12 results about "Micro-Opto-Electro-Mechanical Systems" patented technology

The invention relates to the field of micro-optical electro-mechanical systems, in particular to an optical integrated displacement sensing element alignment assembly system and method, and the system comprises a base, a three-dimensional moving platform, a z-axis micro vibration table, an optical path module table and a sensitive layer clamping mechanism. A y-axis moving table, an x-axis moving table, an xy-plane rotating table and a z-axis moving table are sequentially arranged on the base to form a three-dimensional moving platform; the z-axis micro-vibration table is installed on the z-axis moving table and generates simple harmonic vibration. The optical path module table is fixed on the micro-vibration table and is used for bearing an optical path module; and the sensitive layer clamping mechanism comprises at least two groups of longitudinal moving frames, transverse moving frames and clamping claws which are symmetrically distributed relative to the normal central axis of the three-dimensional moving platform, and is used for carrying out central symmetry clamping on the sensitive layer in the circumferential direction. Through combination of three-dimensional coarse positioning and micro-vibration dynamic excitation, high-precision alignment assembly of the optical path module and the sensitive layer is realized, and the technical problems that a micro-nano optical element is low in alignment precision and easy to damage are solved.

The present invention discloses a grating light valve type current sensor based on temperature compensation, which includes a signal processing unit and a sensing unit. The sensing unit is a three-beam grating light valve temperature-current sensing unit based on micro-optoelectromechanical system technology. The grating light valve based on micro-optoelectromechanical system technology is used to measure the two parameters of temperature and current, and according to the detected temperature information, the current measurement error introduced by the change of the grating light valve with temperature is corrected to meet the accurate current measurement requirements in the outdoor engineering application process. At the same time, a closed-loop control modulation and demodulation algorithm based on square wave + stepped wave is adopted to improve the linearity and dynamic measurement range of current measurement.

Silicon photonics adds optical functionality to electronic integrated circuits allowing leveraging CMOS fabrication processes, integration of CMOS electronics discretely and integration of microelectromechanical systems (MEMS) or Micro-Opto-Electro-Mechanical-Systems (MOEMS) elements. Further, silicon photonics allows hybrid or monolithic integration of semiconductor photodetectors in conjunction with the passive silicon photonics and active elements such as semiconductor optical amplifiers (SOAs). Accordingly, it would be beneficial to provide network designers with silicon photonic optical emitters and transmitters for wavelength division multiplexed networks which can dynamically transmit on one or more channels whilst addressing the inherent issues that silicon photonics and other optical waveguide technologies exhibit for hybrid integration of SOAs and passive photonics.

Silicon photonics technologies adds integrated optics functionality to CMOS integrated circuits thereby leveraging high volume manufacturing. Independent of geometry or technology these silicon photonic devices require packaging with single mode optical fibers to interface to the optical network and / or co-packaging with active semiconductor devices, discrete microoptoelectromechanical systems (MOEMS)s or monolithically integrated MOEMS. Stringent performance constraints and minimizing manufacturing costs / times are consistent demands on such photonic circuits. Accordingly, there is a demand for low-cost and low-loss optical coupling technologies for packaging that can easily be scaled for mass production that overcome limitations in the prior art. The inventors have established design methodologies, packaging schemes and component designs that leverage automated passive assembly techniques for speed / cost in combination with directly written optical interconnects that allow for offsetting the losses that would arise from the manufacturing tolerances of these passive assembly techniques.

The application discloses a kind of integrated micro-optical mechanical system accelerometers based on ridge waveguide, including ridge waveguide structure, photonic crystal waveguide structure, photonic crystal resonant cavity, mass block;Photonic crystal resonant cavity includes two photonic crystal plates and the air slot between;Ridge waveguide structure includes first wide ridge waveguide 1a, first tapered ridge waveguide 2a, second tapered ridge waveguide 2b and second wide ridge waveguide 1b, first / two tapered ridge waveguide 2a / 2b connects first / two wide ridge waveguide 1a / 1b and first / two photonic crystal waveguide 3a / 3b, first photonic crystal waveguide 3a and second photonic crystal waveguide 3b are coupled by photonic crystal waveguide-microcavity coupling structure 4a;First photonic crystal waveguide 3a, second photonic crystal waveguide 3b and photonic crystal waveguide-microcavity coupling structure 4a are located on photonic crystal plate A;Photonic crystal plate B is etched on mass block.The application utilizes ridge waveguide technology to realize high sensitivity and high integration, while maintaining the advantages of simple structure and low-cost manufacturing.

The present invention discloses a grating light valve type current sensor based on a micro-power optical control signal source, which includes a signal processing unit and a sensing unit. The sensing unit is a three-beam grating light valve temperature-current sensing unit based on micro-optoelectromechanical system technology. The signal processing unit adopts a closed-loop demodulation algorithm to obtain the detected current by demodulating the output compensation phase shift. In the closed-loop demodulation algorithm, error correction is performed according to the temperature information measured by the sensing unit to correct the influence of ambient temperature change on the measurement accuracy of the sensing unit. At the same time, the micro-power optical control signal source technology is used to realize the closed-loop optical feedback control of the grating light valve, improve the measurement linearity of the grating light valve in the closed-loop demodulation algorithm, and increase the dynamic measurement range.

