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188 results about "Float zone" patented technology

Directional TiAl-based alloy and preparation method thereof

The invention discloses directional TiAl-based alloy and a preparation method thereof. According to the atomic percentage, TiAl alloy components are expressed as Ti-(40-50)Al-aNb-bCr-cMo-dV-eMn, wherein in the formula, a, b, c, d, e are atomic percentages, a+b+c+d+e is less than or equal to 10, and the balance is Ti. The method for preparing the columnar crystal TiAl-based alloy includes the following steps that mother alloy is smelted through vacuum induction suspension, and a mother alloy cast rod is prepared through vacuum suction casting; an optical floating zone crystal growth system is adopted, argon is used as protection gas, the flow speed is 3-3.6L/min, the width of a regional heating zone is 6-6.7mm, heat treatment is performed on the TiAl-based alloy cast rod, the heating temperature is controlled to be 1250-1350 DEG C, the drawing speed is in the range of 3-13 micrometers per second, and the columnar crystal TiAl-based alloy is prepared. Compared with a directional solidification technology, in the preparation method, peritectic reaction is omitted, and therefore peritectic segregation is avoided; the problem that refractory metal and alloy, such as tungsten and molybdenum, with direction tissue cannot be prepared through the direction solidification technology can also be solved.
Owner:NANJING UNIV OF SCI & TECH

Method and apparatus for preparing major diameter single crystal

InactiveCN1847468AMake up for heat lossHigh Inductive Heat InputPolycrystalline material growthBy zone-melting liquidsSingle crystalEngineering
The present invention relates to an apparatus and method for growing a high melting point single crystal having a predetermined orientation, which is grown from a culture rod (3) by a floating zone method or a suspension zone method. The device comprises: culture rods (3) and crystal nuclei (4), a strip-shaped resistance heating type heating strip (6) provided with at least one opening is installed between its ends and next to it, and it is heated To the crystal melting temperature, so as to form the melting zone (5), drive mechanism (8, 11), so that relative movement occurs between the heating belt (6) and the crystal nucleus (4) and the culture rod (3) that are installed next to the heating belt , the molten liquid material of the culture rod (3) is obtained through each opening of the heating belt, and causes single crystal growth on the crystal nucleus (4) by cooling, and another heating device (15, 16), which is arranged at the melting The vicinity of the zone (5) in order to set the temperature gradient within the range of the melting zone (5). In order to reduce the temperature gradient in the melting zone, said further heating device (15, 16) comprises at least one heating coil (17, 19), which is driven with radio frequency, wherein the heating strip (6) and the respective heating coil are thus mounted opposite each other (17, 19) so that radio frequency radiation is coupled on the heating strip in order to generate an additional inductive heat input in the heating strip and to set a temperature gradient across the melting zone (5). This enables an inductive heat input into the heating strip, which can be varied or varied in a targeted manner.
Owner:SCHOTT AG

10<5> K/cm temperature gradient directional solidification device and directional solidification method

The invention relates to a 10<5> K / cm temperature gradient directional solidification device and a directional solidification method. The 100000 K / cm temperature gradient directional solidification device is characterized in that laser light generated by a laser horizontally passes through a plate lens to enter a vacuum chamber, intersects vertically the axis of a drawing system, and is used for heating a preform; and liquid gallium-indium-tin alloy serves as cooling medium. The distance between the lower surface of a melting zone and the liquid level of the liquid gallium-indium-tin alloy is 1mm to 5 mm. When directional solidification is performed to the preform, the power of the laser is increased to 200 w to 1400 w. After the preform is zone-melted, a drawing mechanism is started to enable the preform to move at the speed of 1 to 300 microns per second and to be cooled, so that directional solidification of the preform is accomplished. In the invention, laser floating zone melting is combined with liquid metal cooling, so that the obtained oxide eutectic in-situ composite is uniform in structure, fine and compact, has good directing property, and is remarkably improved in mechanical property and other functions, the sizes and the shapes of produced function materials can satisfy the application of various photoelectric components.
Owner:NORTHWESTERN POLYTECHNICAL UNIV

P-type epitaxial layer-based binary coded decimal (BCD) integrated device and manufacturing method thereof

