
cemented carbide, belonging to the field of
ceramic material bonding technology. The method includes the following steps: preparing a
metal solder;
grinding,
polishing, and cleaning the bonding surfaces of the
ceramic and
cemented carbide respectively; loading the prepared
metal solder into a mold and pressing it under
uniaxial pressure to obtain a
metal solder sheet; placing the
ceramic, metal solder sheet, and
cemented carbide in a stacked structure in a
microwave sintering furnace for
microwave sintering to achieve the bonding of the ceramic and cemented
carbide. Compared with traditional
brazing and
diffusion welding, this ceramic-cemented
carbide microwave bonding method increases the heating /
cooling rate by 6-10 times, improves the single-furnace bonding efficiency by 5-9 times, allows for
mass production, and yields ceramic-cemented
carbide bonding interfaces with high strength. This invention significantly improves production efficiency, reduces
energy consumption, and has widespread application value.