3results about How to "Applicable processing" patented technology

The application provides a kind of power grid equipment three-dimensional twin model slice simplification method based on visual relationship, belong to power grid three-dimensional visualization technical field, the method steps: the data format of power grid equipment three-dimensional model is unified and is parsed;Construct power grid equipment three-dimensional model object instantiation information;From model data, texture is compressed;Using octree structure is handled to model data slice and vertex optimization and monomer;According to octree structure, the model slice data after processing is merged, generates each level LOD;In three-dimensional network application end, according to the format requirement, the device and component instantiation of multiplexing are instantiated, load power grid equipment three-dimensional model in current window current level LOD data rendering.The application is compressed model vertex and texture data, multiplexing device and component instantiation, and load the LOD of current window, realizes the efficient transmission, loading and rendering effect of power grid equipment three-dimensional model data in the application without plug-in.

This application relates to the technical field of semiconductor processing equipment components, specifically disclosing a special metal chamfering wheel for semiconductor silicon carbide wafers and its processing technology. The special metal chamfering wheel for semiconductor silicon carbide wafers is mainly made of the following raw materials in weight percentages: 7-8% micron-sized diamond, 23-27% copper-tin powder, 60-65% cobalt powder, 2-3% silver powder, and 2-3% silicon nitride powder. This special metal chamfering wheel, through the interaction of the raw materials, has advantages such as high hardness, good thermal conductivity, excellent wear resistance, and high stability during the grinding process, outperforming traditional chamfering wheels and making it suitable for processing silicon carbide wafers.

This invention relates to the field of food processing technology, specifically to a method for improving the starch structure and digestibility of sprouted corn flour, the prepared sprouted corn flour, and its applications. A method for improving the starch structure and digestibility of sprouted corn flour includes the following steps: S1, preparation of sprouted corn: soaking and germinating corn kernels to obtain sprouted corn; S2, microwave treatment: subjecting the sprouted corn to microwave treatment; S3, forced-air drying: subjecting the microwave-treated sprouted corn to forced-air drying until constant weight, obtaining dried sprouted corn; S4, pulverization: pulverizing and sieving the dried sprouted corn to obtain sprouted corn flour. This method not only significantly improves the drying efficiency of sprouted corn but also improves the starch structure characteristics of the sprouted corn flour, particularly increasing the content of resistant starch and reducing in vitro digestibility, thereby providing a high-quality raw material for developing corn-based foods with low digestibility or low glycemic index.