The invention discloses a
metal / glass surface in-situ metallization multilayer
eutectic bonding method and device based on electrogenerated cationic conduction. The method comprises the following steps: alternately stacking a plurality of
layers of pre-coated
metal test pieces and cationic conductive glass, and putting the stacked
metal test pieces and cationic conductive glass into a
vacuum furnace, enabling each layer of metal and glass test piece to be respectively communicated with a negative
electrode and a positive
electrode of a direct-current electrostatic field according to a bondingsequence, heating and loading an
electric field while applying
axial pressure to the bonded piece, activating
ionization of cations in the glass under high temperature and
electric field repulsive force to make the cations directionally migrate to the bonding surface of the glass to be enriched, carrying out a
redox reaction on the cations and free charges to generate elementary substances, then carrying out in-situ growth in a micro-nano structure on the surface of the glass to form a metal layer, carrying out
diffusion and eutectic reaction on the metal layer and a
coating film at an eutectic temperature to realize bonding, and repeating the processes to carry out multilayer bonding.
Anodic bonding and
eutectic bonding principles are combined, so high-
conductivity, high-
thermal conductivity and high-strength multilayer bonding of metal and glass is realized under the conditions of low temperature and
low voltage.