1results about How to "Control etch rate" patented technology

The application relates to a glass substrate via hole method, a Mini-LED substrate and a device. The glass substrate via hole method comprises the following steps: providing a glass substrate, the glass substrate having opposite A and B surfaces; performing laser treatment on the A surface to form pre-penetration array dots, and performing film coating treatment on the B surface to form a protective film; and performing via hole treatment on the glass substrate by using a first etching solution containing HF and H2SO4 to form a via hole extending from the pre-penetration array dots on the A surface to the B surface. The via hole method provided by the application can form a large number of via holes with regular hole shapes, uniform hole diameters and high via hole rates on the glass substrate.