52results about How to "Fragile" patented technology

The invention provides a commercial display cabinet for food refrigeration and preservation. A foaming side plate (3) is mounted on side of a forward tilting type underframe (2); a foaming box body (6) is mounted at the upper part of the forward tilting type underframe (2); an underfloor system evaporation coil (7) is bonded on the inner wall of the foaming box body (6); a supporting arm (19) is mounted above the foaming box body (6); the lower part of an adjustable supporting rod (14) is mounted on the foaming box body (6) while the upper part of the adjustable supporting rod is connected with the supporting arm (19); an operation end hollow toughened glass translation door (10) is mounted on one side of the supporting arm (19); a client arc hollow glass (13) is fixedly mounted at the upper part of the supporting arm (19); and a box body water drainage pipe (17) is mounted at the bottom of the foaming box body (6). The commercial display cabinet for food refrigeration and preservation, provided by the invention, has the advantages of energy conservation, environment friendliness, flexible and changing combining modes as well as capability of satisfying requirements of different clients, such as large-scale stores, small shops and the like.

The invention provides a method for rapidly cutting silicon wafers with an electroplating diamond wire with ultrahigh efficiency. The method includes the following steps that firstly, bar sticking is conducted; secondly, feeding is conducted; thirdly, a cutting solution is prepared; fourthly, cutting is conducted; fifthly, discharging is conducted; sixthly, degumming and cleaning are conducted; and seventhly, checking and packaging are conducted. According to cutting, a cutting rack drives a silicon bar to move towards the electroplating diamond wire, and meanwhile a main roller drives an electroplating diamond wire net to conduct reciprocating movement to achieve cutting; in the cutting process, the linear speed of the electroplating diamond wire ranges from 1300 m / min to 1500 m / min, the workpiece cutting speed ranges from 1 mm / min to 4.5 mm / min, and the thickness of a diamond particle coating on the electroplating diamond wire ranges from 3 microns to 5 microns; and in the cutting process, the manner of conducting forward feeding firstly and backward feeding secondly is adopted in the electroplating diamond wire, and before each workpiece is machined, the 3 km-5 km electroplating diamond wire is fed to a wire collecting wheel. By means of the cutting method, 8.4 inch and 650 mm crystalline silicon bars can be smoothly cut within 1 h, and the problem that in the prior art the efficiency for cutting silicon wafers with electroplating diamond wire is low is solved.

The invention belongs to the technical field of tea manufacture, in particular to a method for mechanically processing flat green tea. The method is characterized in that fresh green tea leaves are prepared into well-known tea with a flat shape through spreading, enzyme deactivating, sorting, pressing, solidifying, flavoring and other steps. The flat well-know tea has the characteristics of flat and smooth strips, no fragment, unpolished rice like color and luster, constant chestnut fragrance, green and bright color of liquor color, fresh and pure taste, tender, uniform, green and bright leaves and the like. The tea quality can completely reach the level of manually processing, and the method is applicable to mechanical processing production.