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32results about How to "Has radiation resistance" patented technology

Radio frequency SOI LDMOS device with close body contact

The invention relates to the field of a radio frequency power device, and discloses a radio frequency SOI LDMOS device with close body contact. The device comprises bottom layer silicon, an embedding oxidation layer, top layer silicon, a P region an N region, a gate oxidation layer, a polysilicon gate layer, a gate poly-silicide layer, a gate electrode, a silicon nitride side wall, an N drift region, a drain region, a drain region silicide layer, a drain electrode, a source region, a body contact region, a body region, a source region silicide layer and a source electrode. The radio frequency LDMOS device is manufactured on an SOI substrate, and forms the close body contact which is in short circuit with the source region by utilizing a heavily doped region in the same form as the P region; the source/body, a drain/body and the gate and the electrodes are interconnected by the silicide; a plurality of gate bars are connected in parallel in the forked mode so as to improve the driving capability of the device; a method for adjustment, back-gate injection, N region injection and N drift region injection, which is compatible with the CMOS process, is designed; and a method for hiding the silicide in the N drift region, which is compatible with the CMOS process, is designed.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

Radio frequency laterally diffused metal oxide semiconductor (LDMOS) device based on silicon on insulator (SOI) and method for injecting device

The invention discloses a radio frequency silicon on insulator(SOI) laterally diffused metal oxide semiconductor (LDMOS) device provided with a low potential barrier body lead-out, which comprises a bottom layer silicon, a concealed oxide layer, a top layer silicon, a P-region, a N-region, a gate oxide layer, a polysilicon gate layer, a gate polycrystalline silicon carbide layer, a gate electrode, a side wall, a N-drift region, a drain region, a drain region silicate layer, a leakage electrode, a source region, a low potential barrier body lead-out region, a body region, a source region silicide layer, and a source electrode. In the invention, the radio frequency LDMOS device is manufactured on an SOI substrate, and a low potential barrier body lead-out is in a short circuit with the source region is formed by utilizing a heavily doped region homotypic with the P- region; the source/body, leakage/ body as well as a gate is interconnected with each electrode by utilizing a silicide; a plurality of grate bars are in interdigital type parallel connection so as to enlarge the driving power of the device; and the invention provides a method for rectifying, back gate injection, N-region injection as well as N-drift region injection compatible with a complementary metal-oxide-semiconductor (CMOS) technology, as well as a N-drift region silicide conceal method compatible with the CMOS technology.
Owner:BEIJING ZHONGKE XINWEITE SCI & TECH DEV

Formula and preparation process for multifunctional surface treating agent applied to aqueous leather

InactiveCN108047906ARich touch and visual experienceImprove physical performanceFireproof paintsWax coatingsWaxChemistry
The invention discloses a formula for a multifunctional surface treating agent applied to aqueous leather. The formula comprises 3 to 35% of an aqueous polyurethane emulsion, 0.5 to 20% of a multifunctional finishing agent, 2 to 15% of aqueous wax, 0.3 to 3% of a leveling agent, 0.5 to 1.5% of a thickening agent, 0.5 to 1% of an antifoaming agent and 24.5 to 93.2% of water. The preparation processcomprises the following steps: adding all the above raw materials except the thickening agent into a container in proportion, carrying out uniform mixing through a dispersator, then carrying out filtering and adding the thickening agent to adjust viscosity so as to obtain the surface treating agent. The surface treating agent provided by the invention endows synthetic leather with special performances like antibacterial, sterilizing, anti-ultraviolet, anti-radiation, flame-retardant, temperature-adjusting, color-changing, self-cleaning and anti-doodling performances without any influence on the fastness and handfeel of the synthetic leather, and substantially prolongs the service life of the synthetic leather; a product having been treated with the surface treating agent has better handfeel and presents better visual impression; and the surface treating agent greatly improves the physical properties of the synthetic leather and allows the synthetic leather to have more excellent scrape resistance, water resistance, fire resistance and the like.
Owner:宋林涛

