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56 results about "Non-radiative recombination" patented technology

Non-radiative recombination is a process in phosphors and semiconductors, whereby charge carriers recombine without releasing photons. A phonon is released instead. Non-radiative recombination in optoelectronics and phosphors is an unwanted process, lowering the light generation efficiency and increasing heat losses.

Methods of hyperdoping semiconductor materials and hyperdoped semiconductor materials and devices

Methods are disclosed for producing highly doped semiconductor materials. Using the invention, one can achieve doping densities that exceed traditional, established carrier saturation limits without deleterious side effects. Additionally, highly doped semiconductor materials are disclosed, as well as improved electronic and optoelectronic devices/components using said materials. The innovative materials and processes enabled by the invention yield significant performance improvements and/or cost reductions for a wide variety of semiconductor-based microelectronic and optoelectronic devices/systems. Materials are grown in an anion-rich environment, which, in the preferred embodiment, are produced by moderate substrate temperatures during growth in an oxygen-poor environment. The materials exhibit fewer non-radiative recombination centers at higher doping concentrations than prior art materials, and the highly doped state of matter can exhibit a minority carrier lifetime dominated by radiative recombination at higher doping levels and higher majority carrier concentrations than achieved in prior art materials. Important applications enabled by these novel materials include high performance electronic or optoelectronic devices, which can be smaller and faster, yet still capture or emit light efficiently, and high performance electronics, such as transistors, which can be smaller and faster, yet cooler.
Owner:YALE UNIV

Methods of hyperdoping semiconductor materials and hyperdoped semiconductor materials and devices

Methods are disclosed for producing highly doped semiconductor materials. Using the invention, one can achieve doping densities that exceed traditional, established carrier saturation limits without deleterious side effects. Additionally, highly doped semiconductor materials are disclosed, as well as improved electronic and optoelectronic devices / components using said materials. The innovative materials and processes enabled by the invention yield significant performance improvements and / or cost reductions for a wide variety of semiconductor-based microelectronic and optoelectronic devices / systems.Materials are grown in an anion-rich environment, which, in the preferred embodiment, are produced by moderate substrate temperatures during growth in an oxygen-poor environment. The materials exhibit fewer non-radiative recombination centers at higher doping concentrations than prior art materials, and the highly doped state of matter can exhibit a minority carrier lifetime dominated by radiative recombination at higher doping levels and higher majority carrier concentrations than achieved in prior art materials. Important applications enabled by these novel materials include high performance electronic or optoelectronic devices, which can be smaller and faster, yet still capture or emit light efficiently, and high performance electronics, such as transistors, which can be smaller and faster, yet cooler.
Owner:YALE UNIV

LED with two-dimensional photonic crystals

The invention relates to a low cost LED with two-dimensional photonic crystals, and aims to solve the problem that the light-emitting efficiency is low and high production cost, and the problem that non-radiative recombination increases because a semiconductor active layer is damaged by adopting the conventional etching, photo-etching or imprinting technique in the conventional LED. The LED comprises a substrate, a buffer layer, an N-type doped semiconductor layer, an active layer, a P-type doped semiconductor layer, a current diffusing layer, a P-type electrode and an N-type electrode, wherein two-dimensional photonic crystal layers are covered on the interface between the N-type doped semiconductor layer and the air and the interface between the P-type doped semiconductor layer and the air; and the two-dimensional photonic crystal layer adopts a single-layer micro-sphere ordered arrangement structure, and the grain size of the micro-spheres is 50nm to 5 mu m. In the LED, by using the two-dimensional photonic crystal layer, a refraction index difference between the semiconductor and the outside is improved; and by utilizing the weak photonic crystal effect, a light-emitting efficiency is improved by 10 to 20 percent compared with that of the conventional LED. The LED of the invention is suitable for large-area and industrialized production.
Owner:HARBIN INST OF TECH

