The invention discloses a method for preparing organosilicone
hybrid resin and a power type encapsulating material for light-emitting diodes (LED) thereof and application. According to the method, the organosilicone
hybrid resin containing three functional groups of an
epoxy group, a fluorin group and a
phenyl group is prepared by a cohydrolysis condensation method, and the content of each group in the resin is optimized by controlling the ratios of fluoro
alkyl silicane,
epoxy alkyl silicane and phenyl silicane, so that the resin is applied to the power type encapsulating material for the LEDs. The prepared encapsulating material has the advantages of
epoxy resin and organosilicone, has high performance of high light
transmittance and
refractive index, low hygroscopicity, high
mechanical property and
ageing-resistant performance and the like, and the problems of low light output rate, short service life and the like of the LEDs due to dropping caused by low
bonding strength and poor
mechanical property of the ordinary organosilicone material for encapsulating LEDs are solved. The method for preparing the organosilicone
hybrid resin and the power type encapsulating material for the LEDs is simple, and raw materials are readily available and environment-friendly; and the organosilicone hybrid resin can also be used as the raw materials to be applied to
processing and preparation of optical
lens materials, photovoltaic conversion materials,
integrated circuit encapsulating materials, insulating materials,
coating materials, adhesives and the like.