Method for manufacturing 50A high-current fast recovery diode

The invention discloses a method for manufacturing a 50A high-current fast recovery diode. The method for manufacturing the 50A high-current fast recovery diode comprises the steps that an N type semiconductor silicon material is provided to serve as a semiconductor substrate; the N type semiconductor substrate is doped with N+ type impurities; the N+ type impurity layer on one side of the semiconductor substrate is removed; an exposed N-type semiconductor material is doped with dual P+ type impurities; heavy metal platinum doping is conducted according to the high-temperature diffusion method; primary mask photoetching is conducted; glass powder is arranged in a passivation groove through knife coating, high-temperature sinter molding is conducted, and then PN junction glass passivation is completed; multiple metallization layers are manufactured on the two sides of a silicon wafer according to the vacuum sputtering method; secondary mask photoetching is conducted; the silicon wafer is divided into independent dies; a chip and a lead component are bonded together; the chip, the lead component and a diode holder are bonded together in a metallurgical mode through sintering; a diode cap and the diode holder are welded together in a sealed mode through percussion welding. According to the method for manufacturing the 50A high-current fast recovery diode, the manufacturing process based on the method is less influenced by the environment, the technology is mature, the stability and the repeatability are high, and the method can be widely used for volume production of high-current fast recovery diodes.
Owner:西安卫光科技有限公司

Anti-radiation wide-spectrum optical-fiber light source based on photo-bleaching

The invention discloses an anti-radiation wide-spectrum optical-fiber light source based on photo-bleaching. The optical-fiber light source is a multi-pump double-pass backward structure and adopts an erbium-doped photo crystal optical fiber as a gain medium. A tail fiber of a 980nm laser is in fusion connection with one end of a first wavelength division multiplexer; a tail fiber of a 810nm laser is in fusion connection with one end of a third wavelength division multiplexer; a tail fiber of a 665nm laser is in fusion connection with the third wavelength division multiplexer; the other two ends of the first wavelength division multiplexer are in fusion connection with a second optical spectrum filter and an erbium-doped photo crystal optical fiber; one end of the second wavelength division multiplexer is in fusion connection with the erbium-doped photo crystal optical fiber, and the other two ends of the second wavelength division multiplexer are in fusion connection with the first optical spectrum filter and the third wavelength division multiplexer; and a fiber leading-out end of the second optical spectrum filter is in fusion connection with a fiber leading-in end of an optical fiber isolator, and a fiber leading-out end of the optical fiber isolator is used as a light output end. Multiple special wavelength lasers are used for simultaneously pump to realize the effective photo-bleaching, so that the stability of the average wavelength and the output power of the erbium-doped optical fiber light source can be guaranteed under the space radiation environment.
Owner:BEIHANG UNIV

Radio frequency SOI LDMOS device with H-shaped gate

The invention relates to the field of radio frequency power devices, and discloses a radio frequency SOI LDMOS device with H-shaped gate. The device comprises bottom layer silicon, an embedding oxide layer, top layer silicon, a P region, an N region, an H-shaped gate oxide layer, an H-shaped polysilicon gate layer, an H-shaped gate poly-silicide layer, a gate electrode, a silicon nitride side wall, an N drift region, a drain region, a drain region silicide layer, a drain electrode, a source region, a body lead-out region, a source region silicide layer and a source electrode. The radio frequency LDMOS device is manufactured on an SOI substrate, and forms the body lead-out which is in short circuit with the source region by utilizing a heavily doped region in the same form as the P region; the source/body, a drain/body and the gate and the corresponding electrodes are interconnected by the silicide; and a plurality of gate bars are connected in parallel in the forked mode so as to improve the driving capability of the device. Simultaneously, the invention discloses a method for adjustment, back-gate injection, N region injection and N drift region injection, which is compatible with the CMOS process and a method for hiding the silicide in the N drift region, which is compatible with the CMOS process.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

