6 results about "Micro-Opto-Electro-Mechanical Systems" patented technology

The invention relates to the field of micro-optical electro-mechanical systems, in particular to an optical integrated displacement sensing element alignment assembly system and method, and the system comprises a base, a three-dimensional moving platform, a z-axis micro vibration table, an optical path module table and a sensitive layer clamping mechanism. A y-axis moving table, an x-axis moving table, an xy-plane rotating table and a z-axis moving table are sequentially arranged on the base to form a three-dimensional moving platform; the z-axis micro-vibration table is installed on the z-axis moving table and generates simple harmonic vibration. The optical path module table is fixed on the micro-vibration table and is used for bearing an optical path module; and the sensitive layer clamping mechanism comprises at least two groups of longitudinal moving frames, transverse moving frames and clamping claws which are symmetrically distributed relative to the normal central axis of the three-dimensional moving platform, and is used for carrying out central symmetry clamping on the sensitive layer in the circumferential direction. Through combination of three-dimensional coarse positioning and micro-vibration dynamic excitation, high-precision alignment assembly of the optical path module and the sensitive layer is realized, and the technical problems that a micro-nano optical element is low in alignment precision and easy to damage are solved.

Silicon photonics technologies adds integrated optics functionality to CMOS integrated circuits thereby leveraging high volume manufacturing. Independent of geometry or technology these silicon photonic devices require packaging with single mode optical fibers to interface to the optical network and / or co-packaging with active semiconductor devices, discrete microoptoelectromechanical systems (MOEMS)s or monolithically integrated MOEMS. Stringent performance constraints and minimizing manufacturing costs / times are consistent demands on such photonic circuits. Accordingly, there is a demand for low-cost and low-loss optical coupling technologies for packaging that can easily be scaled for mass production that overcome limitations in the prior art. The inventors have established design methodologies, packaging schemes and component designs that leverage automated passive assembly techniques for speed / cost in combination with directly written optical interconnects that allow for offsetting the losses that would arise from the manufacturing tolerances of these passive assembly techniques.

The application provides a mirror array spatial light modulator chip structure and a processing method thereof, and relates to the technical field of micro-opto-electro-mechanical systems.The application is composed of multiple groups of micro-mirror units arranged at equal intervals;the micro-mirror unit comprises a first substrate and a second substrate;the first substrate is provided with a torsional beam and an electrical insulation layer, a back cavity is formed below the torsional beam, a first addressing electrode and a second addressing electrode are symmetrically arranged on the electrical insulation layer along the central axis of the torsional beam, and contact bumps are arranged on the first addressing electrode and the second addressing electrode;the second substrate is used for processing a mirror surface by an operator, and a mirror surface anchor point for connecting the torsional beam is arranged on the mirror surface.The method can overcome the problems of poor light field matching of the micro-mirror array in a spectral imaging system, loss of target optical information acquisition caused by the inherent torsional mode and array form.

Silicon photonics technologies add integrated optics functionality to CMOS integrated circuits thereby leveraging high volume manufacturing. Independent of geometry or technology these silicon photonic devices require packaging with single mode optical fibers to interface to the optical network and / or co-packaging with active semiconductor devices, discrete microoptoelectromechanical systems (MOEMS)s or monolithically integrated MOEMS. Stringent performance constraints and minimizing manufacturing costs / times are consistent demands on such photonic circuits. Accordingly, there is a demand for low-cost and low-loss optical coupling technologies for packaging that can easily be scaled for mass production that overcome limitations in the prior art. The inventors have established design methodologies, packaging schemes and component designs that leverage automated passive assembly techniques for speed / cost in combination with directly written optical interconnects that allow for offsetting the losses that would arise from the manufacturing tolerances of these passive assembly techniques.

The invention relates to a micro-hemispherical resonator gyroscope driving device based on cavity light force, which is applied to the technical field of micro-optical electro-mechanical systems (MOEMS) and high-precision gyroscopes, and aims to solve the problems that the excitation intensity of a second-order wine-cup-shaped working mode is difficult to further improve due to the limitation of an electrode gap in the conventional electrostatic push-pull driven micro-hemispherical resonator gyroscope; the existing cavity light force driven micro-hemisphere gyroscope has the problems of poor second-order mode excitation symmetry and large amplitude fluctuation. According to the invention, multi-path symmetrical optical push-pull driving is adopted, the second-order working mode of the micro-hemispherical harmonic oscillator can be efficiently and purely excited, and the driving efficiency and the mode purity are increased by magnitude compared with a single-path driving scheme; and a phase-locked loop injection-locking mechanism is used to suppress frequency cracking, and high-precision and high-stability detection of the angular velocity signal is finally realized.

Silicon photonics adds optical functionality to electronic integrated circuits allowing leveraging CMOS fabrication processes, integration of CMOS electronics discretely and integration of microelectromechanical systems (MEMS) or Micro-Opto-Electro-Mechanical-Systems (MOEMS) elements. Further, silicon photonics allows hybrid or monolithic integration of semiconductor photodetectors for optical receivers in conjunction with the passive silicon photonics and active elements such as semiconductor optical amplifiers (SOAs) and laser diodes (LDs) for coherent detection receivers for next generation systems. Accordingly, it would be beneficial to provide network designers with silicon photonic receivers for wavelength division multiplexed networks using direct or coherent detection which can dynamically select one or more channels from a large number of incoming channels whilst addressing the inherent issues that silicon photonics and other optical waveguide technologies exhibit such as polarisation dependency.