3results about How to "Stable operating temperature" patented technology

The utility model discloses a transformer oil tank structure with multiple heat exchange modes, and relates to the technical field of transformer cooling. The device structurally comprises a shell, a box cover, a plurality of U-shaped pipes, a buffer tank and a circulating pump, a heat exchange box body extending downwards is arranged in the center of the lower end of the shell; supporting channel steel is fixed to the lower end of the shell and located on the two sides of the heat exchange box respectively; the circulating pump is mounted on one supporting channel steel; an S-shaped coil pipe is fixed between the left wall and the right wall of the heat exchange box body in a penetrating mode. Geothermal cooling is carried out through the U-shaped pipes buried underground, heat exchange is carried out through the low temperature and stability of underground soil, the operation temperature of the transformer is effectively reduced, and the cooling efficiency is improved. The geothermal cooling mode does not need additional refrigeration equipment, only a circulating pump is needed to drive cooling liquid to circulate, and operation energy consumption is low. And the underground soil temperature is relatively stable and is slightly influenced by the external environment, so that the geothermal cooling effect is stable and reliable, and the transformer can normally operate under various environmental conditions.

This invention provides a computing device with heat dissipation on both sides, relating to the field of heat dissipation technology for high-heat computing devices. Addressing the problem of high heat generation and poor single-sided heat dissipation in existing computing devices due to highly integrated chips, this device includes a chassis, a computing board, and a heat sink. The chassis has ventilation holes and an intake fan and an exhaust fan on its front and rear panels, respectively. The computing board integrates a computing chip on its front side, with an upper heat-conducting plate and a lower heat-conducting plate fixed to its front and back sides, respectively. The back of the upper heat-conducting plate contacts the chip, and the front side has multiple upper heat sinks extending forward and backward (arranged alternately). The back of the lower heat-conducting plate covers the back of the computing board, and the front side has multiple lower heat sinks extending forward and backward (arranged alternately). The upper heat-conducting plate, computing board, and lower heat-conducting plate are suspended above the chassis bottom plate and located between the intake fan and the exhaust fan. This structure, through double-sided heat conduction, matching the heat sink with the airflow direction, and the suspended design, effectively improves heat dissipation efficiency and ensures the reliability of device operation.

The utility model discloses a flame-retardant high-low voltage switch cabinet, which belongs to the technical field of high-low voltage switch cabinets, and is characterized by comprising a flame-retardant shell, the inner side of the flame-retardant shell is fixedly connected with a high-low voltage switch cabinet body, and the bottom of the inner side of the high-low voltage switch cabinet is fixedly connected with a cooling mechanism. Two cabinet doors rotate on the front side of the flame-retardant shell, a control mechanism is installed on the front side of the cabinet door on the right side, the cooling mechanism forms cooling liquid circulation through a liquid storage tank, a circulating pump, a cooling pipeline, a guide pipe and a backflow pipe, and the circulating pump can drive cooling liquid to circularly flow between the cooling pipeline and the placement plate to take away heat generated by electrical elements on the placement plate. The high-efficiency heat dissipation is achieved, the temperature in the switch cabinet is effectively prevented from being too high, the five placing plates are arranged, the heat dissipation area is increased, electrical elements can be installed on the placing plates in a layered mode, cooling liquid can cool the placing plates on each layer, and the uniformity and comprehensiveness of heat dissipation are improved.