The invention discloses a P-type epitaxial layer-based binary coded decimal (BCD) integrated device and a manufacturing method thereof and belongs to the technical field of semiconductor power devices. A high-voltage n laterally diffused metal oxide semiconductor (LDMOS) device, a high-voltage n lateral insulated gate bipolar transistor (LIGBT) device, a low-voltage P-channel metal oxide semiconductor (PMOS) device, a low-voltage N-channel metal oxide semiconductor (NMOS) device, a low-voltage plug-and-play (PNP) device and a low-voltage negative-positive-negative (NPN) device are integrated on the same substrate; various devices are manufactured in a P-type epitaxial layer on the surface of a P-type substrate and are self-isolated through the P-type epitaxial layer; an N-type buried layer is formed between the P-type substrate below a high-voltage device and the P-type epitaxial layer; and the N-type buried layer can (or cannot) be formed on the P-type epitaxial layer on two sides below a low-voltage device. Due to the introduction of the N-type buried layer, a lower-resistivity silicon chip can be used as a substrate under the same breakdown voltage, and increase of chip manufacturing cost brought by a manufactured monocrystalline silicon chip by a floating zone (FZ) method is avoided; therefore, the manufacturing cost of the chip is reduced.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Thermal system and technology for producing float zone doped single crystal silicon having size phi of 6 inches

ActiveCN102358951ASolve the problem of prone to dislocation and broken bractsSolve the \"stab\" problemPolycrystalline material growthBy zone-melting liquidsAngular degreesSingle crystal
The invention relates to a thermal system and a technology for producing a float zone doped single crystal silicon having a size phi of 6 inches. The thermal system comprises a coil and a heat preservation cylinder. An upper surface of the coil has an inclined multi-stepped coil structure. An external diameter phi of the coil is in a range of 350+50/-50 millimeters. An internal diameter phi of the coil is in a range of 50+2/-2 millimeters. The thickness of the coil is in a range of 30+2/-2 millimeters. A diameter phi of the heat preservation cylinder is in a range of 350+50/-50 millimeters. The height of the heat preservation cylinder is in a range of 100+20/-20 millimeters. A distance between the coil and the heat preservation cylinder is in a range of 100+50/-50 millimeters. The technology is characterized in that impurity gas is fed into a furnace chamber in shoulder extension, wherein a lower shaft rotating speed is in a range of 7 to 10 revolutions per minute and a shoulder extension angle is in a range of 40+2/-2 degrees; and in equal-diameter growth, a lower shaft has a falling speed of 3 to 4 millimeters per minute and a rotating speed of 3 to 5 revolutions per minute and coil pulser power is 60 to 70% of rated power. Through the thermal system which is a novel thermal system and adjustment on technological parameters, the float zone doped single crystal silicon having a size phi of 6 inches can be successfully prepared by drawing, and dislocation and burr generation problems produced easily in production of a float zone doped single crystal silicon with a large size are solved, and thus market demands on single crystal silicon with a large size are satisfied.
Owner:ZHONGHUAN ADVANCED SEMICON MATERIALS CO LTD +1

Bipolar CMOS DMOS (BCD) integrated device based on N type extension layer and manufacture method thereof

A bipolar CMOS DMOS (BCD) integrated device based on a N type extension layer and a manufacture method thereof, which belongs to the semiconductor power device technology field, are disclosed. In the invention, a high voltage nLDMOS device, a high voltage nLIGB device, a low voltage PMOS device, a low voltage NMOS device, a low voltage PNP device and a low voltage NPN device are integrated on a same substrate. All devices are made in an N type extension layer arranged on a surface of a P type extension layer which is on a surface of a P type substrate. And junction isolations of the devices are realized through P<+> isolation regions. N type buried layers are arranged between the P type substrate and the P type extension layer, wherein the P type substrate and the P type extension layer are under the high voltage devices. N type buried layers are/ are not arranged between the P type extension layer and the N type extension layer, wherein the P type extension layer and the N type extension layer are under the low voltage devices. The N type buried layers are introduced in the invention to realize that silicon chips with lower resistivity can be used as the substrate at a same breakdown voltage. In the prior art, float-zone technique is adopted to manufacture monocrystalline silicon pieces, which can increase the chip manufacturing costs. In the invention, the float-zone technique is not used so that the chip manufacturing costs can be reduced.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Method for preparing (110) float zone silicon crystal

ActiveCN101974779AMeet the requirements for preparing silicon materials for high-efficiency solar cellsMeeting Silicon Material Requirements for High Efficiency Solar CellsPolycrystalline material growthBy zone-melting liquidsSingle crystalEngineering
The invention discloses a method for preparing a (110) float zone silicon crystal. The key point of the technical scheme is that: 1, in the seeding technology, by controlling and adjusting the descending speed of a lower shaft and adjusting the power, the seeding neck diameter is controlled in a range from 2 to 6 mm, wherein the seeding neck diameter is more than or equal to 1.5 times the diameter of a single crystal; 2, in the shouldering technology, by controlling and adjusting the descending speed and rotating speed of the lower shaft and the descending speed and rotating speed of an upper shaft and adjusting the power, the shouldering angle is 50+/-5 degrees; and 3, in the ending technology, the ending length is more than 1.2 times the diameter of the single crystal, and the minimum tail diameter is less than or equal to 5mm. The method overcomes the defects that the (110) silicon single crystal prepared by the conventional direct pulling method has high impurity content and cannot meet the requirement on the silicon single crystal of a high-efficiency solar cell, and successfully prepares a low-impurity content and long-service life (110) dislocation-free float zone silicon crystal by a floating zone method, wherein the (110) float zone silicon crystal has the dislocation density of less than or equal to 500 units/cm<2> and the minority carrier lifetime of more than or equal to 300us, and meets the requirement of a silicon material for preparing the high-efficiency solar cell.
Owner:ZHONGHUAN ADVANCED SEMICON MATERIALS CO LTD +1

