The invention discloses a damp-heat-resistant soybean-based board adhesive. The adhesive is prepared from, by weight, 2-3 parts of polymaleic anhydride, 2-4 parts of polyvinyl alcohol, 170-200 parts of defatted soybean powder, 0.3-0.4 part of ferric chloride, 0.1-0.2 part of ferrous chloride, 0.8-1 part of epoxy chloropropane, 2-3 parts of N-hydroxymethyl acrylamide, 16-20 parts of styrene, 0.1-0.2 part of potassium persulfate, 3-4 parts of hemicellulase, 10-19 parts of 4,4'-diphenylmethane diisocyanate, 60-70 parts of 20-30% hydrochloric acid solution, 0.6-1 part of ammonium alcohol ether sulphate, 2-4 parts of palm wax, 0.6-1 part of 2,2-dimethylolpropionic acid, 0.01-0.02 part of stannous octoate, 0.01-0.02 part of divinyl benzene, 4-6 parts of zirconium oxychloride octahydrate and the like. The adhesive has the advantages that equipment is not likely to be corroded, pot-life storage life is long, the adhesive is free of formaldehyde, the residual monomer content is low, and water resistance is good.