Radiation-resistant high-performance silica fiber and preparation method thereof

The invention relates to a radiation-resistant high-performance silica fiber and a preparation method thereof. The radiation-resistant high-performance silica fiber provided by the invention is composed of a silica glass material based fiber core, an inner cladding and an outer cladding, wherein the fiber core contains 0-2000ppm of hydroxyl group and 0-1000ppm of fluorine, the inner cladding is doped with 10000-20000ppm of fluorine, and the outer cladding is silica glass containing 1000-6000ppm of fluorine. The radiation-resistant high-performance silica fiber provided by the invention can beprepared by adopting a combined process method of VAD (vapour axial deposition) and MCVD (modified chemical vapour deposition) or PCVD (plasma chemical vapour deposition), namely a core layer is prepared by adopting VAD firstly, and different deposition and vitrifaction technological conditions are controlled to obtain core rods with different hydroxyl group and fluorine contents, the inner cladding doped with fluorine is prepared by adopting an MCVD or PCVD process, a sleeve containing a low-refractive index inner cladding is obtained, and then the core rods and the obtained sleeve are fusedinto a prefabricated rod or combined into a prefabricated rod assembly, and finally direct wire drawing is carried out to obtain the silica fiber. The silica fiber can be used for information transmission of a communication system, especially can be used as both a radiation-resistant optical fiber to guarantee long-distance communication and an energy transmitting optical fiber for transmitting ultraviolet light under the radiation environment.
Owner:HANGZHOU FUTONG COMM TECH CO LTD +1

Radio frequency laterally diffused metal oxide semiconductor (LDMOS) device based on silicon on insulator (SOI) and method for injecting device

The invention discloses a radio frequency silicon on insulator(SOI) laterally diffused metal oxide semiconductor (LDMOS) device provided with a low potential barrier body lead-out, which comprises a bottom layer silicon, a concealed oxide layer, a top layer silicon, a P-region, a N-region, a gate oxide layer, a polysilicon gate layer, a gate polycrystalline silicon carbide layer, a gate electrode, a side wall, a N-drift region, a drain region, a drain region silicate layer, a leakage electrode, a source region, a low potential barrier body lead-out region, a body region, a source region silicide layer, and a source electrode. In the invention, the radio frequency LDMOS device is manufactured on an SOI substrate, and a low potential barrier body lead-out is in a short circuit with the source region is formed by utilizing a heavily doped region homotypic with the P- region; the source / body, leakage / body as well as a gate is interconnected with each electrode by utilizing a silicide; a plurality of grate bars are in interdigital type parallel connection so as to enlarge the driving power of the device; and the invention provides a method for rectifying, back gate injection, N-regioninjection as well as N-drift region injection compatible with a complementary metal-oxide-semiconductor (CMOS) technology, as well as a N-drift region silicide conceal method compatible with the CMOStechnology.
Owner:BEIJING ZHONGKE XINWEITE SCI & TECH DEV

A manufacturing method of a 50A high-current fast-recovery diode

The invention discloses a method for manufacturing a 50A high-current fast recovery diode. The method for manufacturing the 50A high-current fast recovery diode comprises the steps that an N type semiconductor silicon material is provided to serve as a semiconductor substrate; the N type semiconductor substrate is doped with N+ type impurities; the N+ type impurity layer on one side of the semiconductor substrate is removed; an exposed N-type semiconductor material is doped with dual P+ type impurities; heavy metal platinum doping is conducted according to the high-temperature diffusion method; primary mask photoetching is conducted; glass powder is arranged in a passivation groove through knife coating, high-temperature sinter molding is conducted, and then PN junction glass passivation is completed; multiple metallization layers are manufactured on the two sides of a silicon wafer according to the vacuum sputtering method; secondary mask photoetching is conducted; the silicon wafer is divided into independent dies; a chip and a lead component are bonded together; the chip, the lead component and a diode holder are bonded together in a metallurgical mode through sintering; a diode cap and the diode holder are welded together in a sealed mode through percussion welding. According to the method for manufacturing the 50A high-current fast recovery diode, the manufacturing process based on the method is less influenced by the environment, the technology is mature, the stability and the repeatability are high, and the method can be widely used for volume production of high-current fast recovery diodes.
Owner:西安卫光科技有限公司