High-temperature high-strength TiAl-Nb monocrystal and preparation method thereof

The invention discloses a high-temperature high-strength TiAl-Nb monocrystal and a preparation method thereof. Based on the atomic percent, the high-temperature high-strength TiAl-Nb monocrystal comprises the alloy components: Ti-(43-47) Al-(6-10)Nb-(0.1-1)(C, Si), and the balance of Ti. The preparation method comprises the following steps: smelting TiAl-Nb button-shaped master alloy ingot casting by using an electro-magnetic induction suspension method; preparing a cylindrical rod-shaped sample by means of differential pressure suction casting or gravity casting; directionally condensing the cylindrical bar by using an optical float-zone crystal growth system to guarantee that the heating power is between 65% and 70%, the growth velocity is 5-30mm / h, the relative rotation speed is 20-40r / min and the argon flow protection is carried out for 3-5L / min; finally obtaining a TiAl-Nb monocrystal test bar; and performing desegregation heat treatment on the TiAl-Nb monocrystal bar to finally obtain the monocrystal test sample. By adopting the TiAl-Nb monocrystal alloy material prepared by using preparation method disclosed by the invention, the alloy pollution caused by a traditional Bridgman directional condensation method can be effectively avoided, a solid-liquid interface shape during condensation is controlled by regulating the heating power so as to quickly obtain the TiAl-Nb monocrystal, and after the desegregation of the TiAl-Nb monocrystal, the high-strength TiAl-Nb monocrystal alloy of which the yield strength is 637MPa at a temperature of 900 DEG C, the elongation percentage is 8.1% and the ductile-brittle transition temperature is not lower than 900 DEG C can be obtained.
Owner:NANJING UNIV OF SCI & TECH

Electron beam zone melting furnace and method for carrying out float zone purification on material

The invention relates to an electron beam zone melting furnace and a method for carrying out float zone purification on a material. The electron beam zone melting furnace comprises a furnace body arranged on a work table, an annular electron gun arranged in the furnace body, and a material fixation device arranged in the furnace body, wherein the annular electron gun sleeves on the outer cycle of a material during melting, a refrigeration system, a vacuum unit and a rocker arm mechanism of a control panel are arranged, the material fixation device comprises a pair of rotatable rod material clamping heads fixed on the upper end and the lower end of the furnace body and capable of being adjusted up and down, an electron gun lifting system capable of driving the electron gun to move up and down during melting is further provided and at least comprises a set of screws respectively driven by a servomotor and a supporting and placing plate for the electron gun, the pair of the double screws are respectively arranged on both sides of the material during melting, and the supporting and placing plate for the electron gun is horizontally fixed on the pair of the double screws. According to the present invention, the melting furnace adopts the electron beam to carry out float zone purification on the material difficultly melting at a high temperature, such that the difficult problems that purification of the material difficultly melting at the high temperature, crystal production and the like can not be achieved only with the current resistance zone melting furnace and the sensing zone melting furnace are solved.
Owner:GRIMAT ENG INST CO LTD

Graphene/metal composite material and preparation method thereof

The invention discloses a graphene / metal composite material and a preparation method thereof. The method comprises the following steps of: (1) weighing a metal rod and a high-purity carbon rod in percentage by mass, wherein the high-purity carbon rod accounts for 1%-30%; (2) clamping the cleaned metal rod on an upper chuck and a lower chuck of a withdrawing system of a directional solidification furnace adopting a floating zone method, clamping the high-purity carbon rod on a clamp beside the withdrawing system, and enabling the bottom end of the high-purity carbon rod to be in contact with amelting zone of the metal rod; and (3) performing vacuum-pumping on the directional solidification furnace adopting the floating zone method, performing directional solidification on the metal rod, controlling length of a melting zone to be 1-50 mm, moving the metal rod from top to bottom at a rate of 1-5000 [mu]m / s, and rotating along the axis of the withdrawing system; and enabling the bottom end of the high-purity carbon rod to be within the melting zone of the metal rod all the time. According to the graphene / metal composite material obtained by the method disclosed by the invention, carbon exists in a metal lattice in the form of graphene, and the two-phase interface is good in combination, so that conductivity of the material is favorably improved.
Owner:INST OF ELECTRICAL ENG CHINESE ACAD OF SCI

