The invention discloses a preparation method of a low
dielectric constant thin film layer. When the vacuum degree in a furnace body is smaller than 10-30 Pa, a radio-frequency power supply and a matcher are started; after a second
mass flow meter is started, exhaust
nitrogen used for emptying residual gas in the furnace body is fed in;
octamethylcyclotetrasiloxane and
cyclohexane are mixed uniformly and injected into a pressure-proof stainless steel kettle, a baffle valve is
shut down manually, bubbling
nitrogen and
inert gas are injected respectively from a first gas inlet
pipe and a second gas inlet
pipe, sequentially flow through a first pressure-proof
gas mixing tank, the pressure-proof stainless steel kettle and a first
nozzle and are fed into the furnace body, accordingly the
octamethylcyclotetrasiloxane and the
cyclohexane are brought into the furnace body, and the
octamethylcyclotetrasiloxane, the
cyclohexane, the bubbling
nitrogen and the
inert gas deposit on the surface of a substrate to form the thin film layer under the
plasma condition. According to the method, the
dielectric constant value of a thin film is adjusted and controlled conveniently and precisely, the thin film layer with a low
dielectric constant value is obtained, chemical components of the thin film layer are more uniform, the thin film layer has good
thermostability and
hardness, and flatness of the thin film is improved.