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31results about How to "Moderate curing time" patented technology

Method for preparing adhesive for grade-E0 medium density fiberboards

The invention provides an adhesive for grade-E0 medium density fiberboards. The raw materials of the adhesive include formaldehyde, polyvinyl alcohol, urea and tripolycyanamide. The production process of the adhesive comprises: firstly, adding all formaldehyde into a reaction kettle, regulating the pH value of formaldehyde solution to 7.5 to 8.5 by using sodium hydroxide solution, adding the 40 to 50 percent of polyvinyl alcohol and urea and adding 80 to 90 percent of tripolycyanamide and adding the 10 to 20 percent of urea; secondly, adjusting the pH value to 5 to 6 by using formic acid, reacting for 20 to 30 minutes till a cloud point, regulating the pH value to 705 to 8.5 with caustic soda solution, and adding the 10 to 20 percent of tripolycyanamide and 20 to 30 percent of urea; and finally, adding 10 to 20 percent of urea, regulating the pH value of the adhesive to 6.6 to 7.5, and discharging. The adhesive has the advantages that: the free formaldehyde content is very low, and the manufactured medium density board is of grade E0; the curing time is proper, the storage stability is high, and the normal-temperature storage period is about 1 month; and the manufactured medium density board has high internal combining strength and high waterproof and dampproof performance.
Owner:BEIJING BUILDING MATERIALS ACADEMY OF SCI RES

Marble glue adhesive for construction engineering and preparation process thereof

The invention discloses a marble glue adhesive for construction engineering and a preparation process thereof. The marble glue adhesive comprises a component A and a component B, wherein the weight ratio of the component A to the component B is 10:3; the component A consists of the following raw materials in parts by weight: unsaturated polyester resin, a reinforcing filler, a polymerization inhibitor, an accelerant, reinforcing chopped fiber, polyethylene glycol methacrylate, a diluent and a thixotropic agent; and the component B consists of the following raw materials in parts by weight: a filler curing agent, a plasticizer, an emulsifier and a thixotropic agent. The preparation method disclosed by the invention comprises the following steps: preparing the unsaturated resin, polyethyleneglycol methacrylate, the component A, the component B and the marble glue adhesive. The marble glue adhesive disclosed by the invention has excellent tensile shearing strength and impact strength, and has the advantages of convenient source of raw materials, simple production process, moderate curing time for obtained products, stable storage, small odor, high hardness, good toughness, excellentadhesive strength, good elasticity, excellent resistance to yellowing, moisture and heat, and the like.
Owner:福州市承亨建材有限公司

A press-button junction box dedicated to cadmium telluride thin film components

The invention discloses a dedicated press-clip type wiring box for a cadmium telluride thin film assembly. The wiring box includes a box body, a bottom board and a pedestal buckled to each other so asto form a mounting cavity. A diode is mounted in the mounting cavity. The box body is provided with a sunken mounting groove used for accommodating the diode. The mounting groove is provided with a boss protruding from the box body and formed on the back face of the box body. A plurality of radiating fins are arranged on the periphery of the boss. The box body is provided with a wire slot reaching the mounting groove from the edge of the box body. A cable is connected with the diode via the wire slot. The bottom board is in a shape corresponding to that of the mounting groove and can be nested in the mounting groove so as to form a plane with the bottom part of the box body. The middle part of the bottom board is provided with a sub box body which has a hollow bottom part. The box body with provided with a neck within the mounting groove. When the box body buckles with the bottom board, the neck is disposed in the bottom hollow part of the sub box. The edge of the bottom board is connected with a wire slot cover board capable of being spliced with the wire slot. The pedestal is provided with a pin, so that the pin is in associated connection with the neck when the pedestal is nested in the hollow part of the sub box.
Owner:CNBM CHENGDU OPTOELECTRONICS MATERIAL

Dedicated press-clip type wiring box for cadmium telluride thin film assembly

The invention discloses a dedicated press-clip type wiring box for a cadmium telluride thin film assembly. The wiring box includes a box body, a bottom board and a pedestal buckled to each other so asto form a mounting cavity. A diode is mounted in the mounting cavity. The box body is provided with a sunken mounting groove used for accommodating the diode. The mounting groove is provided with a boss protruding from the box body and formed on the back face of the box body. A plurality of radiating fins are arranged on the periphery of the boss. The box body is provided with a wire slot reaching the mounting groove from the edge of the box body. A cable is connected with the diode via the wire slot. The bottom board is in a shape corresponding to that of the mounting groove and can be nested in the mounting groove so as to form a plane with the bottom part of the box body. The middle part of the bottom board is provided with a sub box body which has a hollow bottom part. The box body with provided with a neck within the mounting groove. When the box body buckles with the bottom board, the neck is disposed in the bottom hollow part of the sub box. The edge of the bottom board is connected with a wire slot cover board capable of being spliced with the wire slot. The pedestal is provided with a pin, so that the pin is in associated connection with the neck when the pedestal is nested in the hollow part of the sub box.
Owner:CNBM CHENGDU OPTOELECTRONICS MATERIAL

Magnetorheological porous soft mold and plate forming device

ActiveCN113510177ALarge adjustable rangeIncrease or decrease material inflowIncreasing energy efficiencyComposite materialForming force
The invention relates to a magnetorheological porous soft mold and a plate forming device. The magnetorheological porous soft mold comprises an elastic base body with pores; and magnetic particles integrally formed in the elastic base body, wherein the magnetic particles are distributed in the elastic base body in a dispersed mode and located outside the pores. The elastic base body comprises at least two forming sections; all the forming sections are internally provided with the pores, and the porosity of at least one forming section is larger than that of the other forming sections, so that the elastic modulus of the forming sections with the large porosity is smaller than that of the forming sections with the small porosity; or at least one forming section is internally provided with the pores and at least one forming section is not internally provided with the pores, so that the elastic modulus of the forming sections with the pores is smaller than that of the forming sections without the pores. Through the design of the structure, when a blank is in complete contact with a special-shaped female mold, the stress of the whole blank is uniform, and the situation that the blank is broken due to the fact that the forming force is too large when a deeper part is formed is avoided.
Owner:HENAN UNIV OF SCI & TECH
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