Carbon-silicon-tungsten-yttrium lamellar structure high-niobium titanium-aluminum alloy and preparation method thereof

The invention relates to a carbon-silicon-tungsten-yttrium lamellar structure high-niobium titanium-aluminum alloy and a preparation method thereof. The alloy belongs to a gamma-TiAl alloy and comprises 45.0-48.0% of Al, 5.0-8.0% of Nb, 0.5-1% of C, 0.1-0.5% of Si, 1.0-2.0% of W, 0.1-0.5% of Y, and the balance of Ti. The preparation method comprises the steps of preparing a button ingot through electric arc melting, casting a cylindrical test bar through suspension smelting, conducting directional solidification on the test bar by an optical float-zone method, and obtaining a lamellar structure high-niobium titanium-aluminum alloy sample. Compared with the common titanium-aluminum alloy, grains of the alloy can be further refined, the strength and rigidity of the alloy can be further improved, and the alloy has good oxidation resistance and creep resistance, and can overcome the disadvantages of poorer room-temperature brittleness and room-temperature ductility. In addition, as the optical float-zone method is adopted for the directional solidification, an oriented lamellar structure can be obtained, properties of the alloy, such as fracture toughness, creeping strength and room-temperature ductility, can be improved greatly, and the alloy has the advantages that no crucible is required, no pollution is caused, and the growth speed is high.
Owner:NANJING UNIV OF SCI & TECH

Method for growing large size Ta2O5 single crystal by using floating zone method

The invention relates to a method for growing a large size Ta2O5 single crystal by using a floating zone method, and belongs to the field of crystal growth. The method comprises the following steps: carrying out ball milling and drying for a Ta2O5 powder material; placing the treated Ta2O5 powder material in a rubber tube, and carrying out isostatic pressing for the material to prepare a biscuit rod; carrying out sintering for the biscuit rod to obtain a polycrystalline rod; adopting the biscuit rod or the polycrystalline rod as the material rod, and adopting the polycrystalline or the Ta2O5 single crystal as the seed crystal, wherein the seed crystal and the material rod form a straight line in a vertical direction, and the contact point and a halogen lamp are at the same horizontal line; heating the material rod and the seed crystal until the material rod and the seed crystal are molten, wherein the heating rate is 30-60 DEG C per minute; adjusting the rotation speeds and the rotation directions of the material rod and the seed crystal, then carrying out inoculation; adopting the movement of a focusing lens or the up and down movement of the rod to enable the molten zone to be far away from the focusing point, enable the temperature of the molten zone to be decreased to realize the crystallization, wherein the crystal growth rate is 10-60 mm / h; cooling the grown crystal to the room temperature. With the method provided by the present invention, the growth period is short; the preparation efficiency is high; the Ta2O5 single crystal can be rapidly grown, wherein the grownTa2O5 single crystal has characteristics of size in centimeter magnitude, no macroscopic defect and high quality.
Owner:BEIJING UNIV OF TECH

Garnet composite crystal with multi-segment doping concentration gradient and growing method thereof

The invention relates to a garnet composite crystal with a multi-segment doping concentration gradient and a growing method thereof. The garnet composite crystal has the following structural general formula: (Lnx1Re1-x1) 3B2C3O12 / (Lnx2Re1-x2) 3B2C3O12 / (Lnx3Re1-x3) 3B2C3O12 / ... / (LnxnRe1-xn) 3B2C3O12, wherein Ln is equal to Nd or Yb or Tm or Ho, x1 is more than 0 and less than 1, x2 is more than 0 and less than 1, x3 is more than 0 and less than 1, xn is more than 0 and less than 1, and n is more than 3; Re is equal to Lu, Y or Gd; B is equal to Sc, Al or Ga; and C is equal to Al or Ga; and the garnet composite crystal has a garnet structure. The growing method comprises the following steps of: making the composite crystal grow by an optical float-zone method; proportioning the raw materials according to chemometry in the general formula; preparing polycrystal charge bars according to the predesigned segments and length; and loading the polycrystal charge bars into an optical float-zone furnace for growing. The method has the advantages of high speed, short cycle, no crucible in the process crystal growth, less pollution on crystals, obvious gradient concentration segments and relatively simple process. The growing crystals have high transparency and few cracks and are suitable for growing of the garnet composite crystals with the concentration gradients.
Owner:SHANDONG UNIV
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