This invention discloses a
semiconductor quartz component
polishing device, relating to the field of
quartz component
polishing technology. The device includes a main body, inside which a
polishing assembly and a rotating
assembly coaxially arranged with the polishing
assembly are installed. A mounting arm is mounted on the rotating end of the rotating assembly, and a ball head seat is mounted at the bottom of the mounting arm. A positioning assembly capable of vertical rotation is installed inside the ball head seat. Through the arrangement of the polishing assembly and the positioning assembly, the
quartz rod is positioned, allowing the polishing assembly to first polish the end of the quartz rod. Then, combined with the cooperation of the rotating assembly and the electric push rod, the entire circumference of the quartz rod's end face can be uniformly and continuously contacted with the polishing assembly. This eliminates the need for manual polishing of the quartz rod by hand, efficiently chamfering the end of the quartz rod, eliminating quality fluctuations caused by inconsistent polishing force and path during manual polishing, effectively removing micro-cracks, scratches, and unevenness left from
cutting, and reducing potential
stress concentration points.