Light emitting diode and manufacturing method thereof

The invention discloses a light emitting diode and a manufacturing method thereof, and belongs to the technical field of a semiconductor. An electron baffle layer of the light emitting diode comprises three sub-layers, wherein the three sub-layers comprise a first sub-layer, a second sub-layer and a third sub-layer which are sequentially grown, the first sub-layer comprises an AlGaN/InGaN superlattice layer with (n+1) periods, the second sub-layer comprises an AlGaN/InGaN superlattice layer with n periods, the third sub-layer comprises an AlGaN/InGaN superlattice layer with (n-1) periods, InGaN layers in the first sub-layer, the second sub-layer and the third sub-layer are all doped with Mg, and n is more than or equal to 3 but less than or equal to 6. The electron baffle layers are divided into three superlattice sub-layers with different doping and same structure to form three segments of baffle layers, so that non-radiative recombination due to electrons leaked to a P layer is reduced as much as possible; and moreover, the periods of the superlattices of each sub-layer in the three sub-layers are gradually reduced according to 1, the electrons can be blocked better, meanwhile, not many holes can be blocked, and the luminous efficiency of a light emitting diode crystal is further improved.
Owner:HC SEMITEK SUZHOU

Method for deactivation of semiconductor laser cavity surface

The invention belongs to the semiconductor laser field. It comprises the following steps: cleaving the semiconductor laser to ropes in the air, then loading a fixture and putting it into an electron-beam vapor vacuum chamber; ion precleaning, that is to remove the oxidant and impurity substance in the cleaved cavity surface and the non-radiative recombination center as formed surface state and interface state with low energy ion current, which is less than 100eV , in the air of the electron-beam vapor vacuum chamber; ion precleaning the front cavity surface(4) for 30 seconds to 6 minutes; depositing broad forbidden band low absorbing material such as ZnSe or ZnS on the front cavity surface(4) to be an inactivating blocking layer(3) in the way of electron-beam vapor deposition; plating reflection reducting coating(1) on the front cavity surface(4); ion precleaning the rear cavity surface(5) from the back of the fixture for 30 seconds to 6 minutes; depositing ZnSe or ZnS on the rear cavity surface(5) in the way of electron-beam vapor deposition; plating high negative coating(2) on the rear cavity surface(5). The invented inactivating film is of stable performance, improved reliability, simple preparation, which can be used in lasers with different wave lengths or structures.
Owner:BEIJING UNIV OF TECH

Preparation method of low-defect quasi-two-dimensional perovskite film based on methanesulfonic acid negative ion induction

The invention discloses a preparation method of a low-defect quasi-two-dimensional perovskite film based on methanesulfonic acid negative ion induction. According to the method, methanesulfonic acid (MeS) negative ions are led in an L2An-1MnX3n+1 perovskite precursor to adjust phase compositions, so that a more effective energy transfer way is generated. Crystal boundary and surface defect inactivation is achieved by the MeS negative ions, and non-radiative recombination is effectively restrained. The service life of an exciton of the prepared quasi-two-dimensional perovskite film is obviouslyprolonged, and three-dimensional perovskite crystal particles are obviously increased. CsMeS is added into quasi-two-dimensional metal halide perovskite precursor solution to adjust perovskite phasecompositions, so that more three-dimensional perovskite crystal particles are generated as compared with a traditional method, and the more effective energy transfer way is generated. According to themethod, mixing of perovskite crystal lattices in the used CsMeS is omitted, the crystal lattices only exist on the surfaces of the perovskite crystal lattices, crystal boundary and surface defect inactivation can be achieved by MeS negative ions in the CsMeS, and non-radiative recombination is effectively restrained.
Owner:SHANGHAI UNIV

Light-emitting enhancement type electron beam pumping ultraviolet light source and preparation method thereof

The invention discloses a light-emitting enhancement type electron beam pumping ultraviolet light source and a preparation method thereof. According to the light-emitting enhancement type electron beam pumping ultraviolet light source and the preparation method thereof, multiple quantum wells of an epitaxial layer serve as an active region, a potential well adopts digital alloy of a monoatomic layer or a subatomic layer, carrier localization can be improved, non-radiative recombination process can be inhibited, and internal quantum efficiency can be further improved; a latticed reflecting layer with a concave surface is formed by utilizing periodic grid scratches and evaporating a highly-reflective metal thin film, reflection of ultraviolet light can be enhanced, and the light extraction efficiency can be increased; an electron beam pumping source adopts a field emission electron beam, and the miniaturization and low cost of the field emission electron beam are conductive to commercialization of the electron beam pumping source; meanwhile, the electron beam pumping source is equipped with a metal gate, is much easier in control of cathode accelerated current, and can effectively solve the problem of electron emission uniformity.
Owner:PEKING UNIV

