The invention relates to the field of organic high-
polymer materials, and particularly provides a low-temperature-resistant high-
ductility anti-seepage
adhesive, and a preparation method and application thereof. The preparation method comprises the following steps: by using a
melamine formaldehyde resin as a main material and polyoxypropylene
triol as an NCO
prepolymer, carrying out reaction with a
polymer (TDI (
toluene diisocyanate) and / or MDI (methylenediphenyl diisocyanate)) under the action of a thixotropic agent (
silicon dioxide) and a
tin catalyst in the presence of
polypropylene glycol to form a uniform high-
polymer flexible material, and mixing with a filler to obtain the anti-seepage
adhesive which has the advantages of no
pollution, low
specific gravity, high
ductility, high deformation adaptability, favorable
corrosion resistance, favorable low-
temperature resistance, favorable freezing resistance and no water permeability. The anti-seepage
adhesive has the characteristics of favorable low-temperature flexibility, no crack at -30 DEG C, no water permeability, high stretching resistance (3.10 MPa) and high elongation percentage (1211%). The anti-seepage adhesive can effectively obstruct seepage of earthfill dams, earth water passages and the like, and is a novel synthetic soil
engineering anti-seepage material with wide market prospects.