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106 results about "Oxygen donor" patented technology

Method for preparing mullite nanofibers by combination of non-hydrolytic sol-gel technology and electrostatic spinning technology

The invention relates to a method for preparing mullite nanofibers by combination of a non-hydrolytic sol-gel technology and an electrostatic spinning technology, and belongs to the technical field of material science. The method comprises that anhydrous aluminum chloride and tetraethoxysilane as raw materials, isopropyl ether as an oxygen donor and anhydrous dichloromethane as a solvent are synthesized into mullite xerogel by the non-hydrolytic sol-gel method; anhydrous ethanol and tetrahydrofuran are mixed into a mixed solution A; the mullite xerogel is dissolved in the mixed solution A so that a mixed solution B is obtained; polyvinylpyrrolidone (PVP) and the mixed solution B are mixed by stirring; a less amount of N-N-dimethylformamide is dropwisely added into the mixture obtained by the previous step so that a spinning precursor is obtained; the spinning precursor is prepared into mullite xerogel/PVP composite fibers by an electrostatic spinning technology; and the mullite xerogel/PVP composite fibers are calcined at a temperature of 900 to 1200 DEG C and then are subjected to heat preservation for 0.5 to 5h to form the mullite nanofibers. The method has the advantages of simple processes, easy control and low preparation cost.
Owner:NORTH CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY

Heat treatment process of semiconductor silicon wafer

ActiveCN102995125AOxygen Donor Effect EliminationOxygen donor effect inhibitionAfter-treatment detailsOxygen donorMonocrystalline silicon
The invention discloses a heat treatment process of a semiconductor silicon wafer. The process comprises the steps of: (1) stabilizing the temperature in heat treatment furnace and stabilizing the temperature in the heat treatment furnace at 640-660 DEG C; (3) placing the semiconductor silicon wafer into a quartz boat orderly and horizontally; (4) opening the heat treatment furnace and pushing the quartz boat which carries the semiconductor silicon wafer quickly into a constant temperature area at 640-660 DEG C of the heat treatment furnace to be processed for 30-45minutes; (5) opening the heat treatment furnace and pulling the quartz boat which carries the semiconductor silicon wafer quickly out of the heat treatment furnace; and (6) quickly placing the quartz boat and the semiconductor silicon wafer at an air cooler to be quickly cooled to room temperature. According to the heat treatment process of the semiconductor silicon wafer provided by the invention, the oxygen donor effect is eliminated and the heat donor effect is inhibited through heat treatment at 650 DEG C and rapid annealing crossing at 350-500 DEG C, meanwhile, no novel donor effect is generated within a short time for treatment at 650 DEG C, so that the real resistivity of the straightly pulled monocrystalline silicon piece can be obtained by the heat treatment process disclosed by the invention.
Owner:ZHEJIANG COWIN ELECTRONICS
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