Laser processing device (1) comprising: a clamping table (36) operable to hold a workpiece (W); and a
laser beam
irradiation means (5) which can be operated to irradiate the workpiece (W) held by the clamping table (36) with a
laser beam, wherein the
laser beam
irradiation means (5) comprises: a pulse
laser oscillator (51) designed to oscillate a
pulsed laser beam (LB) at a predetermined repetition frequency, a first (52a) and a second (52b) condenser designed to collect the
pulsed laser beam oscillated by the pulse
laser oscillator (51), and a
beam splitter means (53) arranged between the pulse
laser oscillator (51) and the first (52a) and the second (52b) condenser for splitting the
pulsed laser beam oscillated by the pulse laser oscillator (51) and directing the resulting beams (LB1, LB2) alternately towards the first (52a) and the second (52b) condenser, wherein the
beam splitter means (53) includes a
photoelastic modulator (532) having a piezoelectric element (532a) and a synthetic
quartz (532b) formed in one piece, and modulates the laser beam so that a
polarization plane of the laser beam is alternately at 0 and 90 degrees by applying a high-frequency
voltage having a frequency to the piezoelectric element (532a), which corresponds to the
natural frequency of the synthetic
quartz (532b), where the
beam splitter means (53) from one side of the pulse laser oscillator (51) towards one side of the first (52a) and second (52b) condensers includes: a first λ / 2 plate, a
photoelastic modulator (532), a second λ / 2 plate, and a
polarization beam splitter (534), and wherein, if the frequency of the
photoelastic modulator (532) is f PEM , the repetition frequency of the pulse laser oscillator (51) with f
Laser and a natural number is denoted by m, the repetition frequency f
Laser from the following formula: f Laser = 4 f PEM ( 2 m + 1 ) [ H z ]