Method for improving extended wavelength gallium indium arsenide detector etching damage

The invention discloses a method for improving extended wavelength gallium indium arsenide detector etching damage which is provided with a whole set of chip preparation etching processes. The methodincludes the steps: (1) depositing a mask etched by silicon nitride; (2) performing heat treatment in the nitrogen environment; (3) transferring table top images; (4) etching an N groove; (5) forminga table top; (6) removing etching damage. The method has the advantages that the mask etched by the silicon nitride is deposited, the heat treatment is performed in the nitrogen environment, materialdamage can be repaired, complex center density is reduced, material quality is improved, dark current of devices is reduced, hole carrier density can be increased, P-electrode ohmic contact stabilityis facilitated, resistance is reduced, a table top forming process includes gas is etched by the aid of chlorine methane, hydrogen decomposed by the methane in the plasma etching process can passivatedangling bonds formed by etching, and non-radiative recombination center density in materials is reduced. According to an etching damage removing process, damage layers of etching surfaces can be removed, the non-radiative recombination center density is reduced, subsequent passivation effects are enhanced, and the method is applicable to preparation of a high-performance short wave infrared gallium indium arsenide detector.
Owner:GUIZHOU ZHENHUA FENGGUANG SEMICON

Lattice mismatch solar cell containing novel tunneling junction and preparation method thereof

The invention discloses a lattice mismatch solar cell containing a novel tunneling junction and a preparation method thereof. A Ge monocrystal is used as a substrate, and a GaInP nucleation layer, a GaInAs buffer layer, a lattice gradient buffer layer, a first novel tunneling junction, a GaInAs sub cell, a second novel tunneling junction and a GaInP sub cell are grown on the surface of the substrate sequentially from bottom to top. The first novel tunneling junction and the second novel tunneling junction include a layer of degenerate p-type gallium indium nitrogen arsenide (Ga<1-y>In<y>N<x>As<1-x>) and a layer of degenerate n-type gallium indium arsenide (Ga<1-z>In<z>As), the lattice constants of the two layers of materials are respectively consistent with the materials of the adjacent semiconductor layers or the mismatching degree is less than 3%, and the thickness of each layer is 5-100nm. The novel tunneling junction adopted in the invention has better conductivity and light transmission than general tunneling junctions. More importantly, as a rigid material, the novel tunneling junction can filter a lot of threading dislocation and mismatch dislocation, reduce non-radiative recombination, prolong the service life of minority carriers and improve the photoelectric conversion efficiency.
Owner:ZHONGSHAN DEHUA CHIP TECH CO LTD

Epitaxial wafer of GaN-based light-emitting diode and preparing method thereof

The invention discloses an epitaxial wafer of a GaN-based light-emitting diode and a preparing method of the epitaxial wafer, and belongs to the field of light-emitting diodes. The preparing method includes the steps that a substrate is provided; a buffer layer and an N-type layer sequentially grow on the substrate, an N-type current expanding layer, a multi-quantum-well layer and a P-type layer sequentially grow on the N-type layer, the N-type current expanding layer is a GaN layer adopting a delta doping technology for growth, the doping concentration of the N-type current expanding layer is smaller than that of the N-type layer, starting from one side of the N-type layer, the doping concentration of the N-type current expanding layer is kept unchanged or reduced gradually, and the doping concentration of the portion, adjacent to one side of the multi-quantum-well layer, of the N-type current expanding layer is zero. The current expanding layer grows by adopting the delta doping technology, the carrier concentration is high, compensation is small, and the device is good in heat stability; the undoped GaN layer is introduced into the position close to an active area to ensure transverse expansion of currents and reduce forward voltage drop, the service life is prolonged, and the fact that defects caused by doping extend to the active area and a non-radiative recombination center is reduced.
Owner:HC SEMITEK SUZHOU
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