The application provides a mirror array spatial light modulator chip structure and a processing method thereof, and relates to the technical field of micro-opto-electro-mechanical systems.The application is composed of multiple groups of micro-mirror units arranged at equal intervals;the micro-mirror unit comprises a first substrate and a second substrate;the first substrate is provided with a torsional beam and an electrical insulation layer, a back cavity is formed below the torsional beam, a first addressing electrode and a second addressing electrode are symmetrically arranged on the electrical insulation layer along the central axis of the torsional beam, and contact bumps are arranged on the first addressing electrode and the second addressing electrode;the second substrate is used for processing a mirror surface by an operator, and a mirror surface anchor point for connecting the torsional beam is arranged on the mirror surface.The method can overcome the problems of poor light field matching of the micro-mirror array in a spectral imaging system, loss of target optical information acquisition caused by the inherent torsional mode and array form.

Silicon photonics technologies add integrated optics functionality to CMOS integrated circuits thereby leveraging high volume manufacturing. Independent of geometry or technology these silicon photonic devices require packaging with single mode optical fibers to interface to the optical network and / or co-packaging with active semiconductor devices, discrete microoptoelectromechanical systems (MOEMS)s or monolithically integrated MOEMS. Stringent performance constraints and minimizing manufacturing costs / times are consistent demands on such photonic circuits. Accordingly, there is a demand for low-cost and low-loss optical coupling technologies for packaging that can easily be scaled for mass production that overcome limitations in the prior art. The inventors have established design methodologies, packaging schemes and component designs that leverage automated passive assembly techniques for speed / cost in combination with directly written optical interconnects that allow for offsetting the losses that would arise from the manufacturing tolerances of these passive assembly techniques.

The present invention discloses a cavity optical force vibration sensor, a measuring device, and a measuring method. These sensors are applied to the field of vibration measurement technology. To address the low measurement accuracy of existing vibration sensors, the present invention utilizes the optomechanical coupling principle of a cavity optical force micro-opto-electromechanical system to achieve optical measurement of vibration states. Infrared light emitted by a laser enters a polarization controller via a single-mode optical fiber, generating laser light with arbitrary polarization directions. This laser light is then coupled via a V-shaped micro-concave optical fiber into a photonic crystal microcavity within a vacuum cavity. The microcavity's outgoing light, carrying optomechanical coupling information, enters a photodetector via an attenuator. A spectrum analyzer reads and analyzes the vibration information of the silicon micromechanical oscillator and the piezoelectric ceramic oscillator, and a computer reads and analyzes the coupled optical information.

The invention relates to a preparation method of micro-opto-mechanical system, comprising the following steps: forming a patterned high-reflection film, a top silicon electrode and a detection electrode on the top silicon of a first SOI silicon wafer; the patterned top silicon of a second SOI silicon wafer and the high-reflection film together form a movable filter structure, and the bottom of the patterned metal support column is connected to the top silicon; aligning and bonding the movable filter structure layer wafer prepared by S3 to the top of the fixed filter structure layer wafer prepared by S2, and bonding the metal support column in the movable filter structure to the metal support column in the fixed filter structure to form a support column; taking a standard wafer after polishing on both sides as a cap layer, and preparing a metal Pad point on the front of the cap to connect with a vertical conductive lead; the beneficial effects of the invention are: the preparation method is compatible with optical and MEMS preparation processes, can be mass-produced, and the micro-opto-mechanical system prepared by the method has the advantages of high integration, large optical duty cycle, large electrostatic driving force, easy integration with detectors, etc.

The invention relates to a micro-hemispherical resonator gyroscope driving device based on cavity light force, which is applied to the technical field of micro-optical electro-mechanical systems (MOEMS) and high-precision gyroscopes, and aims to solve the problems that the excitation intensity of a second-order wine-cup-shaped working mode is difficult to further improve due to the limitation of an electrode gap in the conventional electrostatic push-pull driven micro-hemispherical resonator gyroscope; the existing cavity light force driven micro-hemisphere gyroscope has the problems of poor second-order mode excitation symmetry and large amplitude fluctuation. According to the invention, multi-path symmetrical optical push-pull driving is adopted, the second-order working mode of the micro-hemispherical harmonic oscillator can be efficiently and purely excited, and the driving efficiency and the mode purity are increased by magnitude compared with a single-path driving scheme; and a phase-locked loop injection-locking mechanism is used to suppress frequency cracking, and high-precision and high-stability detection of the angular velocity signal is finally realized.

Silicon photonics adds optical functionality to electronic integrated circuits allowing leveraging CMOS fabrication processes, integration of CMOS electronics discretely and integration of microelectromechanical systems (MEMS) or Micro-Opto-Electro-Mechanical-Systems (MOEMS) elements. Further, silicon photonics allows hybrid or monolithic integration of semiconductor photodetectors for optical receivers in conjunction with the passive silicon photonics and active elements such as semiconductor optical amplifiers (SOAs) and laser diodes (LDs) for coherent detection receivers for next generation systems. Accordingly, it would be beneficial to provide network designers with silicon photonic receivers for wavelength division multiplexed networks using direct or coherent detection which can dynamically select one or more channels from a large number of incoming channels whilst addressing the inherent issues that silicon photonics and other optical waveguide technologies exhibit such as polarisation dependency.