The invention provides a high temperature-resistant heat-sealing
adhesive for a high-speed
medicine packaging machine for
medicine blister packaging. The high temperature-resistant heat-sealing
adhesive comprises, by
mass, 20-39.9% of modified
polyolefin resin, 10-20% of modified
epoxy resin, 50-60% of a
solvent and 0.1-0.5% of an assistant. A preparation method of the high temperature-resistant heat-sealing
adhesive comprises the following steps: S1, adding the
solvent into a reaction kettle, performing stirring to achieve uniform mixing, sequentially adding the modified
polyolefin resin andthe modified
epoxy resin while stirring, and stirring and uniformly mixing the
solvent, the modified
polyolefin resin and the modified
epoxy resin; S2, adding the assistant to a
mixed solution obtained in step S1, performing high-speed stirring to achieve uniform mixing, and performing
downtime curing; and S3, measuring the
solid content, adjusting the
solid content to a theoretical value, and performing stirring, cooling and filtering. Compared with heat-sealing adhesives in the prior art, the heat-sealing adhesive in the invention has the following advantages: no leakage sealing, no scorching crease marks and no peculiar smell are achieved during high-temperature and high-speed sealing using the
medicine packaging machine; the heat-sealing strength is high, so product demands are met; anadhesive layer has a good stability, and the strength of a
coating film does not change after the
coating film is stored for one year; and the heat-sealing adhesive has a wide application range.