Radio frequency SOI LDMOS device with close body contact

The invention relates to the field of a radio frequency power device, and discloses a radio frequency SOI LDMOS device with close body contact. The device comprises bottom layer silicon, an embedding oxidation layer, top layer silicon, a P<-> region an N<-> region, a gate oxidation layer, a polysilicon gate layer, a gate poly-silicide layer, a gate electrode, a silicon nitride side wall, an N<-> drift region, a drain region, a drain region silicide layer, a drain electrode, a source region, a body contact region, a body region, a source region silicide layer and a source electrode. The radio frequency LDMOS device is manufactured on an SOI substrate, and forms the close body contact which is in short circuit with the source region by utilizing a heavily doped region in the same form as the P<-> region; the source / body, a drain / body and the gate and the electrodes are interconnected by the silicide; a plurality of gate bars are connected in parallel in the forked mode so as to improve the driving capability of the device; a method for adjustment, back-gate injection, N<-> region injection and N<-> drift region injection, which is compatible with the CMOS process, is designed; and amethod for hiding the silicide in the N<-> drift region, which is compatible with the CMOS process, is designed.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

Radio frequency SOI LDMOS device with H-shaped gate

The invention relates to the field of radio frequency power devices, and discloses a radio frequency SOI LDMOS device with H-shaped gate. The device comprises bottom layer silicon, an embedding oxide layer, top layer silicon, a P<-> region, an N<-> region, an H-shaped gate oxide layer, an H-shaped polysilicon gate layer, an H-shaped gate poly-silicide layer, a gate electrode, a silicon nitride side wall, an N<-> drift region, a drain region, a drain region silicide layer, a drain electrode, a source region, a body lead-out region, a source region silicide layer and a source electrode. The radio frequency LDMOS device is manufactured on an SOI substrate, and forms the body lead-out which is in short circuit with the source region by utilizing a heavily doped region in the same form as the P<-> region; the source / body, a drain / body and the gate and the corresponding electrodes are interconnected by the silicide; and a plurality of gate bars are connected in parallel in the forked mode so as to improve the driving capability of the device. Simultaneously, the invention discloses a method for adjustment, back-gate injection, N<-> region injection and N<-> drift region injection, whichis compatible with the CMOS process and a method for hiding the silicide in the N<-> drift region, which is compatible with the CMOS process.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

Radiation-proof packaging material for chip and radiation-proof packaging process

The invention belongs to the technical field of materials for the material nuclear industry, and particularly relates to a chip anti-radiation packaging material and an anti-radiation packaging process. The chip anti-radiation packaging material is formed by doping wide bandgap semiconductor particles in a plastic packaging material, and the weight ratio of the wide bandgap semiconductor particles is 10-75%. The chip anti-radiation packaging process comprises the following steps: firstly, growing an anti-radiation layer on the back surface of a copper substrate, welding a chip on the front surface of the copper substrate, and bonding the chip with a pin of the copper substrate; then weighing a plastic packaging material and the doped particles, putting the plastic packaging material and the doped particles into a mold with a preset stirring temperature, and uniformly stirring, so as to obtain a plastic packaging material composite material after the stirring time is ended; and finally, carrying out injection molding and press sealing on the uniformly stirred plastic packaging composite material, and carrying out pin electroplating and burr and flash removal on the plastic packaged chip. The radiation-proof performance of the whole chip and the reliability in the space environment are improved, and meanwhile, the radiation-proof capability of the back of a chip device is improved.
Owner:重庆平创半导体研究院有限责任公司
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