The invention provides a test module and a test device, a
capacitor assembly and a switch
assembly are both located in a frame
assembly, and the
capacitor assembly and the switch assembly are connected with a
semiconductor device to be tested. Wherein the switch assembly comprises a protection switch, and the protection switch is connected with the
capacitor assembly. In the direct-
current pulse capacitor discharging process, the protection switch can perform
overvoltage protection on the capacitor
bank, and damage to the tested
semiconductor device and the test module can be avoided. In other words, the test module provided by the invention is high in reliability. The switch
busbar is connected according to a device connection mode and
layout, the loop distance is short, the back-and-forth superposed parasitic
inductance is low, the
stray inductance is low, and the problem that the parasitic
inductance generates
voltage and current overshoot under the condition of
high current change rate is effectively solved. Therefore, the switch
busbar not only can meet the requirements of
voltage resistance, insulation and heat dissipation, but also can effectively improve the problems of turn-off
voltage peak, voltage and current
waveform distortion and the like, and reduces the voltage stress on a tested
semiconductor device.