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53results about How to "Simple removal process" patented technology

Synthesis method of high-purity leuprorelin

The invention provides a method for preparing leuprorelin. The method comprises the following steps: (1) taking Fmoc-Pro-CTC-OH and CTC (Carbon Tetrachloride) resin as starting raw materials and treating to obtain Fmoc-Pro-CTC-OH resin; (2) sequentially connecting the Fmoc-Pro-CTC-OH resin with an amino acid with a protecting group by adopting a gradual coupling manner of a Fmoc/tBu solid-phase method to synthesize side chain wholly-protected leuprorelin precursor peptide-resin; (3) taking a 20 percent trifluoroethanol/DCM (Dichloromethane) solution as a cutting reagent and cutting the side chain wholly-protected leuprorelin precursor peptide-resin, so as to obtain a side chain wholly-protected leuprorelin precursor peptide; (4) carrying out ethyl amination on the side chain wholly-protected leuprorelin precursor peptide to obtain side chain wholly-protected leuprorelin; (5) carrying out side chain cutting on the side chain wholly-protected leuprorelin to obtain a leuprorelin crude peptide; (6) carrying out CM purification and HPLC (High Performance Liquid Chromatography) purification, concentration, dissolving and freeze-drying on the leuprorelin crude peptide to obtain a high-purity leuprorelin crude drug. The method provided by the invention has the advantages of simplicity in operation, short period, low cost, high product yield and small environment pollution and is very suitable for industrial production.
Owner:上海丽珠制药有限公司

Mould cleaning cake for removing residual aluminum in to-be-repaired mould as well as preparation method and using method of mould cleaning cake

The invention provides a mould cleaning cake for removing residual aluminum in a to-be-repaired mould as well as a preparation method and a using method of the mould cleaning cake. The mould cleaning cake comprises the following raw materials in parts by weight: 5-15 parts of filler, 5-15 parts of a solid lubricant, 40-70 parts of water-soluble materials and 1-5 parts of a reinforcing agent. The preparation method of the mould cleaning cake comprises the following steps: drying and crushing the raw materials respectively; then, pressing and molding after mixing according to a proportion; and finally, roasting to prepare the mould cleaning cake. While being adopted to remove the residual aluminum in the mould, the mould cleaning cake is firstly placed above to-be-removed residual aluminum in the mould and then the mould is heated and pressurized to control the temperature to 450-500 DEG C and the pressure to 1000-1200MPa, so that the residual aluminum is replaced by virtue of the mould cleaning cake; and then, the mould is soaked or cleaned by virtue of hot water, so that the mould cleaning cake left in the mould can be removed. The mould cleaning cake provided by the invention can be adopted to effectively remove the residual aluminum in the mould; moreover, the removed residual aluminum can be recycled, and the mould cleaning cake also can be conveniently removed and recycled.
Owner:湖北豪展铝业有限公司

Wafer grinding method

The invention provides a wafer grinding method. The wafer grinding method includes the steps that a wafer is provided and comprises a functional face and a back face opposite to the functional face; after a protective layer is formed on the functional face of the wafer, the protective layer is covered with a layer of protective adhesive tape; then, the wafer is placed on a grinding device, the back face of the wafer is ground so that the portion, with the partial thickness, of the wafer can be removed; and the protective adhesive tape is removed, and then the protective layer is removed. Before grinding, the protective layer is formed on the functional face of the wafer, and then the protective layer is covered with one layer of protective adhesive tape. In the grinding process of the protective adhesive tape, the structure on the functional face of the wafer can be effectively protected against damage in the grinding process, the protective adhesive tape is pasted on the protective layer, the situation that the protective adhesive tape makes contact with the functional face of the wafer can be effectively avoided, and therefore in the process of tearing off the adhesive tape after the grinding technology, the protective adhesive tape can remove defects of parts on the surface of the functional face of the part of the wafer, and structural damage on the functional face of the wafer is reduced.
Owner:SEMICON MFG INT (SHANGHAI) CORP

Zirconium matrix removing process and burnup measuring method adopting same

The invention discloses a zirconium matrix removal process and a burnup measurement method adopting the process. The burnup measurement method comprises a sample cutting and separating step, a sampledissolving step, a hydrofluoric acid removal step, a uranium and burnup monitoring body separation step and a uranium and burnup monitoring body content measurement step. The method further comprisesa zirconium matrix removing step, and the zirconium matrix removing step is located between the hydrofluoric acid removing step and the uranium and fuel consumption monitoring body separating step. Asolution obtained by the zirconium matrix removing step can be directly used in the uranium and burnup monitoring body separation step. Through the zirconium matrix removal process, in the burnup measuring method, a large number of zirconium matrixes in the dissolving solution can be removed after the hydrofluoric acid removal step; and the content of zirconium in the dissolving solution is lowerthan the requirement of the subsequent uranium and burnup monitoring body separation step, so that the burnup measurement process can accurately measure the burnup value of a special system, namely azirconium-based dispersive nuclear fuel element, and has wide application and popularization values.
Owner:NUCLEAR POWER INSTITUTE OF CHINA

Wafer Grinding Method

The invention provides a wafer grinding method. The wafer grinding method includes the steps that a wafer is provided and comprises a functional face and a back face opposite to the functional face; after a protective layer is formed on the functional face of the wafer, the protective layer is covered with a layer of protective adhesive tape; then, the wafer is placed on a grinding device, the back face of the wafer is ground so that the portion, with the partial thickness, of the wafer can be removed; and the protective adhesive tape is removed, and then the protective layer is removed. Before grinding, the protective layer is formed on the functional face of the wafer, and then the protective layer is covered with one layer of protective adhesive tape. In the grinding process of the protective adhesive tape, the structure on the functional face of the wafer can be effectively protected against damage in the grinding process, the protective adhesive tape is pasted on the protective layer, the situation that the protective adhesive tape makes contact with the functional face of the wafer can be effectively avoided, and therefore in the process of tearing off the adhesive tape after the grinding technology, the protective adhesive tape can remove defects of parts on the surface of the functional face of the part of the wafer, and structural damage on the functional face of the wafer is reduced.
Owner:SEMICON MFG INT (SHANGHAI) CORP

A kind of synthetic method of high-purity leuprolide

The invention provides a method for preparing leuprorelin. The method comprises the following steps: (1) taking Fmoc-Pro-CTC-OH and CTC (Carbon Tetrachloride) resin as starting raw materials and treating to obtain Fmoc-Pro-CTC-OH resin; (2) sequentially connecting the Fmoc-Pro-CTC-OH resin with an amino acid with a protecting group by adopting a gradual coupling manner of a Fmoc / tBu solid-phase method to synthesize side chain wholly-protected leuprorelin precursor peptide-resin; (3) taking a 20 percent trifluoroethanol / DCM (Dichloromethane) solution as a cutting reagent and cutting the side chain wholly-protected leuprorelin precursor peptide-resin, so as to obtain a side chain wholly-protected leuprorelin precursor peptide; (4) carrying out ethyl amination on the side chain wholly-protected leuprorelin precursor peptide to obtain side chain wholly-protected leuprorelin; (5) carrying out side chain cutting on the side chain wholly-protected leuprorelin to obtain a leuprorelin crude peptide; (6) carrying out CM purification and HPLC (High Performance Liquid Chromatography) purification, concentration, dissolving and freeze-drying on the leuprorelin crude peptide to obtain a high-purity leuprorelin crude drug. The method provided by the invention has the advantages of simplicity in operation, short period, low cost, high product yield and small environment pollution and is very suitable for industrial production.
Owner:上海丽珠制药有限公司
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