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5results about How to "Cascading convenience" patented technology

Seawater Temperature, Salinity, and Depth Integrated Fiber Optic Sensor Based on Composite Microstructure and its Fabrication Method

This invention belongs to the field of fiber optic sensing technology, and discloses an integrated fiber optic sensor for seawater temperature, salinity, and depth based on a composite microstructure and its fabrication method. A single-mode fiber, a first coreless fiber, and a graded-index fiber are sequentially fused together to form a collimation structure for long-distance beam transmission. One end of the graded-index fiber is sequentially connected to a hollow-core fiber and a second coreless fiber. The core of the hollow-core fiber is filled with polydimethylsiloxane, located at the intersection of the cores of the graded-index fiber and the hollow-core fiber. The microsphere structure is divided into a cladding cavity and an air cavity from the outside to the inside. One end face of the second coreless fiber intersects with the air cavity and cladding cavity of the microsphere structure. Test results show that the integrated fiber optic sensor for seawater temperature, salinity, and depth based on the composite microstructure has the potential for integrated measurement of seawater temperature, salinity, and depth parameters.
Owner:NORTHEASTERN UNIV CHINA

Test module and test device

The invention provides a test module and a test device, a capacitor assembly and a switch assembly are both located in a frame assembly, and the capacitor assembly and the switch assembly are connected with a semiconductor device to be tested. Wherein the switch assembly comprises a protection switch, and the protection switch is connected with the capacitor assembly. In the direct-current pulse capacitor discharging process, the protection switch can perform overvoltage protection on the capacitor bank, and damage to the tested semiconductor device and the test module can be avoided. In other words, the test module provided by the invention is high in reliability. The switch busbar is connected according to a device connection mode and layout, the loop distance is short, the back-and-forth superposed parasitic inductance is low, the stray inductance is low, and the problem that the parasitic inductance generates voltage and current overshoot under the condition of high current change rate is effectively solved. Therefore, the switch busbar not only can meet the requirements of voltage resistance, insulation and heat dissipation, but also can effectively improve the problems of turn-off voltage peak, voltage and current waveform distortion and the like, and reduces the voltage stress on a tested semiconductor device.
Owner:CHINA ELECTRIC POWER RESEARCH INSTITUTE CO LTD

Small-size delay network based on SIP technology

PendingCN119602748AGuaranteed cooling effectGuaranteed rangeDelay linesTime-delay networksSession Initiation ProtocolLow noise
The invention provides a small-size delay network based on an SIP (Session Initiation Protocol) technology. The delay network comprises an amplifier, a delayer, a power divider, a switch and an equalizer, the radio frequency signal transmission sequence is as follows: four radio frequency input ends pass through four high-gain low-noise amplifiers; entering four delayers to complete the delay function of four branches; each path of radio-frequency signal is divided into two paths after passing through a single-pole two-throw switch, the two paths of radio-frequency signals are synthesized through a power divider, and the synthesized four paths of signals are selectively output through a single-pole two-throw switch; a delayer chip is arranged on the trunk; the radio frequency amplitude is compensated through an amplifier and an equalizer, and the whole delay network is arranged in a central symmetry mode. According to the invention, the radio frequency delay line chips are respectively arranged on the upper printed board and the lower printed board in the ceramic tube shell, the delay chips on the upper layer and the lower layer are interconnected through the solder balls, and the serial-to-parallel conversion chip and the delayer chip are directly bonded through the gold wire.
Owner:CHINA SHIPBUILDING IND CORP NO 723 RESEARCH INSTITUTE

Microwave tri-proof lamp

The utility model provides a microwave tri-proof lamp which comprises a microwave circuit, a setting switch, a driving module and a light source assembly and further comprises a lampshade, the first end of the lampshade is provided with a first shell, the second end of the lampshade is provided with a second shell, the ends, away from the lampshade, of the first shell and the second shell are each provided with a connecting port, and the connecting ports are connected with detachable end covers in a covering mode. A light source assembly is arranged in the lampshade, driving modules are arranged in the first shell and the second shell, the light source assembly is in communication connection with the driving modules, a microwave circuit is arranged on the driving module in the first shell, the microwave circuit is in communication connection with a microwave setting switch, and the microwave setting switch is arranged on the side, facing the connecting port, of the driving module. The microwave circuit and the setting switch are separately arranged on one of the driving modules, the size is reduced, and the setting switch is opposite to the connecting port, so that a user can conveniently open the end cover for self-adjustment; the driving modules are arranged in the shell on the two sides of the lampshade instead of being arranged on the back face of the light source assembly, so that the distance between the light source assembly and the light-transmitting face is increased.
Owner:AXG LIGHTING XIAMEN

A hybrid integrated millimeter wave coaxial radial triplexer

This application relates to the field of radio frequency microwave circuit technology and discloses a hybrid integrated millimeter-wave coaxial radial triode, including a first coaxial line, a dielectric substrate, three output circuits disposed on the dielectric substrate, and a second coaxial line. The output circuit includes a coaxial probe, an arcuate stripline, and a width-change-abrupt stripline connected in sequence, with at least one slot structure disposed on the arcuate stripline. This application utilizes a concentric arcuate stripline disposed inside the first coaxial line solely for transmitting excitation signals, and employs a circuit design on the arcuate stripline that enables the implementation of a bandpass filter structure. This allows the signal excited and coupled by the coaxial probe to be transmitted via the arcuate stripline to three signals of different specific frequency bands to a standard microstrip line connected outside the first coaxial line. This effectively improves upon the problem of the difficulty and large workload in designing common port impedance matching networks in traditional circuit structures.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA